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    DEFECT OBSERVATION SYSTEM AND DEFECT OBSERVATION METHOD FOR SEMICONDUCTOR WAFER
    2.
    发明申请
    DEFECT OBSERVATION SYSTEM AND DEFECT OBSERVATION METHOD FOR SEMICONDUCTOR WAFER 审中-公开

    公开(公告)号：US20200083017A1

    公开(公告)日：2020-03-12

    申请号：US16567687

    申请日：2019-09-11

    Applicant: Hitachi High-Technologies Corporation

    Inventor： Minoru HARADA ,  Yuji TAKAGI ,  Naoaki KONDO ,  Takehiro HIRAI ,  Yohei MINEKAWA

    IPC: H01J37/147 ,  G01N21/956 ,  G01N21/95 ,  G06T7/00 ,  G06T7/12 ,  G06T5/50 ,  H01L21/67 ,  H01J37/28

    Abstract: In a device for observing a semiconductor wafer, a positional relationship between an in-wafer region and a background region in an imaging field of view is not constant when an outer peripheral portion of the wafer is imaged, which results in an increase in the quantity of calculation in defect detection and image classification processing and makes it difficult to efficiently perform defect observation and analysis. There is provided a defect observation system for a semiconductor wafer, and the system includes: a stage on which the semiconductor wafer is placed and which is movable in an XY direction, an imaging unit that is configured to image a portion including an edge of the semiconductor wafer, and an image output unit that is configured to, with respect to a plurality of images obtained by imaging, output images in which edges of the wafer are substantially in parallel among the plurality of images.

    DEFECT INSPECTION METHOD AND DEFECT INSPECTION DEVICE
    3.
    发明申请
    DEFECT INSPECTION METHOD AND DEFECT INSPECTION DEVICE 有权
    缺陷检查方法和缺陷检查装置

    公开(公告)号：US20160019682A1

    公开(公告)日：2016-01-21

    申请号：US14773319

    申请日：2014-01-27

    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

    Inventor： Yuji TAKAGI ,  Minoru HARADA ,  Masashi SAKAMOTO ,  Takehiro HIRAI

    IPC: G06T7/00 ,  G06K9/62

    CPC classification number: G06T7/001 ,  G06K9/6202 ,  G06K9/6284 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01J2237/2817 ,  H01L22/12

    Abstract: In order to reduce the amount of time it takes to collect images of defects, this defect inspection device is provided with the following: a read-out unit that reads out positions of defects in a semiconductor wafer that have already been detected; a first imaging unit that takes, at a first magnification, a reference image of a chip other than the chip where one of the read-out defects is; a second imaging unit that takes, at the first magnification, a first defect image that contains the read-out defect; a defect-position identification unit that identifies the position of the defect in the first defect image taken by the second imaging unit by comparing said first defect image with the reference image taken by the first imaging unit; a third imaging unit that, on the basis of the identified defect position, takes a second defect image at a second magnification that is higher than the first magnification; a rearrangement unit that rearranges the read-out defects in an order corresponding to a path that goes through each of the read-out defects exactly once; and a stage-movement-path generation unit that selects the chip where the reference image corresponding to each defect is to be taken and generates a stage-movement path by determining stage-movement positions for the first and second imaging units.

    Abstract translation: 为了减少收集缺陷图像所花费的时间，该缺陷检查装置具有：读出单元，读出已经检测到的半导体晶片中的缺陷位置; 第一成像单元，其以第一放大率取得除了其中一个读出缺陷的芯片之外的芯片的参考图像; 第二成像单元，其在第一放大率下取得包含读出缺陷的第一缺陷图像; 缺陷位置识别单元，其通过将所述第一缺陷图像与由所述第一成像单元拍摄的参考图像进行比较来识别由所述第二成像单元拍摄的所述第一缺陷图像中的所述缺陷的位置; 第三成像单元，其基于所识别的缺陷位置，以比所述第一放大率高的第二倍率拍摄第二缺陷图像; 重新布置单元，其以与经过每一个读出缺陷的路径相对应的顺序重新排列读出的缺陷; 以及阶段移动路径生成单元，其选择要获取与每个缺陷相对应的参考图像的芯片，并且通过确定第一和第二成像单元的阶段移动位置来生成平台移动路径。

