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1.发明申请公开(公告)号：US20100081361A1
公开(公告)日：2010-04-01
申请号：US12566224
申请日：2009-09-24
CPC分类号： B24B53/017
摘要： A method of dressing a polishing member with a diamond dresser having diamond particles arranged on a surface thereof is provided. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the dressing conditions determined. The simulation includes calculation of the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.
摘要翻译： 提供了一种用金刚石修整器修整抛光构件的方法，其具有布置在其表面上的金刚石颗粒。 该方法包括通过对抛光构件的表面上的金刚石修整器的滑动距离的分布进行模拟来确定修整条件，以及在确定的修整条件下用金刚石修整器修整抛光构件。 模拟包括根据推入抛光构件的金刚石颗粒的深度校正的滑动距离的计算。
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2.发明授权Dressing method, method of determining dressing conditions, program for determining dressing conditions, and polishing apparatus 有权敷料方法，确定敷料条件的方法，确定敷料条件的程序和抛光装置公开(公告)号：US08655478B2
公开(公告)日：2014-02-18
申请号：US12566224
申请日：2009-09-24
CPC分类号： B24B53/017
摘要： A method dresses a polishing member with a diamond dresser having diamond particles arranged on a surface thereof. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the determined dressing conditions. The simulation includes calculating the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.
摘要翻译： 一种方法用抛光件与金刚石修整器连接，金刚石修整器具有布置在其表面上的金刚石颗粒。 该方法包括通过对抛光构件的表面上的金刚石修整器的滑动距离的分布的模拟进行模拟，以及在确定的修整条件下用金刚石修整器修整抛光构件来确定修整条件。 模拟包括计算根据推入抛光构件的金刚石颗粒的深度校正的滑动距离。
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公开(公告)号：US20070224916A1
公开(公告)日：2007-09-27
申请号：US11802353
申请日：2007-05-22
申请人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
发明人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
IPC分类号： B24B49/00
CPC分类号： B24B37/30 , B24B37/005 , B24B37/042 , B24B49/00
摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.
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公开(公告)号：US20070205112A1
公开(公告)日：2007-09-06
申请号：US11797480
申请日：2007-05-03
申请人： Masako Kodera , Yoshihiro Mochizuki , Akira Fukuda , Akira Kodera , Hirokuni Hiyama , Manabu Tsujimura , Kazuto Hirokawa , Akira Fukunaga
发明人： Masako Kodera , Yoshihiro Mochizuki , Akira Fukuda , Akira Kodera , Hirokuni Hiyama , Manabu Tsujimura , Kazuto Hirokawa , Akira Fukunaga
IPC分类号： B23H3/00
CPC分类号： B23H5/08 , B24B53/001 , B24B53/017 , C09G1/02 , C25F3/02 , C25F7/00 , H01L21/3212 , H01L21/32125 , H01L21/76814 , H01L21/76825 , H01L21/7684
摘要： A polishing apparatus (30) has a polishing surface (32), a top ring (36) for holding a wafer (W), motors (46, 56) to move the polishing surface (32) and the wafer (W) relative to each other at a relative speed, and a vertical movement mechanism (54) to press the wafer (W) against the polishing surface (32) under a pressing pressure. The polishing apparatus (30) also has a controller (44) to adjust a polishing condition in a non-Preston range in which a polishing rate is not proportional to a product of the pressing pressure and the relative speed. The polishing apparatus (30) can simultaneously achieve uniform supply of a chemical liquid to a surface of the wafer (W) and a uniform polishing rate within the surface of the wafer (W).
摘要翻译： 抛光装置（30）具有抛光面（32），用于保持晶片（W）的顶环（36），使抛光面（32）和晶片（W）相对于运动的电机（46,56）相对于 以及垂直移动机构（54），其在压制压力下将晶片（W）压靠在抛光表面（32）上。 抛光装置（30）还具有控制器（44），用于在抛光速率与按压压力与相对速度的乘积不成比例的非普雷斯顿范围内调节抛光状态。 抛光装置（30）可以同时实现向晶片（W）的表面均匀供应化学液体，并且在晶片表面（W）内均匀的研磨速率。
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公开(公告)号：US07234999B2
公开(公告)日：2007-06-26
申请号：US11599351
申请日：2006-11-15
申请人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
发明人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
CPC分类号： B24B37/30 , B24B37/005 , B24B37/042 , B24B49/00
摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.
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6.发明申请Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus 有权估算抛光轮廓或抛光量的方法，抛光方法和抛光装置公开(公告)号：US20070061036A1
公开(公告)日：2007-03-15
申请号：US11599351
申请日：2006-11-15
申请人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
发明人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
IPC分类号： G06F19/00
CPC分类号： B24B37/30 , B24B37/005 , B24B37/042 , B24B49/00
摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.
