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公开(公告)号：US20190143325A1
公开(公告)日：2019-05-16
申请号：US16097460
申请日：2016-07-15
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Chien-Hua Chen , Michael W. Cumbie , Devin Alexander Mourey
Abstract: A method may include etching a number of holes into a carrier wafer layer to form a plurality of filters in the carrier wafer layer, pattering a chamber layer over a first side of the carrier wafer layer to form chambers above each filter formed in the carrier wafer layer, forming a layer over the chamber layer, grinding a second side of the carrier wafer layer to expose the number of holes etched into the carrier wafer layer, and bonding a molded substrate to the carrier wafer layer opposite the chamber layer.
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公开(公告)号：US20190111694A1
公开(公告)日：2019-04-18
申请号：US16092350
申请日：2016-04-21
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Michael W. Cumbie , Chien-Hua Chen , Devin Alexander Mourey , Anthony D. Studer
Abstract: In one example in accordance with the present disclosure a liquid level sensing device is described. The device includes a carrier and a liquid level sensing device disposed on the carrier. The liquid level sensing interface has an aspect ratio of at least 1:50. A number of liquid level sensing components are disposed on the liquid level sensing interface. The number of liquid level sensing components detect a liquid level in a liquid container. The liquid level sensing device also includes an electrical interconnect to output data collected from the number of liquid level sensing components.
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公开(公告)号：US20150025831A1
公开(公告)日：2015-01-22
申请号：US13943727
申请日：2013-07-16
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Devin Alexander Mourey , Dennis T. So , Pavel Kornilovich , David M. Cook
CPC classification number: G01V1/003 , G01K1/022 , G01K3/10 , G01V2200/12
Abstract: A seismic system includes a wireless sensor node. The wireless sensor node includes a global positioning system (GPS) device to receive a GPS time value at an interval; a temperature sensor to measure temperature; an oscillator to measure time; and a memory to store the GPS time value, the temperature, and the oscillator time. The wireless sensor node also includes a processor to determine a rate of temperature change during the interval, and to dynamically update the interval to receive the GPS time value from the GPS device, based on the rate of temperature change.
Abstract translation: 地震系统包括无线传感器节点。 无线传感器节点包括用于以一定间隔接收GPS时间值的全球定位系统（GPS）设备; 用于测量温度的温度传感器; 一个振荡器来测量时间; 以及存储GPS时间值，温度和振荡器时间的存储器。 无线传感器节点还包括处理器，用于确定间隔期间的温度变化率，并且基于温度变化率来动态地更新从GPS设备接收GPS时间值的间隔。
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公开(公告)号：US20240269921A1
公开(公告)日：2024-08-15
申请号：US18290309
申请日：2021-06-03
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Karsten N. Wilson , Emre Hiro Discekici , Vladek Kasperchik , Timothy L. Weber , Sterling Chaffins , Devin Alexander Mourey
IPC: B29C64/165 , B29C64/188 , B29C64/264 , B29K221/00 , B33Y10/00 , B33Y30/00 , B33Y40/20
CPC classification number: B29C64/165 , B29C64/188 , B29C64/264 , B33Y10/00 , B33Y30/00 , B33Y40/20 , B29K2221/00
Abstract: Methods of three-dimensional printing can include iteratively applying a polymer build material as individual layers to a powder bed, where the polymer build material includes from about 80 wt % to 100 wt % polymer build particles, and based on a three-dimensional object model, selectively applying a binder agent including an aqueous liquid vehicle and polymer binder particles onto the individual layers of the polymer build material. The polymer binder particles have or are capable of having a melting temperature lower than a melting temperature of the polymer build particles. The methods can include exposing the powder bed to heat at a temperature less than a melting point of the polymer build particles but greater than a melting temperature of the polymer binder particles. The heat causes the polymer binder particles to melt to adhere the polymer build particles together to form a three-dimensional object.
