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    Elastic device
    14.
    发明授权
    Elastic device 有权

    公开(公告)号：US10125010B2

    公开(公告)日：2018-11-13

    申请号：US15328315

    申请日：2014-07-30

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： James Elmer Abbott, Jr. ,  Zhizhang Chen ,  John L Williams

    IPC: B41J2/14 ,  B81B3/00 ,  B81B7/00

    Abstract: An elastic device may comprise an amorphous metal comprising at least one refractory metal, at least two elements selected from periods, 4, 5, 6, 9, and 10, and at least one metalloid. A membrane may comprise a layer of silicon dioxide and a layer of amorphous metal. A MEMS device may comprise a layer of amorphous metal comprising at least one refractory metal, at least two elements selected from periods, 4, 5, 6, 9, and 10, and a metalloid. In one example, the amorphous material comprises Tantalum (Ta), Tungsten (W), and Silicon (Si). In another example, the metalloid is Silicon. In yet another example, the refractory metals comprise Niobium, Molybdenum, Tantalum, Tungsten, Rhenium, or combinations thereof.

    Electrocaloric Heating and Cooling Device
    16.
    发明申请
    Electrocaloric Heating and Cooling Device 有权
    电加热和冷却装置

    公开(公告)号：US20170043600A1

    公开(公告)日：2017-02-16

    申请号：US15306855

    申请日：2014-04-30

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： James Elmer Abbott, Jr.

    IPC: B41J29/377 ,  B41J2/14 ,  F25B21/00

    CPC classification number: B41J29/377 ,  B41J2/14016 ,  F25B21/00 ,  F25B2321/001 ,  Y02B30/66

    Abstract: The present disclosure is drawn to electrocaloric heating and cooling devices and related methods. The electrocaloric heating and cooling devices can comprise an electronic feature of an integrated circuit, wherein the electronic feature is for heating and cooling cycles. The device can also include an electrocaloric film in thermal communication with the electronic feature which includes a blend or solid solution of two or more components selected from the group consisting of BNT, BKT, BZT, BMgT, and BNiT. Electrodes can be associated with the electrocaloric film, and an electrical source can be to add or reduce electrical field between the electrodes across the electrocaloric film to influence both heating and cooling of the electronic feature.

    Abstract translation: 本公开涉及电加热和冷却装置及相关方法。 电热加热和冷却装置可以包括集成电路的电子特征，其中电子特征用于加热和冷却循环。 该装置还可以包括与电子特征热连通的电热膜，其包括选自BNT，BKT，BZT，BMgT和BNiT的两种或更多种组分的共混物或固溶体。 电极可以与电热膜相关联，并且电源可以是增加或减少跨过电加热膜的电极之间的电场，以影响电子特征的加热和冷却。

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