公开(公告)号：US06390901B1

公开(公告)日：2002-05-21

申请号：US09397916

申请日：1999-09-17

申请人： Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa ,  Hisanori Matsuo ,  Tetsuji Togawa ,  Satoshi Wakabayashi

发明人： Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa ,  Hisanori Matsuo ,  Tetsuji Togawa ,  Satoshi Wakabayashi

IPC分类号： B24B2900

CPC分类号： B24B37/11 ,  B24D9/085

摘要： An object of the present invention is to provide a polishing apparatus with a grinding plate that can easily and reliably be installed on and detached from a turntable. The polishing apparatus has a grinding plate tool, fixedly mounted on the turntable, which includes the grinding plate, and a top ring for holding a workpiece to be polished and pressing the workpiece against the grinding plate in sliding contact therewith for polishing a surface of the workpiece to a flat, mirror finish. A clamping mechanism is mounted in the turntable for fixing an outer circumferential flange of the grinding plate tool to the turntable.

摘要翻译： 本发明的目的是提供一种具有研磨板的抛光装置，其可以容易且可靠地安装在转台上和从转盘上拆下。 抛光装置具有固定安装在转盘上的研磨板工具，其包括研磨板，以及用于保持要抛光的工件的顶环，并将工件抵靠研磨板与其滑动接触，以抛光其中的表面 工件平整，镜面光洁。 夹持机构安装在转盘中，用于将研磨板工具的外周凸缘固定到转台上。

公开(公告)号：US06336850B1

公开(公告)日：2002-01-08

申请号：US09173002

申请日：1998-10-15

申请人： Yutaka Wada ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Hisanori Matsuo

发明人： Yutaka Wada ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Hisanori Matsuo

IPC分类号： B24B722

CPC分类号： B24B37/04 ,  B24B57/02

摘要： A polisher includes a turntable with a polishing surface provided on the top surface of the turntable, an article carrier for holding an article to be polished in such a manner that the article is brought into contact with the polishing surface to polish the article, and a slurry dispenser for receiving and dispensing slurry to the polishing surface. The dispenser includes a slurry dispensing member for dispensing slurry to the polishing surface. The slurry dispensing member includes a contact surface facing and substantially contacting the polishing surface, and a slurry dispensing opening including at least one hole provided in the contact surface to dispense the slurry to the polishing surface therethrough. The opening is sized in such a manner that the opening covers substantially an area of the polishing surface which is to be brought into engagement with the article by relative movement between the article and the polishing surface.

摘要翻译： 抛光机包括具有设置在转盘顶表面上的抛光表面的转台，用于保持待抛光物品的物品载体，使物品与抛光表面接触以对物品进行抛光，以及 用于将浆料接收和分配到抛光表面的浆料分配器。 分配器包括用于将浆料分配到抛光表面的浆料分配构件。 浆料分配构件包括面向并基本上接触抛光表面的接触表面，以及浆料分配开口，其包括设置在接触表面中的至少一个孔，以将浆料分配到通过其中的抛光表面。 开口的尺寸设计成使得开口基本上覆盖了通过制品和抛光表面之间的相对运动而与制品接合的抛光表面的一个区域。

公开(公告)号：US06190243B1

公开(公告)日：2001-02-20

申请号：US09306985

申请日：1999-05-07

申请人： Yutaka Wada ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Hisanori Matsuo

发明人： Yutaka Wada ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Hisanori Matsuo

IPC分类号： B24B2118

CPC分类号： B24B53/017

摘要： A polishing apparatus comprises a table having a smooth surface, a polishing pad provided on the smooth surface and a carrier for carrying an article to be polished The carrier brings the article into engagement with the pad under a pressure. The carrier and the table with the polishing pad are repeatedly moved relative to each other in a predetermined direction to thereby polish the article. A pressing device is positioned at a position spaced from the carrier is and adapted to be engaged with the polishing surface of the polishing pad. The pressing device includes a plurality of pressing elements which are arranged across an area of the polishing surface which area is to be brought into engagement with the article carried by the carrier and are adapted to individually press successive corresponding portions in the area to arrange the configuration of the surface of the area under corresponding various pressures.

