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公开(公告)号：US20110155504A1
公开(公告)日：2011-06-30
申请号：US13044133
申请日：2011-03-09
申请人： YOSUKE TANABE , Masanori Watanabe , Akira Goto , Shigeyasu Tsubaki , Masahiko Usui , Akio Idei
发明人： YOSUKE TANABE , Masanori Watanabe , Akira Goto , Shigeyasu Tsubaki , Masahiko Usui , Akio Idei
IPC分类号： E04F17/04
CPC分类号： G10K11/172 , H05K7/20718
摘要： Silencing equipment provided with one or more flow channels through which cooling air flows has a flow channel forming member that forms the flow channel, and an acoustic absorbent member that is fixed to the flow channel forming member. A resonance type silencer is formed on a wall surface of the flow channel by providing a cavity for the resonance type silencer in the acoustic absorbent member and an aperture for the resonance type silencer in a portion of the flow channel forming member. The resonance type silencer sets a frequency of noise necessary to be reduced based on a peak frequency of noise generated by a fan. The silencing equipment further has a slide member which slides by a slide mechanism to adjust the area of the top of the aperture. The silencing equipment for electronic devices capable of cooling heat generating sections thereof with air has a small and simple structure and can improve a silencing effect by blowing air.
摘要翻译： 设置有冷却空气流过的一个或多个流动通道的沉降设备具有形成流路的流路形成部件，以及固定在流路形成部件上的吸声部件。 通过在吸声部件中设置共振型消音器的空腔，在流路形成部件的一部分设置共振型消音器的开口，在流路的壁面上形成共振型消音器。 谐振型消声器基于由风扇产生的噪声的峰值频率来设定需要减小的噪声频率。 消音装置还具有滑动构件，滑动构件通过滑动机构滑动以调节孔的顶部的面积。 能够用空气冷却发热部的电子设备的消音装置结构简单，结构简单，能够通过吹送空气来提高消音效果。
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公开(公告)号：US20100187037A1
公开(公告)日：2010-07-29
申请号：US12752781
申请日：2010-04-01
申请人： Akira Goto , Akio Idei , Shigeyasu Tsubaki
发明人： Akira Goto , Akio Idei , Shigeyasu Tsubaki
摘要： In order to provide sound absorbing structure capable of reducing the noise of electronic equipment while maintaining the cooling capability of the electronic equipment, there is provided sound absorbing structure in which a plurality of penetrating openings are provided by arranging a plurality of acoustic materials having a predetermined shape at predetermined intervals in a flow channel of cooling fluid from a blower, and the plurality of acoustic materials are arranged so that the sound vertically incident on a penetrating plane of the penetrating openings from the blower does not directly go out of the electronic equipment.
摘要翻译： 为了提供能够在保持电子设备的冷却能力的同时降低电子设备的噪音的吸声结构，提供了一种吸声结构，其中通过布置多个具有预定的 在来自鼓风机的冷却流体的流动通道中以预定间隔形状，并且布置多个声学材料，使得垂直入射在来自鼓风机的穿透开口的穿透平面上的声音不会直接离开电子设备。
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公开(公告)号：US08485310B2
公开(公告)日：2013-07-16
申请号：US13044133
申请日：2011-03-09
申请人： Yosuke Tanabe , Masanori Watanabe , Akira Goto , Shigeyasu Tsubaki , Masahiko Usui , Akio Idei
发明人： Yosuke Tanabe , Masanori Watanabe , Akira Goto , Shigeyasu Tsubaki , Masahiko Usui , Akio Idei
CPC分类号： G10K11/172 , H05K7/20718
摘要： Silencing equipment provided with one or more flow channels through which cooling air flows has a flow channel forming member that forms the flow channel, and an acoustic absorbent member that is fixed to the flow channel forming member. A resonance type silencer is formed on a wall surface of the flow channel by providing a cavity for the resonance type silencer in the acoustic absorbent member and an aperture for the resonance type silencer in a portion of the flow channel forming member. The resonance type silencer sets a frequency of noise necessary to be reduced based on a peak frequency of noise generated by a fan. The silencing equipment further has a slide member which slides by a slide mechanism to adjust the area of the top of the aperture. The silencing equipment for electronic devices capable of cooling heat generating sections thereof with air has a small and simple structure and can improve a silencing effect by blowing air.
