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公开(公告)号：US20190104636A1
公开(公告)日：2019-04-04
申请号：US15724923
申请日：2017-10-04
Applicant: Google LLC
Inventor： Jayson Michael Jochim , Michael Chi Kin Lau , Bill Dailey , Angela Chen , Winnie Leung , Peter Pellerzi , Soheil Farshchian
Abstract: A data center system includes a frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, the plurality of bays arranged in a plurality of stacked layers of bays, the plurality of stacked layers including at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays; a plurality of server racks positioned in the bays of the first layer of bays, each of the server racks configured to support a plurality of data center server devices that define a particular amount of computing power; and a plurality of network switches positioned in the bays of the second layer of bays, each of the network switches communicably coupled to at least one of the data center server devices in the first layer of bays.
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公开(公告)号：US20180235108A1
公开(公告)日：2018-08-16
申请号：US15949511
申请日：2018-04-10
Applicant: Google LLC
Inventor： Emad Samadiani , Eehern J. Wong , Gregory P. Imwalle , Soheil Farshchian
CPC classification number: H05K7/20809 , G06F1/20 , G06F2200/201 , H05K7/20318 , H05K7/20327 , H05K7/20336 , H05K7/20836
Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.
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公开(公告)号：US11357135B2
公开(公告)日：2022-06-07
申请号：US17026978
申请日：2020-09-21
Applicant: Google LLC
Inventor： Jayson Michael Jochim , Michael Chi Kin Lau , Bill Dailey , Angela Chen , Winnie Leung , Peter Pellerzi , Soheil Farshchian
Abstract: A data center system includes a frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, the plurality of bays arranged in a plurality of stacked layers of bays, the plurality of stacked layers including at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays; a plurality of server racks positioned in the bays of the first layer of bays, each of the server racks configured to support a plurality of data center server devices that define a particular amount of computing power; and a plurality of network switches positioned in the bays of the second layer of bays, each of the network switches communicably coupled to at least one of the data center server devices in the first layer of bays.
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公开(公告)号：US11324146B2
公开(公告)日：2022-05-03
申请号：US16919270
申请日：2020-07-02
Applicant: Google LLC
Inventor： Soheil Farshchian , Angela Ying-Ju Chen , Winnie Leung , Pascal C. Kam , Kenneth Dale Shaul
Abstract: A kit for forming a data center comprising a first rack, a second rack, a first support having a first end and a second end opposite the first end, the first support configured to be secured to the floor at the first end, a cooling frame having a cooling unit received therein, the cooling frame having a first face and a second face opposite the first face, the cooling frame configured to be secured to the second end of the first support, a first distribution frame having a first plurality of support arms extending therefrom, the first distribution frame configured to be coupled to the first face of the cooling frame, and a second distribution frame having a second plurality of support arms extending therefrom, the second distribution frame configured to be coupled to the second face of the cooling frame.
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公开(公告)号：US10542641B2
公开(公告)日：2020-01-21
申请号：US15949511
申请日：2018-04-10
Applicant: Google LLC
Inventor： Emad Samadiani , Eehern J. Wong , Gregory P. Imwalle , Soheil Farshchian
Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.
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Patent Agency Ranking
公开(公告)号：US20200015387A1
公开(公告)日：2020-01-09
申请号：US16555562
申请日：2019-08-29
Applicant: Google LLC
Inventor： Soheil Farshchian , Madhu Krishnan Iyengar
Abstract: A server rack thermosiphon system includes a plurality of evaporators, each evaporator including a thermal interface for one or more heat-generating server rack devices; at least one condenser mounted to an external structure of a server rack, the condenser including a fluid-cooled heat transfer module; a liquid conduit that fluidly couples each of the evaporators to the condenser to deliver a liquid phase of a working fluid from the condenser to the evaporators; and a vapor conduit that fluidly couples each of the evaporators to the condenser to deliver a mixed phase of the working fluid from the evaporators to the condenser.
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公开(公告)号：US10344766B2
公开(公告)日：2019-07-09
申请号：US16020657
申请日：2018-06-27
Applicant: Google LLC
Inventor： Kenneth Dale Shaul , Soheil Farshchian , Roy Michael Bannon , Angela Chen , Jonathan D. Beck
Abstract: Methods, systems, and apparatus, including a housing defining a top surface, a bottom surface, and first and second side surfaces. Also included is a first rail extending from the first side surface and a second rail extending from the second surface such that when the first and second rails are slidably engaged with a third surface. A blower device is included that is axially disposed between the top and bottom surface, wherein a first end of the housing defines a first plenum outlet, the top surface defines a plenum inlet, the bottom surface defines a second plenum outlet that is positioned on a second side of the blower device and that fluidly couples the first plenum chamber to the second plenum chamber. Further, the second plenum chamber is formed by the first and second rails, the bottom surface and the third surface has a third plenum outlet.
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公开(公告)号：US20190132992A1
公开(公告)日：2019-05-02
申请号：US15797996
申请日：2017-10-30
Applicant: Google LLC
Inventor： Soheil Farshchian , Emad Samadiani
CPC classification number: H05K7/20336 , F28D15/04 , F28D15/046 , F28F2215/06 , F28F2240/00 , H01L23/427
Abstract: A cooling system for an electronic circuit package is provided. The cooling system includes a heat transfer plate positioned in thermal contact with an electronic circuit package surface and forming the bottom surface of an evaporative region of the cooling system. The cooling system also includes a plurality of condensing tubes in fluid communication with, and extending away from, the evaporative region, such that the evaporative region and the condensing tubes together form a single, uninterrupted, sealed enclosure. The cooling system also includes a fluid within the sealed enclosure. The cooling system also includes a plurality of spacers filling gaps between the heat transfer plate and the condensing tubes, such that each spacer is configured as an independent component to allow the passage of fluid through the interior space of each spacer. The cooling system also includes a plurality of wicks, where each wick is positioned partially within a corresponding spacer to which it is fluidically coupled.
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公开(公告)号：US09961803B2
公开(公告)日：2018-05-01
申请号：US15359154
申请日：2016-11-22
Applicant: Google LLC
Inventor： Emad Samadiani , Eehern J. Wong , Gregory P. Imwalle , Soheil Farshchian
CPC classification number: H05K7/20809 , G06F1/20 , G06F2200/201 , H05K7/20318 , H05K7/20327 , H05K7/20336 , H05K7/20836
Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.
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公开(公告)号：US11297736B2
公开(公告)日：2022-04-05
申请号：US17117674
申请日：2020-12-10
Applicant: Google LLC
Inventor： Jayson Michael Jochim , Angela Chen , Soheil Farshchian , Winnie Leung , Michael Chi Kin Lau
Abstract: A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay including a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose at least one server rack configured to support a plurality of data center computing devices; and at least one cooling unit sized for a bay of the plurality of bays of the server rack frame assembly and configured to circulate a heated airflow from an open back side of the at least one server rack, cool the heated air, and circulate a cooling airflow through an open front side of the at least one server rack.
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