    MEASUREMENT DEVICE, METHOD AND DISPLAY DEVICE
    4.
    发明申请
    MEASUREMENT DEVICE, METHOD AND DISPLAY DEVICE 审中-公开

    公开(公告)号：US20190033728A1

    公开(公告)日：2019-01-31

    申请号：US16070708

    申请日：2016-01-27

    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

    Inventor： Yuji TAKAGI ,  Fumihiko FUKUNAGA ,  Yasunori GOTO

    IPC: G03F7/20 ,  G06K9/62 ,  G06T7/00 ,  H01L23/544

    Abstract: An overlay measurement method using a reference image is an effective method for an overlay measurement in a product circuit. However, there is a problem that it is not possible to obtain an ideal reference image in a process of prototyping.A measurement device described in a specific embodiment of the present invention includes an imaging unit that captures an image of a circuit pattern of a semiconductor wafer surface by an optical microscope or an electronic microscope, a pattern recognition unit that extracts a first pattern and a second pattern from the image captured by the imaging unit, a reference image generation unit that synthesizes a first reference image using the first pattern extracted from a plurality of the images and synthesizes a second reference image using the second pattern extracted from the plurality of images, a quantification unit that quantifies a first difference that is a difference between the first reference image and the first pattern and a second difference that is a difference between the second reference image and the second pattern, and a calculation unit that calculates an overlay amount included in the circuit pattern using the first difference and the second difference.

    DEFECT IMAGE CLASSIFICATION DEVICE AND DEFECT IMAGE CLASSIFICATION METHOD
    5.
    发明申请
    DEFECT IMAGE CLASSIFICATION DEVICE AND DEFECT IMAGE CLASSIFICATION METHOD 审中-公开

    公开(公告)号：US20180174000A1

    公开(公告)日：2018-06-21

    申请号：US15579047

    申请日：2015-06-04

    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

    Inventor： Yuji TAKAGI ,  Minoru HARADA ,  Takehiro HIRAI

    IPC: G06K9/62 ,  G01N21/88 ,  G01N23/2251

    CPC classification number: G06K9/6262 ,  G01N21/8851 ,  G01N21/9501 ,  G01N23/2251 ,  G01N2021/8854 ,  G01N2021/8887 ,  G01N2223/6116 ,  G06K9/03 ,  G06K9/4628 ,  G06K9/6267 ,  G06K9/6271

    Abstract: In a defect classification operation in which ADC and visual classification are both used, a problem with the visual classification in the related art is solved, and then the high-reliability performance evaluation of the ADC and the update of the ADC learning data set are made possible, using both the ADC and the visual classification, or both the ADC and one other classification apparatus.An apparatus that classifies defect images is configured to include: a storage unit in which the defect images that are obtained by being captured with separate image capture means are stored; an image selection unit that selects images from among the defect images that are stored in the storage unit, using information on defect classes into which defects are classified in a plurality of separate defect classification means; an image classification unit that classifies the images which are selected in the image selection unit, based on a classification recipe; a classification performance evaluation unit that evaluates classification performance of the image classification unit based on a result of the classification of the images; and a learning update unit that updates the classification recipe of the image classification unit using the images that are selected in the image selection unit in a case where the result of the evaluation in the classification performance evaluation unit does not satisfy a reference that is in advance set.

    DEFECT OBSERVATION METHOD AND DEFECT OBSERVATION DEVICE
    6.
    发明申请
    DEFECT OBSERVATION METHOD AND DEFECT OBSERVATION DEVICE 有权
    缺陷观察方法和缺陷观察装置

    公开(公告)号：US20150332445A1

    公开(公告)日：2015-11-19

    申请号：US14652198

    申请日：2013-12-06

    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

    Inventor： Minoru HARADA ,  Yuji TAKAGI ,  Ryo NAKAGAKI ,  Takehiro HIRAI ,  Hirohiko KITSUKI

    IPC: G06T7/00

    CPC classification number: G06T7/001 ,  G01N21/9501 ,  G06T2207/10004 ,  G06T2207/10061 ,  G06T2207/30148

