Abstract:
A magnetic and thermally conductive material is provided, which includes a thermally conductive compound powder, and an iron-containing oxide at a surface of the thermally conductive compound powder, wherein the iron-containing oxide is an oxide of iron with an other metal, and the other metal is nickel, zinc, copper, cobalt, magnesium, manganese, yttrium, lithium, aluminum, or a combination thereof. A thermally conductive and dielectric layer is also provided, which includes a magnetic and thermally conductive material and a resin, wherein the thermally conductive material includes a thermally conductive compound powder, and an iron-containing oxide at a surface of the thermally conductive compound powder, wherein the iron-containing oxide is an oxide of iron with an other metal, and the other metal is nickel, zinc, copper, cobalt, magnesium, manganese, yttrium, lithium, aluminum, or a combination thereof.
Abstract:
A copolymer, a film composition and a composite material employing the same are provided. The copolymer is a copolymerization product of a composition, wherein the composition includes a monomer (a), a monomer (b) and a monomer (c). The monomer (a) is a compound having a structure represented by Formula (I), the monomer (b) is a compound having a structure represented by Formula (II), and the monomer (c) is a compound having a structure represented by Formula (III) wherein R1, R2, R3, R4, R5 and R6 are as defined in specification.
Abstract:
A polymer and a resin composition thereof are provided. The polymer includes a first repeat unit represented by Formula (I) and a second repeat unit represented by Formula (II) wherein A1 is C24-48 alkylene, C24-48 alkenylene, C24-48 alkynylene, C24-48 alicyclic alkylene, C24-48 alicyclic alkenylene, or C24-48 alicyclic alkynylene. A2 and A4, independently having at least one reactive group, are independently C6-25 arylene, C4-8 cycloalkylene, C5-25 heteroarylene, divalent C7-25 alkylaryl, divalent C7-25 acylaryl, divalent C6-25 aryl ether, divalent C7-25 acyloxyaryl, or divalent C6-25 sulfonylaryl; and, A3 is substituted or unsubstituted C6-25 arylene, C4-8 cycloalkylene, C5-25 heteroarylene, divalent C7-25 alkylaryl, divalent C7-25 acylaryl, divalent C6-25 aryl ether, divalent C7-25 acyloxyaryl, or divalent C6-25 sulfonylaryl.
Abstract:
A composition, an insulating material, and a method for preparing an insulating material are provided. The composition includes (a) 100 parts by weight of oligomer of Formula (I) (b) 20-50 parts by weight of polymer having at least two reactive functional groups, wherein the reactive functional group is a reactive-double-bond-containing functional group; (c) 1-5 parts by weight of photoinitiator; (d) 0.5-2 parts by weight of thermal initiator; and (e) 0.5-2 parts by weight of photoacid generator.
Abstract:
A solventless resin composition with a low dielectric constant and a substrate structure are provided. The composition includes: (a) 20-50 parts by weight of a copolymer having the structure of Formula (I) wherein, i, j, k, l, and m are independently an integer from 1 to 10; (b) 50-80 parts by weight of a compound having the structure of Formula (II) (c) 80-100 parts by weight of a hardener; and (d) 70-100 parts by weight of an inorganic filler.
Abstract:
An aqueous-phase catalyst composition including a metal ion including copper, nickel, manganese or iron and a water-soluble linear polymer having a molecular weight ranging from 1,000 to 20,000 is provided. The metal ion and the water-soluble linear polymer have a weight ratio of 1:1 to 1:5. A method for preparing polyphenylene ether including providing the disclosed aqueous-phase catalyst composition and adding phenolic monomers to the aqueous-phase catalyst composition to proceed to a polymerization reaction to prepare polyphenylene ether is also provided.