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11.发明申请公开(公告)号：US20070135958A1
公开(公告)日：2007-06-14
申请号：US11677450
申请日：2007-02-21
IPC分类号： G06F19/00
CPC分类号： B24B37/013 , B24B49/02 , B24B49/10 , B24B49/12 , G01B7/105 , G01B11/0683
摘要： A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.
摘要翻译： 化学机械抛光装置和方法可以使用涡流监测系统和光学监测系统。 来自监控系统的信号可以组合在输出线上并由计算机提取。 可以计算抛光垫的厚度。 涡流监测系统和光学监测系统可以测量基板上基本相同的位置。
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公开(公告)号：US20060246822A1
公开(公告)日：2006-11-02
申请号：US11479299
申请日：2006-06-29
CPC分类号： B24B37/345 , B24B37/005 , B24B49/105 , G01B7/105 , H01L21/67219 , H01L22/12
摘要： A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce eddy currents in one or more conductive regions of a substrate either prior to or subsequent to polishing. The eddy current signals are detected, and may be used to update one or more polishing parameters for a chemical mechanical polishing system. The substrate holder may be located in a number places; for example, in a substrate transfer system, a factory interface module, a cleaner, or in a portion of the chemical mechanical polishing system away from the polishing stations. Additional probes may be used.
摘要翻译： 一种系统包括用于将涡流探针靠近衬底保持器中的衬底定位的测量站。 探针可以产生时变磁场，以便在抛光之前或之后在衬底的一个或多个导电区域中引起涡流。 检测涡流信号，并可用于更新化学机械抛光系统的一个或多个抛光参数。 衬底保持器可以位于多个位置; 例如，在基板传送系统，工厂接口模块，清洁器或化学机械抛光系统的远离抛光站的一部分中。 可以使用附加的探针。
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公开(公告)号：US20060009131A1
公开(公告)日：2006-01-12
申请号：US11222561
申请日：2005-09-08
IPC分类号： B24B49/00
CPC分类号： B24B37/013 , B24B49/10
摘要： Methods and apparatus to implement techniques for monitoring polishing a substrate. Two or more data points are acquired, where each data point has a value affected by features inside a sensing region of a sensor and corresponds to a relative position of the substrate and the sensor as the sensing region traverses through the substrate. A set of reference points is used to modify the acquired data points. The modification compensates for distortions in the acquired data points caused by the sensing region traversing through the substrate. Based on the modified data points, a local property of the substrate is evaluated to monitor polishing.
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公开(公告)号：US20050048874A1
公开(公告)日：2005-03-03
申请号：US10966948
申请日：2004-10-15
IPC分类号： B24B37/005 , B24B37/34 , B24B49/10 , B24B49/00
CPC分类号： B24B37/345 , B24B37/005 , B24B49/105 , G01B7/105 , H01L21/67219 , H01L22/12
摘要： A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce eddy currents in one or more conductive regions of a substrate either prior to or subsequent to polishing. The eddy current signals are detected, and may be used to update one or more polishing parameters for a chemical mechanical polishing system. The substrate holder may be located in a number places; for example, in a substrate transfer system, a factory interface module, a cleaner, or in a portion of the chemical mechanical polishing system away from the polishing stations. Additional probes may be used.
摘要翻译： 一种系统包括用于将涡流探针靠近衬底保持器中的衬底定位的测量站。 探针可以产生时变磁场，以便在抛光之前或之后在衬底的一个或多个导电区域中引起涡流。 检测涡流信号，并可用于更新化学机械抛光系统的一个或多个抛光参数。 衬底保持器可以位于多个位置; 例如，在基板传送系统，工厂接口模块，清洁器或化学机械抛光系统的远离抛光站的一部分中。 可以使用附加的探针。
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15.发明授权公开(公告)号：US06399501B2
公开(公告)日：2002-06-04
申请号：US09460529
申请日：1999-12-13
IPC分类号： H01L21302
CPC分类号： B24B37/013 , B24B49/04 , B24B49/12 , H01L21/3212
摘要： An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad that has a window, causes relative motion between the substrate and the polishing pad, and directs a light beam through the window so that the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate. An extreme intensity measurement is derived from a plurality of intensity measurements made as the light beam moves across the substrate. The beam sweeps across the substrate a plurality of times to generate a plurality of extreme intensity measurements, and a polishing endpoint is detected based on the plurality of extreme intensity measurements.