    Abstract: The purpose of the present invention is to easily extract, from samples to be observed, defect candidates that can be labeled as a defect or “nuisance” (a part for which a manufacturing tolerance or the like is erroneously detected) and to allow parameters pertaining to observation processing to be easily adjusted. This defect observation method comprises: an imaging step to image, on the basis of defect information from an inspection device, an object to be inspected and obtain a defect image and a reference image corresponding to the defect image; a parameter determining step to determine a first parameter to be used in the defect extraction by using a first feature set distribution acquired from the reference image and the defect image captured in the imaging step and a second feature net distribution acquired from the reference image; and an observing step to observe using the first parameter determined in the parameter determining step. The present invention can be applied to a method of observing defects generated during the manufacturing of semiconductor wafers.

    Abstract translation: 本发明的目的是容易地从待观察的样品中提取可以被标记为缺陷或“妨碍”（错误地检测制造公差等的部分）的缺陷候选，并且允许参数相关 观察加工易于调整。 该缺陷观察方法包括：成像步骤，基于来自检查装置的缺陷信息，对要检查的对象进行成像，并获得与缺陷图像相对应的缺陷图像和参考图像; 参数确定步骤，通过使用从参考图像获取的第一特征集分布和在成像步骤中捕获的缺陷图像来确定在缺陷提取中使用的第一参数，以及从参考图像获取的第二特征网分布; 以及观察步骤，用于观察使用在参数确定步骤中确定的第一参数。 本发明可以应用于观察在制造半导体晶片期间产生的缺陷的方法。

    DEFECT OBSERVATION DEVICE AND DEFECT OBSERVATION METHOD
    7.
    发明申请
    DEFECT OBSERVATION DEVICE AND DEFECT OBSERVATION METHOD 审中-公开

    公开(公告)号：US20200034957A1

    公开(公告)日：2020-01-30

    申请号：US16493697

    申请日：2017-03-17

    Applicant: Hitachi High-Technologies Corporation

    Inventor： Naoaki KONDO ,  Minoru HARADA ,  Yuji TAKAGI ,  Takehiro HIRAI

    IPC: G06T7/00 ,  G01N21/95 ,  G01N21/956

    Abstract: A defect observation device comprising: a defect determination coordinate creation unit by which the coordinates of a plurality of second defect candidates are determined as overlapping defect candidate coordinates, the plurality of second defect candidates respectively having, in a plurality of second imaging visual field regions overlapping a first imaging visual field region, a circuit pattern which partly overlaps a circuit pattern in the first imaging visual field region, in which a first defect candidate for defect determination among a plurality of defect candidates of a sample is present; a pseudo-reference image generation unit which generates a pseudo-reference image including a circuit pattern of the first defect candidate by superimposing a plurality of images respectively captured at the plurality of overlapping defect candidate coordinates; and a defect determination unit which compares an image for defect determination captured at the coordinates of the first defect candidate with the pseudo-reference image to determine the presence or absence of a defect in the image for defect determination.

    DEFECT CLASSIFICATION APPARATUS AND DEFECT CLASSIFICATION METHOD
    9.
    发明申请
    DEFECT CLASSIFICATION APPARATUS AND DEFECT CLASSIFICATION METHOD 审中-公开

    公开(公告)号：US20190139210A1

    公开(公告)日：2019-05-09

    申请号：US16090991

    申请日：2016-05-24

    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

    Inventor： Naoaki KONDO ,  Takehiro HIRAI ,  Minoru HARADA ,  Yuji TAKAGI

    IPC: G06T7/00 ,  G01N23/225 ,  G06K9/42 ,  G06K9/62

    Abstract: Provided is a defect classification apparatus classifying images of defects of a sample included in images obtained by capturing the sample, the apparatus including an image storage unit for storing the images of the sample acquired by an external image acquisition unit, a defect class storage unit for storing types of defects included in the images of the sample, an image processing unit for extracting images of defects from the images from the sample, processing the extracted images of defects and generating a plurality of defect images, a classifier learning unit for learning a defect classifier using the images of defects of the sample extracted by the image processing unit and data of the plurality of generated defect images, and a defect classification unit for processing the images of the sample by using the classifier learned by the classifier learning unit, to classify the images of defects of the sample.

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