Abstract:
A NAND type flash memory includes first to third memory cell transistors having current paths connected in series between one end of a current path of each of first and second selection transistors, and each having a control gate and a charge storage layer, the first and second memory cell transistors being adjacent to the first and second selection transistors, the third memory cell transistor being positioned between the first and second memory cell transistors, the third memory cell transistor holding data having not less than three bits, the first memory cell transistor holding 2-bit data in which middle and upper pages is written by skipping a lower page, and a lower page verify voltage being set when writing the middle page, and a middle page verify voltage is set when writing the upper page, changing a position of a threshold distribution of the first memory cell transistor.
Abstract:
A nonvolatile semiconductor memory device includes a nonvolatile memory which includes a block having a plurality of memory cell groups, each of the memory cell groups being electrically connected to a plurality of bit lines and electrically connected to a common word line, each memory cell being recordable of a plurality of bits, a first register which stores information obtained by correcting first data to be written to a first word line, and a control circuit which sets a set potential in the first register and writes the bits to a write target first memory cell at a time using the information in the first register, the set potential being obtained by subtracting, from a target potential to be finally set in the first memory cell, a potential increase which is generated by setting a potential in an unwritten second memory cell adjacent to the first memory cell.
Abstract:
The non-volatile semiconductor memory device has a circuit which maintains and holds the potentials of bit lines, and either ones of even-bit lines or odd-bit lines are connected to the circuit. When the bit line potential holding circuit is connected to even-bit lines and a block copy is performed, data is first outputted to the even-bit lines, and after the potential of the even-bit line is determined, the bit line potential holding circuit operates. Then, biasing of the potential of the even-bit lines is carried out by the bit line potential holding circuit, the potentials of the bit lines are maintained and held. At the same time, data is outputted to the odd-bit lines and the potentials of the odd-bit lines are determined. Then, a program voltage is supplied to a selected word line, and data is simultaneously written (programmed) in the memory cells connected to the even-bit lines, and the memory cells connected to the odd-bit lines.
Abstract:
A memory system includes a memory cell array, a bit line switch, first and second page buffers, a column switch, an error correction circuit, and control circuits. The second page buffer can swap data with the first page buffer. The control circuits controls the bit line switch and the first and second page buffers, sequentially reads, page by page, one or more pages from the mth (m is a positive integer) page to the nth (n is an integer greater than m) page of the first block in the memory cell array, controls the error correction circuit to perform error correction calculation by the error correction circuit, controls the first and second data buffers and the bit line switch, and controls to perform write in the second block in the erase state in the memory cell array.
Abstract:
A semiconductor memory device including: a cell array with electrically rewritable and non-volatile memory cells arranged therein; a sense amplifier circuit configured to read data of and write data into the cell array; and a controller configured to control read, write and erase of the cell array, wherein the controller executes an erase sequence for erasing a selected block in the cell array in response to erase command and address input in such a way of: executing a first erase-verify operation for verifying an erase state of the selected block; ending the erase sequence if the erase state of the selected block has been verified by the first erase-verify operation; whereas executing an erase operation for the selected block if the erase state has not been verified.
Abstract:
A semiconductor integrated circuit device comprises several blocks including a word line connected with a memory cell, a row decoder selecting the word line, and a block decoder selecting the block. The block decoder includes a logical address register holding logical block address corresponding to the several blocks and a block status register holding a block status. The block decoder selects a block in which input block address and input block status match with held logical block address and held block status, respectively.
Abstract:
A memory system includes a memory cell array, a bit line switch, first and second page buffers, a column switch, an error correction circuit, and control circuits. The second page buffer can swap data with the first page buffer. The control circuits controls the bit line switch and the first and second page buffers, sequentially reads, page by page, one or more pages from the mth (m is a positive integer) page to the nth (n is an integer greater than m) page of the first block in the memory cell array, controls the error correction circuit to perform error correction calculation by the error correction circuit, controls the first and second data buffers and the bit line switch, and controls to perform write in the second block in the erase state in the memory cell array.
Abstract:
A non-volatile semiconductor memory device includes: a cell array having electrically rewritable and non-volatile memory cells arranged therein; and a sense amplifier circuit configured to detect voltage change of a bit line in the cell array, thereby reading data of a selected memory cell coupled to the bit line, wherein the sense amplifier circuit is controlled to read data at plural timings within a period in which the bit line voltage is changing in correspondence with the selected memory cell, and compare data read out by successive two data read operations with each other so as to judge a threshold margin of the selected memory cell.
Abstract:
A semiconductor integrated circuit device includes first to fourth bit lines and a redundant bit line, first to fourth column gate transistors and a redundant column gate transistor coupled to each of the first to fourth bit lines and the redundant bit lines, first to fourth column select lines and a redundant column select line coupled to each of the first to fourth column gate transistors and the redundant column gate transistor. The second column select line passes through the first bit line. The third column select line passes through the first and second bit lines. The fourth column select line passes through the first, second and third bit lines. The redundant column select line passes through the first, second, third and fourth bit lines.
Abstract:
A non-volatile semiconductor memory device according to the invention comprises a memory cell array having a plurality of non-volatile memory cells, and a write state machine controlling a voltage applied to a memory cell selected from the memory cell array and a voltage application period, in accordance with each of reading of data from the selected memory cell, writing of data into the selected memory cell, and erasion of data from the selected memory. The write state machine executes writing, under a first writing condition, on a predetermined number of memory cells included in the memory cell array, and executes writing on memory cells other than the predetermined number of memory cells, under a second writing condition set in accordance with a result of the writing executed under the first writing condition.