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公开(公告)号：US11364492B2
公开(公告)日：2022-06-21
申请号：US16085342
申请日：2016-03-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Jeffrey A. Nielsen , Michael W. Cumbie , Devin Alexander Mourey , Silam J. Choy , Christie Dudenhoefer , Kenneth Ward
Abstract: A digital dispense apparatus comprising a plurality of fluid dispense devices, at least one reservoir connected to the plurality of fluid dispense devices to deliver fluid to the plurality of fluid dispense devices, at least one contact pad array, and a single monolithic carrier structure.
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Patent Agency Ranking
公开(公告)号：US10427407B2
公开(公告)日：2019-10-01
申请号：US15122701
申请日：2014-03-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Chien-Hua Chen , Michael W Cumbie , Devin Alexander Mourey
Abstract: In an example, a method for making a fluid ejection apparatus may include forming a molding material over a fluid passage on a back surface of printhead die, embedding the printhead die in an encapsulant in a cavity in a printed circuit board such that at least one drop ejector of the printhead die is exposed at a front side of the printed circuit board, removing the encapsulant at a back side of the printed circuit board to expose the molding material, and removing the molding material to form a fluid feed slot through which fluid may flow to the fluid passage opening in the printhead die.
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公开(公告)号：US20190144268A1
公开(公告)日：2019-05-16
申请号：US16098991
申请日：2016-07-26
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Chien-Hua Chen , Devin Alexander Mourey , Michael W. Cumbie , Si-lam Choy
Abstract: A device includes: a die including a microfluidic device; a polymer substrate formed around the die; and a separate fluid manifold attached to the polymer substrate over the die and on a same side of the substrate as the die, the manifold to deliver fluid to the die.
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公开(公告)号：US20190143688A1
公开(公告)日：2019-05-16
申请号：US16244663
申请日：2019-01-10
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Michael W. Cumbie , Devin Alexander Mourey , Chien-Hua Chen
Abstract: In example implementations, an apparatus with an interposer is provided. The apparatus may include an epoxy molded compound (EMC). A print head die and a drive integrated circuit (IC) may be embedded in the EMC. An interposer may also be embedded in the EMC. The print head die, the drive IC and the interposer may be wire bonded within the EMC.
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公开(公告)号：US10232620B2
公开(公告)日：2019-03-19
申请号：US15747639
申请日：2015-10-13
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Michael W. Cumbie , Silam J. Choy , Chien-Hua Chen , Devin Alexander Mourey
Abstract: A printhead may include a number of s-shaped dies embedded in a moldable substrate. An medium-wide array may include a number of printheads with each printhead including a number of s-shaped dies and an ejection fluid feed slot to provide a single type of ejection fluid to the s-shaped dies. An s-shaped die of a printhead may include a number of columns of nozzles and an electrical interconnect coupled to a number of firing chambers associated with each of the nozzles, the electrical interconnect positioned adjacent to the number of columns.
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公开(公告)号：US20180215147A1
公开(公告)日：2018-08-02
申请号：US15747639
申请日：2015-10-13
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Michael W. Cumbie , Silam J. Choy , Chien-Hua Chen , Devin Alexander Mourey
CPC classification number: B41J2/145 , B41J2/14072 , B41J2/155 , B41J2/1603 , B41J2/1623 , B41J2/1632 , B41J2/1635 , B41J2/1637 , B41J2/2103 , B41J2002/14475 , B41J2002/14491 , B41J2202/20 , B41J2202/22
Abstract: A printhead may include a number of s-shaped dies embedded in a moldable substrate. An medium-wide array may include a number of printheads with each printhead including a number of s-shaped dies and an ejection fluid feed slot to provide a single type of ejection fluid to the s-shaped dies. An s-shaped die of a printhead may include a number of columns of nozzles and an electrical interconnect coupled to a number of firing chambers associated with each of the nozzles, the electrical interconnect positioned adjacent to the number of columns.
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