公开(公告)号：US20190237296A1

公开(公告)日：2019-08-01

申请号：US16260988

申请日：2019-01-29

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Yuko OTANI ,  Yohei MINEKAWA ,  Takashi NOBUHARA ,  Nobuhiko KANZAKI ,  Takehiro HIRAI ,  Miyuki FUKUDA ,  Yuya ISOMAE ,  Kaori YAESHIMA ,  Yuji TAKAGI

IPC: H01J37/22 ,  G06T7/73 ,  G06T7/13 ,  G06T7/60 ,  G02B21/00 ,  G02B21/36 ,  G06T7/00 ,  H01J37/28

Abstract: A defect observation device detects a defect with high accuracy regardless of a defect size. One imaging configuration for observing an observation target on a sample is selected from an optical microscope, an optical microscope, and an electron microscope, and an imaging condition of the selected imaging configuration is controlled.

公开(公告)号：US20170082425A1

公开(公告)日：2017-03-23

申请号：US15126391

申请日：2015-03-19

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Yohei MINEKAWA ,  Yuko OTANI ,  Yuji TAKAGI

IPC: G01B11/14 ,  G02B21/36 ,  G02B21/10 ,  G02B21/00 ,  G01N23/225 ,  G01N23/22

CPC classification number: G01B11/14 ,  G01B11/30 ,  G01N21/9501 ,  G01N21/956 ,  G01N23/2204 ,  G01N23/2251 ,  G01N2021/8848 ,  G01N2223/30 ,  G01N2223/646 ,  G02B5/3083 ,  G02B21/0092 ,  G02B21/10 ,  G02B21/361 ,  G02B21/367

Abstract: To review minute defects that were buried in roughness scattered light with an observation device provided with a dark-field microscope, a scanning electron microscope (SEM), and a control unit, the present invention configures the dark-field microscope by installing a filter for blocking a portion of the scattered light, an imaging lens for focusing the scattered light that has passed through the filter, and a detector for dividing the image of the scattered light focused by the imaging lens into the polarization directions converted by a wavelength plate and detecting the resulting images, and the control has a calculation unit for determining the position of a defect candidate detected by another inspection device using the plurality of images separated into polarization directions and detected by the detector.

公开(公告)号：US20200083017A1

公开(公告)日：2020-03-12

申请号：US16567687

申请日：2019-09-11

Applicant: Hitachi High-Technologies Corporation

Inventor： Minoru HARADA ,  Yuji TAKAGI ,  Naoaki KONDO ,  Takehiro HIRAI ,  Yohei MINEKAWA

IPC: H01J37/147 ,  G01N21/956 ,  G01N21/95 ,  G06T7/00 ,  G06T7/12 ,  G06T5/50 ,  H01L21/67 ,  H01J37/28

Abstract: In a device for observing a semiconductor wafer, a positional relationship between an in-wafer region and a background region in an imaging field of view is not constant when an outer peripheral portion of the wafer is imaged, which results in an increase in the quantity of calculation in defect detection and image classification processing and makes it difficult to efficiently perform defect observation and analysis. There is provided a defect observation system for a semiconductor wafer, and the system includes: a stage on which the semiconductor wafer is placed and which is movable in an XY direction, an imaging unit that is configured to image a portion including an edge of the semiconductor wafer, and an image output unit that is configured to, with respect to a plurality of images obtained by imaging, output images in which edges of the wafer are substantially in parallel among the plurality of images.

公开(公告)号：US20170323435A1

公开(公告)日：2017-11-09

申请号：US15329480

申请日：2015-06-26

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Yohei MINEKAWA ,  Yuji TAKAGI ,  Takehiro HIRAI

IPC: G06T7/00 ,  H01L21/68

CPC classification number: G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01L21/67288 ,  H01L21/68

Abstract: To quantify the degree of a defect, and provide information useful for yield management. Disclosed is a defect quantification method wherein: a defect image is classified; a measurement region and a measurement area are set to each of the defect image and a reference image on the basis of defect image classification results, said reference image corresponding to the defect image; and an evaluation value of a defect is calculated using each of the measurement values obtained from each of the measurement areas of the defect image and the reference image, and the defect is quantified.

公开(公告)号：US20170249753A1

公开(公告)日：2017-08-31

申请号：US15386262

申请日：2016-12-21

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Yuko OTANI ,  Kazuo AOKI ,  Yohei MINEKAWA

IPC: G06T7/80 ,  G06T7/00 ,  G06T7/73 ,  H04N5/232 ,  G06K9/62 ,  G01N21/956 ,  G02B21/00 ,  G02B21/06 ,  G02B21/36 ,  G01N23/225 ,  G01N21/95 ,  H04N7/18 ,  H04N5/235

CPC classification number: G06T7/80 ,  G01N21/9501 ,  G01N21/956 ,  G01N23/2251 ,  G01N2223/418 ,  G01N2223/6116 ,  G02B21/0016 ,  G02B21/06 ,  G02B21/125 ,  G02B21/365 ,  G03F7/7065 ,  G06K9/6202 ,  G06T7/001 ,  G06T7/74 ,  G06T2207/10061 ,  G06T2207/30148 ,  H04N5/2256 ,  H04N5/23238 ,  H04N5/23245 ,  H04N5/23296 ,  H04N5/2354 ,  H04N7/181

Abstract: A defect observation apparatus includes a storage unit configured to store defect information about defects detected by an external inspection apparatus; a first imaging unit configured to capture an image of a defect using a first imaging condition and a second imaging condition; a control unit configured to correct positional information on the defect using the image captured with the first imaging unit; and a second imaging unit configured to capture an image of the defect based on the corrected positional information.

公开(公告)号：US20160358746A1

公开(公告)日：2016-12-08

申请号：US15163725

申请日：2016-05-25

Applicant: Hitachi High-Technologies Corporation

Inventor： Takehiro HIRAI ,  Yohei MINEKAWA ,  Yutaka TANDAI

IPC: H01J37/22 ,  H01J37/28 ,  H01J37/285

CPC classification number: H01J37/222 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01J37/28 ,  H01J37/285 ,  H01J2237/221 ,  H01J2237/24592 ,  H01J2237/28 ,  H01J2237/2817 ,  H01L22/12 ,  H01L22/20

Abstract: A defect image classification apparatus includes a control unit that selects images obtained from at least some detectors among a plurality of detectors, associated with kinds of defects to be a classification result of an automatic defect classification processing unit, as images displayed initially on a display unit. The control unit associates the kinds of the defects and the images displayed initially on the display unit, on the basis of a switching operation log when a user classifies images of defects determined previously as the same kinds as the kinds of the defects determined by the automatic defect classification processing unit.

Abstract translation: 缺陷图像分类装置包括控制单元，其将从与缺陷类型相关联的多个检测器中的至少一些检测器获得的图像作为自动缺陷分类处理单元的分类结果，最初显示在显示单元上 。 控制单元根据切换操作日志，基于切换操作日志将先前显示的缺陷和图像的种类与先前所确定的缺陷的图像分类为与由自动化确定的缺陷的种类相同的种类 缺陷分类处理单元。