摘要翻译： 一种装置以及方法使基板的表面与具有窗口的抛光垫接触，引起基板和抛光垫之间的相对运动，并引导光束通过窗口，使得运动 抛光垫相对于基底使得光束在穿过基底的路径中移动。 当光束穿过衬底移动时，从多个强度测量得出极强度测量。 光束扫过基板多次以产生多个极强度测量，并且基于多个极强度测量来检测抛光端点。
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16.发明授权Apparatus for monitoring a metal layer during chemical mechanical polishing using a phase difference signal 有权用于使用相位差信号在化学机械抛光期间监测金属层的装置公开(公告)号：US06878036B2
公开(公告)日：2005-04-12
申请号：US10446878
申请日：2003-05-27
IPC分类号： B24B37/013 , B24B37/20 , B24B49/02 , B24B49/12 , G01B7/06 , G01N27/90 , H01L21/00 , B24B49/00 , B24B51/00
CPC分类号： B24B37/013 , B24B37/205 , B24B49/02 , B24B49/105 , B24B49/12 , G01B7/105
摘要： A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.
摘要翻译： 用于在化学机械抛光期间监测衬底中的导电膜的传感器产生撞击衬底并引起涡流的交变磁场。 传感器可以具有芯，围绕芯的第一部分缠绕的第一线圈和缠绕在芯的第二部分上的第二线圈。 传感器可以位于与衬底相对的抛光表面的一侧。 传感器可以检测到驱动信号和测量信号之间的相位差。
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公开(公告)号：US20070139043A1
公开(公告)日：2007-06-21
申请号：US11505659
申请日：2006-08-16
申请人： G. Miller , Boguslaw Swedek , Manoocher Birang
发明人： G. Miller , Boguslaw Swedek , Manoocher Birang
IPC分类号： G01B7/06
CPC分类号： B24B37/013 , B24B49/105 , G01B7/10 , H01L21/67253
摘要： An eddy current monitoring system may include an elongated core. One or more coils may be coupled with the elongated core for producing an oscillating magnetic field that may couple with one or more conductive regions on a wafer. The core may be translated relative to the wafer to provide improved resolution while maintaining sufficient signal strength. An eddy current monitoring system may include a DC-coupled marginal oscillator for producing an oscillating magnetic field at a resonant frequency, where the resonant frequency may change as a result of changes to one or more conductive regions. Eddy current monitoring systems may be used to enable real-time profile control.
摘要翻译： 涡流监视系统可以包括细长的核心。 一个或多个线圈可以与细长铁芯耦合以产生可与晶片上的一个或多个导电区域耦合的振荡磁场。 芯可以相对于晶片翻转以提供改善的分辨率，同时保持足够的信号强度。 涡流监测系统可以包括用于产生谐振频率的振荡磁场的DC耦合边缘振荡器，其中谐振频率可能由于对一个或多个导电区域的改变而改变。 涡流监视系统可用于实现实时配置文件控制。
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公开(公告)号：US20060286904A1
公开(公告)日：2006-12-21
申请号：US11467116
申请日：2006-08-24
申请人： Boguslaw Swedek , Bret Adams , Sanjay Rajaram , David Chan , Manoocher Birang
发明人： Boguslaw Swedek , Bret Adams , Sanjay Rajaram , David Chan , Manoocher Birang
IPC分类号： B24B51/00
CPC分类号： B24B37/013 , B24B37/042 , B24B49/12 , B24B51/00 , H01L22/26
摘要： A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.
摘要翻译： 一种用于化学机械抛光中的过程控制的计算机实现方法，其中在计量站测量衬底的初始预抛光厚度，从衬底的初始厚度确定端点算法的参数，抛光衬底 在抛光台处，当使用端点算法检测到端点标准时抛光停止。
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公开(公告)号：US20050245170A1
公开(公告)日：2005-11-03
申请号：US11166022
申请日：2005-06-23
申请人： Boguslaw Swedek , Bret Adams , Sanjay Rajaram , David Chan , Manoocher Birang
发明人： Boguslaw Swedek , Bret Adams , Sanjay Rajaram , David Chan , Manoocher Birang
CPC分类号： B24B37/013 , B24B37/042 , B24B49/12 , B24B51/00 , H01L22/26
摘要： A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.
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公开(公告)号：US20050173259A1
公开(公告)日：2005-08-11
申请号：US10773868
申请日：2004-02-06
CPC分类号： B24B37/013 , B23H5/08 , B24B49/105 , C25F7/00
摘要： An electrochemical mechanical polishing apparatus has a rotatable platen to support a polishing pad, a carrier head to hold a substrate against the polishing pad, and multiple sensors, e.g., optical sensors or eddy current sensors, spaced at different angular positions about the axis of rotation of the platen. Each of the sensors can be substantially identical. A processor receives the signal from each of the sensors to determines a polishing endpoint.
摘要翻译： 电化学机械抛光装置具有可旋转压板以支撑抛光垫，用于将基板保持在抛光垫上的载体头以及围绕旋转轴线在不同角度位置间隔开的多个传感器，例如光学传感器或涡流传感器 的压板。 每个传感器可以是基本相同的。 处理器从每个传感器接收信号以确定抛光端点。
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