摘要翻译： 设置有冷却空气流过的一个或多个流动通道的沉降设备具有形成流路的流路形成部件，以及固定在流路形成部件上的吸声部件。 通过在吸声部件中设置共振型消音器的空腔，在流路形成部件的一部分设置共振型消音器的开口，在流路的壁面上形成共振型消音器。 谐振型消声器基于由风扇产生的噪声的峰值频率来设定需要减小的噪声频率。 消音装置还具有滑动构件，滑动构件通过滑动机构滑动以调节孔的顶部的面积。 能够用空气冷却发热部的电子设备的消音装置结构简单，结构简单，能够通过吹送空气来提高消音效果。
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公开(公告)号：US20120138285A1
公开(公告)日：2012-06-07
申请号：US13307476
申请日：2011-11-30
申请人： Shigeyasu Tsubaki , Akio Idei
发明人： Shigeyasu Tsubaki , Akio Idei
CPC分类号： H05K7/20781
摘要： An electronic apparatus rack which can prevent the degradation of cooling performance due to local heat concentration on the exhaust side of the server. The electronic apparatus rack having electronic apparatuses mounted thereon, consists of a radiator incorporated in the rear door of the electronic apparatus rack; plural fans installed on the exhaust side of the radiator; and plural heat pipes installed on the intake side of the radiator.
摘要翻译： 一种电子设备架，其能够防止由于服务器的排气侧的局部热集中而引起的冷却性能的劣化。 安装有电子设备的电子设备机架由装在电子设备机架的后门中的散热器组成; 多个风扇安装在散热器的排气侧; 以及安装在散热器的吸入侧的多个热管。
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公开(公告)号：US08074765B2
公开(公告)日：2011-12-13
申请号：US12752781
申请日：2010-04-01
申请人： Akira Goto , Akio Idei , Shigeyasu Tsubaki
发明人： Akira Goto , Akio Idei , Shigeyasu Tsubaki
摘要： In order to provide sound absorbing structure capable of reducing the noise of electronic equipment while maintaining the cooling capability of the electronic equipment, there is provided sound absorbing structure in which a plurality of penetrating openings are provided by arranging a plurality of acoustic materials having a predetermined shape at predetermined intervals in a flow channel of cooling fluid from a blower, and the plurality of acoustic materials are arranged so that the sound vertically incident on a penetrating plane of the penetrating openings from the blower does not directly go out of the electronic equipment.
摘要翻译： 为了提供能够在保持电子设备的冷却能力的同时降低电子设备的噪音的吸声结构，提供了一种吸声结构，其中通过布置多个具有预定的 在来自鼓风机的冷却流体的流动通道中以预定间隔形状，并且布置多个声学材料，使得垂直入射在来自鼓风机的穿透开口的穿透平面上的声音不会直接离开电子设备。
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公开(公告)号：US20100078258A1
公开(公告)日：2010-04-01
申请号：US12536598
申请日：2009-08-06
申请人： Yosuke TANABE , Masanori Watanabe , Akira Goto , Shigeyasu Tsubaki , Masahiko Usui , Akio Idei
发明人： Yosuke TANABE , Masanori Watanabe , Akira Goto , Shigeyasu Tsubaki , Masahiko Usui , Akio Idei
IPC分类号： G10K11/172 , E04F17/04
CPC分类号： G10K11/172 , H05K7/20718
摘要： Silencing equipment provided with one or more flow channels through which cooling air flows has a flow channel forming member that forms the flow channel, and an acoustic absorbent member that is fixed to the flow channel forming member. A resonance type silencer is formed on a wall surface of the flow channel by providing a cavity for the resonance type silencer in the acoustic absorbent member and an aperture for the resonance type silencer in a portion of the flow channel forming member. The resonance type silencer sets a frequency of noise necessary to be reduced based on a peak frequency of noise generated by a fan. The silencing equipment further has a slide member which slides by a slide mechanism to adjust the area of the top of the aperture. The silencing equipment for electronic devices capable of cooling heat generating sections thereof with air has a small and simple structure and can improve a silencing effect by blowing air.