摘要翻译： 抛光方法可以根据抛光轮廓随着时间的变化的数据，根据研磨部件的状态自动复位抛光条件，从而延长抛光部件的使用寿命，并且以更高的精度获得抛光表面的平坦度。 抛光方法包括以下步骤：通过顶环的每个按压部分独立地施加所需的压力在抛光对象上; 基于设定压力值估计抛光对象的抛光轮廓，并且计算推荐的抛光压力值，使得在某些抛光条件下抛光抛光对象的抛光轮廓与期望的抛光轮廓之间的差异变小; 并用推荐的抛光压力值抛光抛光对象。
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公开(公告)号：US20070254558A1
公开(公告)日：2007-11-01
申请号：US11661141
申请日：2005-08-26
申请人： Masako Kodera , Yoshihiro Mochizuki , Akira Fukuda , Akira Kodera , Hirokuni Hiyama , Manabu Tsujimura , Kazuto Hirokawa , Akira Fukunaga
发明人： Masako Kodera , Yoshihiro Mochizuki , Akira Fukuda , Akira Kodera , Hirokuni Hiyama , Manabu Tsujimura , Kazuto Hirokawa , Akira Fukunaga
CPC分类号： H01L21/6708 , B24B37/005 , B24B37/042 , B24B37/046 , B24B49/006 , B24B57/02
摘要： A polishing apparatus (30) has a polishing surface (32), a top ring (36) for holding a wafer (W), motors (46, 56) to move the polishing surface (32) and the wafer (W) relative to each other at a relative speed, and a vertical movement mechanism (54) to press the wafer (W) against the polishing surface (32) under a pressing pressure. The polishing apparatus (30) also has a controller (44) to adjust a polishing condition in a non-Preston range in which a polishing rate is not proportional to a product of the pressing pressure and the relative speed. The polishing apparatus (30) can simultaneously achieve uniform supply of a chemical liquid to a surface of the wafer (W) and a uniform polishing rate within the surface of the wafer (W).
摘要翻译： 抛光装置（30）具有抛光面（32），用于保持晶片（W）的顶环（36），使抛光面（32）和晶片（W）相对于运动的电机（46,56）相对于 以及垂直移动机构（54），其在压制压力下将晶片（W）压靠在抛光表面（32）上。 抛光装置（30）还具有控制器（44），用于在抛光速率与按压压力与相对速度的乘积不成比例的非普雷斯顿范围内调节抛光状态。 抛光装置（30）可以同时实现向晶片（W）的表面均匀供应化学液体，并且在晶片表面（W）内均匀的研磨速率。
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8.发明授权Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus 有权估算抛光轮廓或抛光量的方法，抛光方法和抛光装置公开(公告)号：US07361076B2
公开(公告)日：2008-04-22
申请号：US11802353
申请日：2007-05-22
申请人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
发明人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
CPC分类号： B24B37/30 , B24B37/005 , B24B37/042 , B24B49/00
摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.
摘要翻译： 抛光方法可以根据抛光轮廓随着时间的变化的数据，根据研磨部件的状态自动复位抛光条件，从而延长抛光部件的使用寿命，并且以更高的精度获得抛光表面的平坦度。 抛光方法包括以下步骤：通过顶环的每个按压部分独立地施加所需的压力在抛光对象上; 基于设定压力值估计抛光对象的抛光轮廓，并且计算推荐的抛光压力值，使得在某些抛光条件下抛光抛光对象的抛光轮廓与期望的抛光轮廓之间的差异变小; 并用推荐的抛光压力值抛光抛光对象。
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9.发明授权Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus 有权估算抛光轮廓或抛光量的方法，抛光方法和抛光装置公开(公告)号：US07150673B2
公开(公告)日：2006-12-19
申请号：US11176184
申请日：2005-07-08
申请人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
发明人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
CPC分类号： B24B37/30 , B24B37/005 , B24B37/042 , B24B49/00
摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.
摘要翻译： 抛光方法可以根据抛光轮廓随着时间的变化的数据，根据研磨部件的状态自动复位抛光条件，从而延长抛光部件的使用寿命，并且以更高的精度获得抛光表面的平坦度。 抛光方法包括以下步骤：通过顶环的每个按压部分独立地施加所需的压力在抛光对象上; 基于设定压力值估计抛光对象的抛光轮廓，并且计算推荐的抛光压力值，使得在某些抛光条件下抛光抛光对象的抛光轮廓与期望的抛光轮廓之间的差异变小; 并用推荐的抛光压力值抛光抛光对象。
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10.发明申请Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus 有权估算抛光轮廓或抛光量的方法，抛光方法和抛光装置公开(公告)号：US20060009127A1
公开(公告)日：2006-01-12
申请号：US11176184
申请日：2005-07-08
申请人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
发明人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
IPC分类号： B24B49/00
CPC分类号： B24B37/30 , B24B37/005 , B24B37/042 , B24B49/00
摘要： A polishing method can automatically reset the polishing conditions according to the state of a polishing member based on data on the polishing profile changing with time, thereby extending the life of the polishing member and obtaining flatness of the polished surface with higher accuracy. The polishing method, including the steps of: independently applying a desired pressure by each of the pressing portions of the top ring on the polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that the difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.
摘要翻译： 抛光方法可以根据抛光轮廓随着时间的变化的数据，根据研磨部件的状态自动复位研磨条件，从而延长抛光部件的使用寿命，并且以更高的精度获得抛光表面的平坦度。 抛光方法，包括以下步骤：通过顶环的每个按压部分独立地施加所需的压力在抛光对象上; 基于设定的压力值估计抛光对象的抛光轮廓，并计算推荐的抛光压力值，使得抛光对象在一定的抛光条件下抛光的抛光轮廓与期望的抛光轮廓之间的差异变小; 并用推荐的抛光压力值抛光抛光对象。
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