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134 条记录 (耗时 0.034 秒)

    Ring substituted pyrazino-isoquinoline derivatives and their preparation
    12.
    发明授权
    Ring substituted pyrazino-isoquinoline derivatives and their preparation 失效
    环取代的吡嗪异喹啉衍生物及其制备方法

    公开(公告)号：US4120961A

    公开(公告)日：1978-10-17

    申请号：US817467

    申请日：1977-07-20

    申请人： Jurgen Seubert ,  Rolf Pohlke ,  Herbert Thomas ,  Peter Andrews

    发明人： Jurgen Seubert ,  Rolf Pohlke ,  Herbert Thomas ,  Peter Andrews

    IPC分类号： C07D217/14 ,  A61K31/495 ,  C07D241/36

    CPC分类号： C07D217/14

    摘要： Isoquinolines of the formula ##STR1## wherein R.sup.1 is H, OH, alkyl; R.sup.2 is H, or an unsubstituted or substituted carbonyl, carbonyloxy or thiocarbonyl group; R.sup.3 is H, alkyl or hydroxy alkyl; R.sup.4 is H, alkyl or phenyl; R.sup.5 is O, H,H or H and alkyl, phenyl, halo or hydroxy; R.sup.6 and R.sup.7 are optional substituents; and R.sup.8 is H or alkyl, R.sup.2 being a thiocarbonyl or carbonyloxy group when R.sup.1 and R.sup.3 to R.sup.8 are H and X is O; and their physiologically acceptable salts, are antihelmintics, especially against cestodes and trematodes; some also possessing CNS activity, e.g., psychotropic and blood pressure regulating activity.

    摘要翻译： 其中R 1是H，OH，烷基; R2是H或未取代或取代的羰基，羰基氧基或硫代羰基; R3是H，烷基或羟基烷基; R4是H，烷基或苯基; R5是O，H，H或H，烷基，苯基，卤素或羟基; R6和R7是任选的取代基; 当R 1和R 3至R 8为H且X为O时，R 8为H或烷基，R 2为硫代羰基或羰基氧基; 和它们的生理学上可接受的盐，是抗炎药，特别是针对绦虫和吸虫; 一些还具有CNS活性，例如精神病和血压调节活性。

    Pyrazinoisoquinolines as anthelmintic agents
    13.
    发明授权
    Pyrazinoisoquinolines as anthelmintic agents 失效
    吡嗪异喹啉作为驱肠剂

    公开(公告)号：US3993760A

    公开(公告)日：1976-11-23

    申请号：US481792

    申请日：1974-06-21

    申请人： Rolf Pohlke ,  Friedrich Loebich ,  Jurgen Seubert ,  Herbert Thomas ,  Peter Andrews

    发明人： Rolf Pohlke ,  Friedrich Loebich ,  Jurgen Seubert ,  Herbert Thomas ,  Peter Andrews

    IPC分类号： C07D217/14 ,  C07D471/04 ,  A61K31/495

    CPC分类号： C07D471/04 ,  C07D217/14

    摘要： (-)-2-Benzoyl-4-oxo-1,2,3,6,7,11b-hexahydro-4H-pyrazino[2,1-a]isoquinoline is prepared by benzoylation of (-)-4-oxo-1,2,3,6,7,11b-hexahydro-4H-pyrazino[2,1-a]isoquinoline, or cyclization of a compound of the formula ##SPC1##Wherein X is F, Cl, Br, I or O-tosyl and which has the optical configuration of the final product, or cyclization of a compound of the formula ##SPC2## wherein Y is OH, alkoxy, F, Cl, Br or I under HY-removing reaction conditions and which has the optical configuration of the final product, which is an anthelmintic.

    摘要翻译： （ - ） - 2-苯甲酰基-4-氧代-1,2,3,6,7,11b-六氢-4H-吡嗪并[2,1-a]异喹啉线是通过（ - ） - 4-氧代 -1,2,3,6,7,11b-六氢-4H-吡嗪并[2,1-a]异喹啉，或式WHEREIN X的化合物与F，Cl，Br，I或O-甲苯磺酰基和 其具有最终产物的光学构型，或在HY-去除反应条件下环化下式化合物其中Y是OH，烷氧基，F，Cl，Br或I，并且具有最终产物的光学构型，其中 是一个驱魔。

    Dispensed electrical interconnections
    16.
    发明授权
    Dispensed electrical interconnections 有权
    分配电气互连

    公开(公告)号：US07442564B2

    公开(公告)日：2008-10-28

    申请号：US11334922

    申请日：2006-01-19

    申请人： Peter Andrews

    发明人： Peter Andrews

    IPC分类号： H01L21/00

    CPC分类号： H05K3/4685 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/3025 ,  H05K1/095 ,  H05K1/142 ,  H05K3/1241 ,  H05K3/321 ,  H05K3/4664 ,  H05K2203/0126 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An electronic device includes a substrate, an electrical element on the substrate, a nonconductive adhesive material on the substrate, and a conductive adhesive material on the electrical element and extending onto the nonconductive adhesive material. Methods of forming a packaged LED include providing a substrate having an electrical element thereon, and dispensing a nonconductive adhesive material on the substrate. The nonconductive adhesive material is at least partially cured, and a conductive adhesive material is dispensed on the electrical element and on the at least partially cured nonconductive material. The conductive adhesive material is at least partially cured. The conductive adhesive material may provide an electrical connection between the electrical element and a second electrical element on the substrate or on another substrate.

