公开(公告)号：US6102786A

公开(公告)日：2000-08-15

申请号：US234633

申请日：1999-01-21

申请人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

发明人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

IPC分类号： B24B37/005 ,  B24D13/14 ,  H01L21/304 ,  B24B29/02

CPC分类号： B24B37/26 ,  B24B37/042 ,  B24B37/24

摘要： A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projecting region is determined on the basis of an area in which the projecting region acts on the workpiece.

摘要翻译： 抛光装置包括：转盘，其具有安装在其上表面上的研磨布;以及顶环，其设置在所述转台上方，用于支撑待抛光的工件，并在预定压力下将所述工件压靠所述研磨布。 转盘和顶环彼此相对移动，用研磨布抛光由顶环支撑的工件的表面。 研磨布在其表面上具有突出区域，用于与研磨布的其它表面更加紧密地接触工件。 当突出区域与工件保持接触时，突出区域在转台的径向上具有比工件的直径更小的尺寸。 基于突出区域作用在工件上的区域来确定突出区域的位置。

公开(公告)号：USRE39262E1

公开(公告)日：2006-09-05

申请号：US09821046

申请日：2002-02-28

申请人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

发明人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

IPC分类号： B24B29/02

CPC分类号： B24B37/24

摘要： A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface regions of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projection region is determined on the basis of an area in which the projecting region acts on the workpiece.

摘要翻译： 抛光装置包括：转盘，其具有安装在其上表面上的研磨布;以及顶环，其设置在所述转台上方，用于支撑待抛光的工件，并在预定压力下将所述工件压靠所述研磨布。 转盘和顶环彼此相对移动，用研磨布抛光由顶环支撑的工件的表面。 研磨布在其表面上具有突出区域，用于与研磨布的其它表面区域更加紧密地接触工件。 当突出区域与工件保持接触时，突出区域在转台的径向上具有比工件的直径更小的尺寸。 基于突出区域作用在工件上的区域来确定投影区域的位置。

公开(公告)号：US5888126A

公开(公告)日：1999-03-30

申请号：US590836

申请日：1996-01-24

申请人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

发明人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

IPC分类号： B24B37/005 ,  B24D13/14 ,  H01L21/304 ,  B24B29/02

CPC分类号： B24B37/26 ,  B24B37/042 ,  B24B37/24

摘要： A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface regions of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projecting region is determined on the basis of an area in which the projecting region acts on the workpiece.

摘要翻译： 抛光装置包括：转盘，其具有安装在其上表面上的研磨布;以及顶环，其设置在所述转台上方，用于支撑待抛光的工件，并在预定压力下将所述工件压靠所述研磨布。 转盘和顶环彼此相对移动，用研磨布抛光由顶环支撑的工件的表面。 研磨布在其表面上具有突出区域，用于与研磨布的其它表面区域更加紧密地接触工件。 当突出区域与工件保持接触时，突出区域在转台的径向上具有比工件的直径更小的尺寸。 基于突出区域作用在工件上的区域来确定突出区域的位置。

公开(公告)号：US5882244A

公开(公告)日：1999-03-16

申请号：US967767

申请日：1997-11-10

申请人： Hirokuni Hiyama ,  Yutaka Wada ,  Tamami Takahashi

发明人： Hirokuni Hiyama ,  Yutaka Wada ,  Tamami Takahashi

IPC分类号： B24B37/00 ,  B24B37/013 ,  B24B37/015 ,  B24B49/14 ,  B24B49/00

CPC分类号： B24B37/015 ,  B24B49/14

摘要： A polishing apparatus makes it possible to accurately detect the temperature of a workpiece during polishing and to perform polishing end point determination on the basis of this detected temperature. The polishing apparatus polishes irregularities in a surface of a workpiece such as for example a semiconductor wafer to a flat and mirror-like finish. A top ring holding a semiconductor wafer is provided with a temperature sensor. Frictional heat generated in the semiconductor wafer by polishing is detected by the temperature sensor, and a polishing end point is determined on the basis of the detected temperature.

