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    DEFECT INSPECTION METHOD AND DEFECT INSPECTION DEVICE
    11.
    发明申请
    DEFECT INSPECTION METHOD AND DEFECT INSPECTION DEVICE 有权
    缺陷检查方法和缺陷检查装置

    公开(公告)号：US20160019682A1

    公开(公告)日：2016-01-21

    申请号：US14773319

    申请日：2014-01-27

    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

    Inventor： Yuji TAKAGI ,  Minoru HARADA ,  Masashi SAKAMOTO ,  Takehiro HIRAI

    IPC: G06T7/00 ,  G06K9/62

    CPC classification number: G06T7/001 ,  G06K9/6202 ,  G06K9/6284 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01J2237/2817 ,  H01L22/12

    Abstract: In order to reduce the amount of time it takes to collect images of defects, this defect inspection device is provided with the following: a read-out unit that reads out positions of defects in a semiconductor wafer that have already been detected; a first imaging unit that takes, at a first magnification, a reference image of a chip other than the chip where one of the read-out defects is; a second imaging unit that takes, at the first magnification, a first defect image that contains the read-out defect; a defect-position identification unit that identifies the position of the defect in the first defect image taken by the second imaging unit by comparing said first defect image with the reference image taken by the first imaging unit; a third imaging unit that, on the basis of the identified defect position, takes a second defect image at a second magnification that is higher than the first magnification; a rearrangement unit that rearranges the read-out defects in an order corresponding to a path that goes through each of the read-out defects exactly once; and a stage-movement-path generation unit that selects the chip where the reference image corresponding to each defect is to be taken and generates a stage-movement path by determining stage-movement positions for the first and second imaging units.

    Abstract translation: 为了减少收集缺陷图像所花费的时间，该缺陷检查装置具有：读出单元，读出已经检测到的半导体晶片中的缺陷位置; 第一成像单元，其以第一放大率取得除了其中一个读出缺陷的芯片之外的芯片的参考图像; 第二成像单元，其在第一放大率下取得包含读出缺陷的第一缺陷图像; 缺陷位置识别单元，其通过将所述第一缺陷图像与由所述第一成像单元拍摄的参考图像进行比较来识别由所述第二成像单元拍摄的所述第一缺陷图像中的所述缺陷的位置; 第三成像单元，其基于所识别的缺陷位置，以比所述第一放大率高的第二倍率拍摄第二缺陷图像; 重新布置单元，其以与经过每一个读出缺陷的路径相对应的顺序重新排列读出的缺陷; 以及阶段移动路径生成单元，其选择要获取与每个缺陷相对应的参考图像的芯片，并且通过确定第一和第二成像单元的阶段移动位置来生成平台移动路径。

    DEFECT OBSERVATION DEVICE AND DEFECT OBSERVATION METHOD
    12.
    发明申请
    DEFECT OBSERVATION DEVICE AND DEFECT OBSERVATION METHOD 审中-公开

    公开(公告)号：US20200034957A1

    公开(公告)日：2020-01-30

    申请号：US16493697

    申请日：2017-03-17

    Applicant: Hitachi High-Technologies Corporation

    Inventor： Naoaki KONDO ,  Minoru HARADA ,  Yuji TAKAGI ,  Takehiro HIRAI

    IPC: G06T7/00 ,  G01N21/95 ,  G01N21/956

    Abstract: A defect observation device comprising: a defect determination coordinate creation unit by which the coordinates of a plurality of second defect candidates are determined as overlapping defect candidate coordinates, the plurality of second defect candidates respectively having, in a plurality of second imaging visual field regions overlapping a first imaging visual field region, a circuit pattern which partly overlaps a circuit pattern in the first imaging visual field region, in which a first defect candidate for defect determination among a plurality of defect candidates of a sample is present; a pseudo-reference image generation unit which generates a pseudo-reference image including a circuit pattern of the first defect candidate by superimposing a plurality of images respectively captured at the plurality of overlapping defect candidate coordinates; and a defect determination unit which compares an image for defect determination captured at the coordinates of the first defect candidate with the pseudo-reference image to determine the presence or absence of a defect in the image for defect determination.

    DEFECT CLASSIFICATION APPARATUS AND DEFECT CLASSIFICATION METHOD
    14.
    发明申请
    DEFECT CLASSIFICATION APPARATUS AND DEFECT CLASSIFICATION METHOD 审中-公开

    公开(公告)号：US20190139210A1

    公开(公告)日：2019-05-09

    申请号：US16090991

    申请日：2016-05-24

    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

    Inventor： Naoaki KONDO ,  Takehiro HIRAI ,  Minoru HARADA ,  Yuji TAKAGI

    IPC: G06T7/00 ,  G01N23/225 ,  G06K9/42 ,  G06K9/62

    Abstract: Provided is a defect classification apparatus classifying images of defects of a sample included in images obtained by capturing the sample, the apparatus including an image storage unit for storing the images of the sample acquired by an external image acquisition unit, a defect class storage unit for storing types of defects included in the images of the sample, an image processing unit for extracting images of defects from the images from the sample, processing the extracted images of defects and generating a plurality of defect images, a classifier learning unit for learning a defect classifier using the images of defects of the sample extracted by the image processing unit and data of the plurality of generated defect images, and a defect classification unit for processing the images of the sample by using the classifier learned by the classifier learning unit, to classify the images of defects of the sample.

    Defect Image Classification Apparatus
    16.
    发明申请
    Defect Image Classification Apparatus 审中-公开
    缺陷图像分类装置

    公开(公告)号：US20160358746A1

    公开(公告)日：2016-12-08

    申请号：US15163725

    申请日：2016-05-25

    Applicant: Hitachi High-Technologies Corporation

    Inventor： Takehiro HIRAI ,  Yohei MINEKAWA ,  Yutaka TANDAI

    IPC: H01J37/22 ,  H01J37/28 ,  H01J37/285

    CPC classification number: H01J37/222 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01J37/28 ,  H01J37/285 ,  H01J2237/221 ,  H01J2237/24592 ,  H01J2237/28 ,  H01J2237/2817 ,  H01L22/12 ,  H01L22/20

    Abstract: A defect image classification apparatus includes a control unit that selects images obtained from at least some detectors among a plurality of detectors, associated with kinds of defects to be a classification result of an automatic defect classification processing unit, as images displayed initially on a display unit. The control unit associates the kinds of the defects and the images displayed initially on the display unit, on the basis of a switching operation log when a user classifies images of defects determined previously as the same kinds as the kinds of the defects determined by the automatic defect classification processing unit.

    Abstract translation: 缺陷图像分类装置包括控制单元，其将从与缺陷类型相关联的多个检测器中的至少一些检测器获得的图像作为自动缺陷分类处理单元的分类结果，最初显示在显示单元上 。 控制单元根据切换操作日志，基于切换操作日志将先前显示的缺陷和图像的种类与先前所确定的缺陷的图像分类为与由自动化确定的缺陷的种类相同的种类 缺陷分类处理单元。

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