摘要翻译： 抛光装置包括具有光滑表面的台面，设置在光滑表面上的抛光垫和用于承载待抛光物品的托架。承载件使得物品在压力下与垫接合。 载体和具有抛光垫的工作台在预定方向上相对于彼此重复地移动，从而抛光物品。 按压装置位于与载体间隔开的位置，并且适于与抛光垫的抛光表面接合。 按压装置包括多个按压元​​件，其横跨抛光表面的区域布置，该区域将与由承载件承载的物品接合，并且适于单独地按压该区域中的连续的对应部分以将构造 的面积在相应的各种压力下。

公开(公告)号：US6102786A

公开(公告)日：2000-08-15

申请号：US234633

申请日：1999-01-21

申请人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

发明人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

IPC分类号： B24B37/005 ,  B24D13/14 ,  H01L21/304 ,  B24B29/02

CPC分类号： B24B37/26 ,  B24B37/042 ,  B24B37/24

摘要： A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projecting region is determined on the basis of an area in which the projecting region acts on the workpiece.

摘要翻译： 抛光装置包括：转盘，其具有安装在其上表面上的研磨布;以及顶环，其设置在所述转台上方，用于支撑待抛光的工件，并在预定压力下将所述工件压靠所述研磨布。 转盘和顶环彼此相对移动，用研磨布抛光由顶环支撑的工件的表面。 研磨布在其表面上具有突出区域，用于与研磨布的其它表面更加紧密地接触工件。 当突出区域与工件保持接触时，突出区域在转台的径向上具有比工件的直径更小的尺寸。 基于突出区域作用在工件上的区域来确定突出区域的位置。

公开(公告)号：US6015337A

公开(公告)日：2000-01-18

申请号：US891993

申请日：1997-07-14

申请人： Hirokuni Hiyama ,  Yutaka Wada

发明人： Hirokuni Hiyama ,  Yutaka Wada

IPC分类号： B24B37/12 ,  B24B41/047 ,  B24B49/16 ,  B24D13/14 ,  H01L21/304 ,  B24B5/00 ,  B24B29/00

CPC分类号： B24B37/12 ,  B24B49/16

摘要： A polishing apparatus for polishing for example a semiconductor wafer to a high degree of flatness includes a turntable to the upper surface of which is affixed a polishing cloth and a top ring. A surface of the workpiece interposed between the polishing cloth on the turntable and the top ring is polished by pressing the workpiece against the polishing cloth with a predetermined pressure and moving the turntable and the top ring relative to each other. The turntable includes a set of annular small tables each of which is smaller than the diameter of the workpiece and determined on the basis of an area of effect on the workpiece.

摘要翻译： 用于将半导体晶片抛光到高平坦度的抛光装置包括一个转盘，其上表面上贴有一个抛光布和一个顶环。 通过以预定的压力将工件压靠在抛光布上而将转盘上的研磨布和顶环之间的工件表面抛光，并相对于彼此移动转台和顶环。 转盘包括一组环形小桌子，每个小桌子都小于工件的直径，并根据对工件的作用面积确定。

公开(公告)号：US08655478B2

公开(公告)日：2014-02-18

申请号：US12566224

申请日：2009-09-24

申请人： Akira Fukuda ,  Yoshihiro Mochizuki ,  Yutaka Wada ,  Yoichi Shiokawa ,  Hirokuni Hiyama

发明人： Akira Fukuda ,  Yoshihiro Mochizuki ,  Yutaka Wada ,  Yoichi Shiokawa ,  Hirokuni Hiyama

IPC分类号： G06F19/00 ,  G05B11/01 ,  G05B19/18 ,  B24B49/00 ,  B24B1/00 ,  G01D1/00

CPC分类号： B24B53/017

摘要： A method dresses a polishing member with a diamond dresser having diamond particles arranged on a surface thereof. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the determined dressing conditions. The simulation includes calculating the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.