摘要翻译： 抛光装置使得可以精确地检测抛光期间工件的温度，并且基于该检测温度进行抛光终点确定。 抛光装置将诸如半导体晶片的工件的表面中的凹凸抛光到平坦的和镜面状的光洁度。 保持半导体晶片的顶环设置有温度传感器。 由温度传感器检测在半导体晶片中通过研磨产生的摩擦热，并且基于检测到的温度来确定研磨终点。

公开(公告)号：US09138854B2

公开(公告)日：2015-09-22

申请号：US12379983

申请日：2009-03-05

申请人： Kazuaki Maeda ,  Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa

发明人： Kazuaki Maeda ,  Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa

IPC分类号： B24B9/02 ,  B24B21/00 ,  B24B21/06 ,  B24B21/08 ,  B24B37/04

CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/06 ,  B24B21/08 ,  B24B37/04 ,  B24B41/06

摘要： A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.

公开(公告)号：US08506363B2

公开(公告)日：2013-08-13

申请号：US12654561

申请日：2009-12-23

申请人： Tamami Takahashi ,  Hiroaki Kusa ,  Masaya Seki

发明人： Tamami Takahashi ,  Hiroaki Kusa ,  Masaya Seki

IPC分类号： B24B29/02

CPC分类号： H01L21/68792 ,  B23Q3/088 ,  B24B37/30 ,  B24B41/068 ,  H01L21/6838 ,  H01L21/6875

摘要： A substrate holder is a mechanism for holding a substrate, to be polished, by vacuum suction. The substrate holder includes a substrate-holding stage having a suction surface for the substrate, and a fluid passage selectively coupled to a vacuum source and a fluid supply source. The suction surface has a plurality of closed sections surrounded by convexities, and the fluid passage includes a plurality of communication passages which are in fluid communication with the plurality of closed segments respectively and independently.

摘要翻译： 衬底保持器是用于通过真空抽吸来保持待抛光的衬底的机构。 衬底保持器包括具有用于衬底的吸入表面的衬底保持台和选择性​​地耦合到真空源和流体供应源的流体通道。 抽吸面具有由凸部包围的多个封闭部分，并且流体通道包括分别和独立地与多个封闭部分流体连通的多个连通通道。

公开(公告)号：US20110165825A1

公开(公告)日：2011-07-07

申请号：US12673294

申请日：2008-07-23

申请人： Norio Kimura ,  Kenya Ito ,  Tamami Takahashi ,  Masaya Seki

发明人： Norio Kimura ,  Kenya Ito ,  Tamami Takahashi ,  Masaya Seki

IPC分类号： B24B9/00

CPC分类号： B24B9/065

摘要： A polishing apparatus according to the present invention is a polishing apparatus for polishing a periphery (a bevel portion, a notch portion, an edge-cut portion) of a substrate (W) by bringing a polishing tool (41) into sliding contact with the periphery of the substrate. The polishing apparatus includes a substrate holder (20) configured to hold the substrate (W); and a polishing head (42) configured to polish the periphery of the substrate (W) held by the substrate holder (20) using the polishing tool (41). The polishing head (42) includes a press pad (50) for pressing the polishing tool (41) against the periphery of the substrate (W), and a linear motor (90) configured to reciprocate the press pad (50).

摘要翻译： 根据本发明的研磨装置是通过使研磨工具（41）与所述基板（W）滑动接触来研磨基板（W）的周边（斜面部，切口部，边缘切断部）的研磨装置 衬底周边。 抛光装置包括：基板保持架（20），其构造成保持基板（W）; 以及抛光头（42），其被配置为使用所述抛光工具（41）抛光由所述基板保持器（20）保持的所述基板（W）的周边。 抛光头（42）包括用于将抛光工具（41）压靠在基板（W）的周边上的压垫（50）和构造成使压垫（50）往复运动的直线电动机（90）。

公开(公告)号：US20090017730A1

公开(公告)日：2009-01-15

申请号：US11665001

申请日：2005-10-12

申请人： Takeo Kubota ,  Atsushi Shigeta ,  Gen Toyota ,  Tamami Takahashi ,  Daisaku Fukuoka ,  Kenya Ito

发明人： Takeo Kubota ,  Atsushi Shigeta ,  Gen Toyota ,  Tamami Takahashi ,  Daisaku Fukuoka ,  Kenya Ito

IPC分类号： B24B1/00 ,  B24B21/00

CPC分类号： H01L21/02021 ,  B24B9/065 ,  B24B21/002

摘要： A polishing apparatus has a polishing tape (21), a supply reel (22) for supplying the polishing tape (21) to a contact portion (30) at which the polishing tape (21) is brought into contact with a notch portion (11) of a substrate (10), and a take-up reel (23) for winding up the polishing tape (21) from the contact portion (30). The polishing apparatus also has a first guide portion (24) having as guide surface (241) for supplying the polishing tape (21) directly to the contact portion (30), and a second guide portion (25) having a guide surface for supplying the polishing tape (21) tot the take-up reel (23). The guide surface (241) of the first guide portion (24) and/or the guide surface of the second guide portion (25) has a shape corresponding to a shape of the notch portion (11) of the substrate (10).