    摘要翻译： 电子设备包括基板，基板上的电气元件，基板上的非导电粘合剂材料，以及电气元件上的导电粘合剂材料并延伸到非导电粘合剂材料上。 形成封装的LED的方法包括提供其上具有电元件的基板，以及在基板上分配非导电粘合剂材料。 非导电粘合剂材料至少部分固化，并且导电粘合剂材料分配在电气元件上以及至少部分固化的非导电材料上。 导电粘合剂材料至少部分固化。 导电粘合剂材料可以在电气元件和衬底上或另一衬底上的第二电气元件之间提供电连接。

    Chuck with integrated wafer support
    17.
    发明授权
    Chuck with integrated wafer support 失效
    带集成晶圆支架的卡盘

    公开(公告)号：US07362115B2

    公开(公告)日：2008-04-22

    申请号：US11655605

    申请日：2007-01-19

    申请人： Peter Andrews ,  Brad Froemke ,  John Dunklee

    发明人： Peter Andrews ,  Brad Froemke ,  John Dunklee

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2887

    摘要： An improved chuck assembly with lift pins. The chuck assembly may have an outer periphery and an upper surface. The lift pins may be positioned within the periphery of the chuck assembly and may be capable of relative vertical movement with respect to the upper surface of the chuck assembly.

    摘要翻译： 具有提升销的改进的卡盘组件。 卡盘组件可以具有外周边和上表面。 提升销可以定位在卡盘组件的周边内，并且可以相对于卡盘组件的上表面相对垂直运动。

    Light emitting device packages, light emitting diode (LED) packages and related methods
    19.
    发明申请
    Light emitting device packages, light emitting diode (LED) packages and related methods 有权
    发光器件封装，发光二极管（LED）封装及相关方法

    公开(公告)号：US20080054286A1

    公开(公告)日：2008-03-06

    申请号：US11895795

    申请日：2007-08-27

    申请人： Ban Loh ,  Peter Andrews ,  Nicholas Medendorp

    发明人： Ban Loh ,  Peter Andrews ,  Nicholas Medendorp

    IPC分类号： H01L33/00 ,  H01L21/00

    CPC分类号： H01L33/52 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2924/00014

    摘要： Light emitting device packages, light emitting diode (LED) packages and related methods are disclosed. According to one aspect, a light emitting device package is provided. The package includes a mounting pad adapted for attachment of a light emitting device. A lens coupler is attached to the mounting pad and defines an opening for containing the light emitting device and a quantity of encapsulant. The lens coupler includes a surface defining a depression which comprises at least one edge that shapes an outer surface of the encapsulant.

    摘要翻译： 公开了发光器件封装，发光二极管（LED）封装和相关方法。 根据一个方面，提供一种发光器件封装。 该包装包括适于附接发光装置的安装垫。 透镜耦合器附接到安装焊盘并且限定用于容纳发光器件的开口和一定数量的密封剂。 透镜耦合器包括限定凹陷的表面，其包括形成密封剂的外表面的至少一个边缘。

    LED package with flexible polyimid circuit and method of manufacturing LED package
    20.
    发明申请
    LED package with flexible polyimid circuit and method of manufacturing LED package 有权
    LED封装具有柔性聚酰亚胺电路和制造LED封装的方法

    公开(公告)号：US20080001160A1

    公开(公告)日：2008-01-03

    申请号：US11476836

    申请日：2006-06-29

    申请人： Peter Andrews

    发明人： Peter Andrews

    IPC分类号： H01L33/00

    CPC分类号： H01L33/62 ,  H01L27/156 ,  H01L33/52 ,  H01L33/58 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01078 ,  H01L2924/00014

    摘要： A light emitting diode (LED) package may include a base, at least one light emitting die on the base, and a flextape on the base. The flextape includes at least one metal trace connected to the light emitting die. In a method of manufacturing the LED package, the base may be formed so as to include a basin and at least one light emitting die may be placed within the basin. The flextape may be provided to include at least one metal trace that is electrically connected to the light emitting die.

    摘要翻译： 发光二极管（LED）封装可以包括基底，在基底上的至少一个发光管芯和基底上的柔性件。 柔性包括连接到发光模具的至少一个金属迹线。 在制造LED封装的方法中，基底可以形成为包括盆，并且至少一个发光管可以放置在盆内。 柔性件可以设置成包括电连接到发光管芯的至少一个金属迹线。