摘要翻译： 设置有冷却空气流过的一个或多个流动通道的沉降设备具有形成流路的流路形成部件，以及固定在流路形成部件上的吸声部件。 通过在吸声部件中设置共振型消音器的空腔，在流路形成部件的一部分设置共振型消音器的开口，在流路的壁面上形成共振型消音器。 谐振型消声器基于由风扇产生的噪声的峰值频率来设定需要减小的噪声频率。 消音装置还具有滑动构件，滑动构件通过滑动机构滑动以调节孔的顶部的面积。 能够用空气冷却发热部的电子设备的消音装置结构简单，结构简单，能够通过吹送空气来提高消音效果。
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公开(公告)号：US5959351A
公开(公告)日：1999-09-28
申请号：US103227
申请日：1993-08-09
申请人： Shigeyuki Sasaki , Tadakatsu Nakajima , Noriyuki Ashiwake , Yasuo Ohsone , Toshio Hatada , Toshiki Iino , Akio Idei , Kenichi Kasai
发明人： Shigeyuki Sasaki , Tadakatsu Nakajima , Noriyuki Ashiwake , Yasuo Ohsone , Toshio Hatada , Toshiki Iino , Akio Idei , Kenichi Kasai
IPC分类号： H01L23/44 , F15D1/08 , H01L23/427 , H01L23/473 , H01L23/34
CPC分类号： F15D1/08 , H01L23/473 , F28F13/02 , H01L2924/0002
摘要： There is disclosed a liquid-cooled electronic device. Semiconductor devices are mounted on a substrate of a semiconductor module immersed in a cooling liquid. A wire-like member is provided in the vicinity of a cooling medium ejection port of each cooling medium supply member which cools a respective one of the semiconductor devices by a jet of the cooling liquid. With this arrangement, the flow of the cooling liquid downstream of the wire-like member is disturbed to promote the boiling over the entire surface of the semiconductor device, and when the semiconductor device is to be cooled, a transient temperature rise is reduced at the time of starting the energization of the semiconductor device, thereby stabilizing the temperature of the semiconductor device.
摘要翻译： 公开了一种液冷电子装置。 半导体器件安装在浸没在冷却液中的半导体模块的衬底上。 在各冷却介质供给部件的冷却介质喷出口附近设置有线状部件，冷却介质供给部件通过冷却液喷射冷却各个半导体器件。 通过这种布置，线状构件下游的冷却液的流动受到干扰，促使半导体装置的整个表面沸腾，并且当半导体装置被冷却时，瞬态温度上升在 开始半导体器件通电的时间，从而稳定半导体器件的温度。
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18.发明授权
公开(公告)号：US5406807A
公开(公告)日：1995-04-18
申请号：US77109
申请日：1993-06-16
申请人： Noriyuki Ashiwake , Tadakatsu Nakajima , Shigeyuki Sasaki , Yasuo Ohsone , Toshio Hatada , Toshiki Iino , Kenichi Kasai , Akio Idei
发明人： Noriyuki Ashiwake , Tadakatsu Nakajima , Shigeyuki Sasaki , Yasuo Ohsone , Toshio Hatada , Toshiki Iino , Kenichi Kasai , Akio Idei
IPC分类号： H01L23/427 , F25D17/02
CPC分类号： H01L23/427 , H01L2924/0002 , Y10S165/908
摘要： An apparatus for cooling semiconductor devices includes a module for cooling semiconductor devices; a refrigerant cooling device for receiving via an outlet pipe the refrigerant discharged through an outlet port of the module to cool the refrigerant; a refrigerant circulation pump for receiving, via a suction pipe, the refrigerant cooled by the refrigerant cooling device and sending the refrigerant to the module via an inlet pipe; and a refrigerant-flow stabilizing mechanism for stabilizing a refrigerant circulation flow discharged from the refrigerant circulation pump to be returned to the refrigerant circulation pump via the module and the refrigerant cooling device. Since the refrigerant-flow stabilizing mechanism stabilize the refrigerant flow, the refrigerant flow can be stably circulated so that the semiconductor devices in the module are stably cooled.