摘要翻译： 抛光装置具有研磨带（21），用于将研磨带（21）供给到研磨带（21）与切口部（11）接触的接触部（30）的供带盘（22） ）和用于从所述接触部分（30）卷绕所述研磨带（21）的卷取卷轴（23）。 抛光装置还具有第一引导部分（24），其具有用于将研磨带（21）直接供应到接触部分（30）的引导表面（241），以及具有引导表面的第二引导部分（25） 研磨带（21）卷绕在卷取卷轴（23）上。 第一引导部（24）的引导面（241）和/或第二引导部（25）的引导面具有与基板（10）的切口部（11）的形状对应的形状。

公开(公告)号：US06453773B1

公开(公告)日：2002-09-24

申请号：US09584078

申请日：2000-06-01

申请人： Yoshihiro Mochizuki ,  Chishiro Yamashina ,  Tamami Takahashi ,  Shimpei Miyakawa ,  JPX Mammoto ,  Ryuji Kodama

发明人： Yoshihiro Mochizuki ,  Chishiro Yamashina ,  Tamami Takahashi ,  Shimpei Miyakawa ,  JPX Mammoto ,  Ryuji Kodama

IPC分类号： B23B2924

CPC分类号： B23Q16/025 ,  B23Q39/044 ,  Y10T74/1476 ,  Y10T74/1488

摘要： An elevation and index apparatus of a water hydraulic driven type has a rotary table (5) supported pivotally by a cross roller bearing (15), a water hydraulic motor (9) and a water hydraulic cylinder (8), each fixed to a table base (14) supporting a power transmission mechanism and the cross roller bearing (15), a main elevation shaft (7) connected to an output shaft of the water hydraulic cylinder (8), an elevation and index table (1) connected to the main elevation shaft (7) through a bearing (7a) and connected to the rotary table (5) so as to restrict pivotal movement, and a casing (18) disposed outside the table base (14) and enclosing the power transmission mechanism.

摘要翻译： 水压驱动式的升降装置具有由交叉滚子轴承（15），水力电动机（9）和水压缸（8）枢转支撑的旋转台（5），每个固定在工作台 支撑动力传递机构的基座（14）和交叉滚子轴承（15），与水压缸（8）的输出轴连接的主仰角轴（7），与 通过轴承（7a）连接到旋转台（5）上以限制枢转运动的主高程轴（7）和设置在工作台基座（14）外部并包围动力传递机构的壳体（18）。

公开(公告)号：US5985090A

公开(公告)日：1999-11-16

申请号：US650144

申请日：1996-05-17

申请人： Ritsuo Kikuta ,  Fujio Aoyama ,  Koji Kato ,  Tamami Takahashi

发明人： Ritsuo Kikuta ,  Fujio Aoyama ,  Koji Kato ,  Tamami Takahashi

IPC分类号： B24B37/20 ,  B24B37/24 ,  B24B41/047 ,  B24D7/14 ,  B24D13/14 ,  H01L21/304 ,  C23F1/02 ,  B44C1/22

CPC分类号： B24B37/24 ,  B24B37/26

摘要： A polishing cloth mounted on a turntable of a polishing apparatus and a polishing apparatus having such a polishing cloth for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing cloth comprises a first elastic region contacting the surface of the workpiece and having a certain elastic modulus, and a second elastic region contacting the surface of the workpiece and having an elastic modulus different from the first elastic region. The second elastic region is surrounded by the first elastic region and has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the second elastic region is held in contact with the workpiece. The position of the second elastic region is determined on the basis of an area in which the second elastic region acts on the workpiece.

摘要翻译： 一种安装在抛光装置的转盘上的抛光布和具有用于将诸如半导体晶片的工件抛光到平面镜面的抛光布的抛光装置。 抛光布包括与工件的表面接触并具有一定弹性模量的第一弹性区域和与工件的表面接触并具有与第一弹性区域不同的弹性模量的第二弹性区域。 第二弹性区域被第一弹性区域围绕，并且当第二弹性区域保持与工件接触时，在转台的径向上具有比工件的直径更小的尺寸。 第二弹性区域的位置基于第二弹性区域作用在工件上的面积来确定。