摘要翻译： 一种方法用抛光件与金刚石修整器连接，金刚石修整器具有布置在其表面上的金刚石颗粒。 该方法包括通过对抛光构件的表面上的金刚石修整器的滑动距离的分布的模拟进行模拟，以及在确定的修整条件下用金刚石修整器修整抛光构件来确定修整条件。 模拟包括计算根据推入抛光构件的金刚石颗粒的深度校正的滑动距离。

公开(公告)号：USRE39262E1

公开(公告)日：2006-09-05

申请号：US09821046

申请日：2002-02-28

申请人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

发明人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

IPC分类号： B24B29/02

CPC分类号： B24B37/24

摘要： A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface regions of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projection region is determined on the basis of an area in which the projecting region acts on the workpiece.

摘要翻译： 抛光装置包括：转盘，其具有安装在其上表面上的研磨布;以及顶环，其设置在所述转台上方，用于支撑待抛光的工件，并在预定压力下将所述工件压靠所述研磨布。 转盘和顶环彼此相对移动，用研磨布抛光由顶环支撑的工件的表面。 研磨布在其表面上具有突出区域，用于与研磨布的其它表面区域更加紧密地接触工件。 当突出区域与工件保持接触时，突出区域在转台的径向上具有比工件的直径更小的尺寸。 基于突出区域作用在工件上的区域来确定投影区域的位置。

公开(公告)号：US06712678B1

公开(公告)日：2004-03-30

申请号：US09890880

申请日：2001-09-21

申请人： Yutaka Wada ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Hisanori Matsuo

发明人： Yutaka Wada ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Hisanori Matsuo

IPC分类号： B24B2900

CPC分类号： B24B53/017 ,  B24B57/02

摘要： It is an object of the present invention to provide a mechanism for effectively discharging debris produced when a substrate is polished by a bonded-abrasive element, and a polishing apparatus. According to the present invention, a polishing apparatus presses a surface of a substrate against a bonded-abrasive surface and moves the surface to be polished and the bonded-abrasive surface relative to each other to polish the surface. A mechanism is provided for discharging debris produced on the bonded-abrasive surface when the surface to be polished is polished.

摘要翻译： 本发明的目的是提供一种用于有效地排出当通过粘结研磨元件抛光基底时产生的碎屑的机构和抛光装置。 根据本发明，抛光装置将基板的表面压靠在粘合研磨表面上，并使被研磨表面和粘结研磨表面相对于彼此移动以抛光表面。 当抛光表面被抛光时，提供了用于排出在粘合研磨表面上产生的碎屑的机构。

公开(公告)号：US06579148B2

公开(公告)日：2003-06-17

申请号：US10166093

申请日：2002-06-11

申请人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo ,  Tetsuji Togawa

发明人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo ,  Tetsuji Togawa

IPC分类号： B24B4900

CPC分类号： B24B37/16 ,  B24B37/013 ,  B24B49/14 ,  B24B49/16 ,  B24B57/02

摘要： A polishing apparatus is used for polishing a surface of a workpiece such as a semiconductor wafer or a glass substrate. The polishing apparatus comprises a polishing table having a polishing surface thereon, a plurality of workpiece holders each for holding a workpiece and pressing the workpiece against the polishing surface, and a controller for controlling the workpiece holders individually so that polishing operations of the workpiece holders are controlled independently of each other.

公开(公告)号：US06458012B1

公开(公告)日：2002-10-01

申请号：US09612215

申请日：2000-07-07

申请人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo ,  Tetsuji Togawa

发明人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo ,  Tetsuji Togawa

IPC分类号： B24B4900

CPC分类号： B24B37/16 ,  B24B37/013 ,  B24B49/14 ,  B24B49/16 ,  B24B57/02

摘要： A polishing apparatus is used for polishing a surface of a workpiece such as a semiconductor wafer or a glass substrate. The polishing apparatus comprises a polishing table having a polishing surface thereon, a plurality of workpiece holders each for holding a workpiece and pressing the workpiece against the polishing surface, and a controller for controlling the workpiece holders individually so that polishing operations of the workpiece holders are controlled independently of each other.

摘要翻译： 抛光装置用于抛光诸如半导体晶片或玻璃基板的工件的表面。 抛光装置包括：抛光台，其上具有研磨面，多个工件保持件，每个工件保持件用于保持工件并将工件压靠在抛光表面上;以及控制器，其分别控制工件保持器，使得工件保持器的抛光操作 相互独立地控制。