摘要翻译： 一种用于冷却半导体器件的设备包括用于冷却半导体器件的模块; 制冷剂冷却装置，用于经由出口管接收通过模块的出口排出的制冷剂以冷却制冷剂; 制冷剂循环泵，其经由吸入管接收由所述制冷剂冷却装置冷却的制冷剂，并且经由入口管将所述制冷剂输送到所述组件; 以及制冷剂流量稳定机构，其使从制冷剂循环泵排出的制冷剂循环流量稳定化，经由模块和制冷剂冷却装置返回到制冷剂循环泵。 由于制冷剂流动稳定机构使制冷剂流动稳定，所以可以稳定地循环制冷剂流，使得模块中的半导体器件稳定地冷却。
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公开(公告)号：US20120312504A1
公开(公告)日：2012-12-13
申请号：US13494461
申请日：2012-06-12
申请人： Kazuaki Suzuki , Shigemasa Sato , Akio Idei
发明人： Kazuaki Suzuki , Shigemasa Sato , Akio Idei
CPC分类号： H05K1/0201 , F25B39/04 , F28D15/0266 , F28D15/046 , F28F13/187 , H01L23/427 , H01L2924/0002 , H05K7/20318 , H01L2924/00
摘要： A boiling refrigerant type cooling system to suppress overshoot upon start of heat generation and realize stable start of boiling. In the boiling refrigerant type cooling system, a metal boiling heat transfer unit has a base in thermal contact with a heat generating body. The boiling heat transfer unit is in contact with a liquid refrigerant. The boiling heat transfer unit has plural parallel tunnels communicating with the outside via holes or gaps under its surface, a groove deeper than a tunnel diameter formed through all the tunnels in an orthogonal direction to the tunnels, and a cover plate on the groove.
摘要翻译： 沸腾的制冷剂型冷却系统，在发热开始时抑制过冲，实现稳定的沸腾开始。 在沸腾制冷剂型冷却系统中，金属沸腾传热单元具有与发热体热接触的基部。 沸腾传热单元与液体制冷剂接触。 沸腾传热单元具有多个平行的隧道，其与其外表面上的通孔或间隙连通，比通过所有隧道在与隧道正交的方向上形成的隧道直径更深的沟槽以及沟槽上的盖板。
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公开(公告)号：US20060227515A1
公开(公告)日：2006-10-12
申请号：US11368055
申请日：2006-03-02
申请人： Takafumi Enami , Akio Idei , Shigemasa Sato , Chikakazu Ninomiya
发明人： Takafumi Enami , Akio Idei , Shigemasa Sato , Chikakazu Ninomiya
IPC分类号： H05K7/20
CPC分类号： H01L23/4338 , H01L23/427 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/12044 , H01L2224/0401
摘要： A cooling apparatus for cooling a plurality of electronic devices each having a large heating value and a small area, capable of effectively cooling the semiconductor chips with the use of a single cooler, comprises a plurality of thermal conductors mounted on the electronic devices and formed with thermal conductive fins, a housing formed with fins fitted with the fins of the thermal conductors, and a cooling device mounted on the housing, for removing heat from the electronic devices, wherein the housing is formed therein with a plane heat-pipe.
摘要翻译： 一种用于冷却具有大的热值和小面积的多个电子装置的冷却装置，其能够使用单个冷却器有效地冷却半导体芯片，包括安装在电子装置上并形成有多个热导体的多个热导体 导热翅片，形成有装配有热导体的翅片的翅片的壳体，以及安装在壳体上的用于从电子设备移除热量的冷却装置，其中壳体在其中形成有平面热管。
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