公开(公告)号：US20180179424A1

公开(公告)日：2018-06-28

申请号：US15656652

申请日：2017-07-21

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Jyh-Long JENG ,  Jeng-Yu TSAI ,  Hsi-Yi CHIN ,  Wei-Ta YANG

IPC: C09J171/12 ,  C09J153/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  B32B7/12 ,  B32B15/08

CPC classification number: C09J171/12 ,  B32B7/12 ,  B32B15/08 ,  B32B2457/08 ,  C08F283/06 ,  C08F287/00 ,  C08F290/062 ,  C08G59/5073 ,  C09J151/085 ,  C09J153/00 ,  C09J153/005 ,  H05K1/028 ,  H05K1/032 ,  H05K1/0393 ,  H05K1/09 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0141 ,  C08L53/02 ,  C08L63/00 ,  C08F220/40

Abstract: An adhesive composition and a composite substrate employing the same are provided. The adhesive composition includes a compound having a structure represented by Formula (I) (Z—Y3X  Formula (I) , wherein X is R can be hydrogen, or C1-6 alkyl group; each Y can be independently a moiety polymerized by at least two different phenol-based compounds; and each Z can be independently hydrogen, acryloyl group, allyl group, vinylbenzyl group, epoxypropyl group, methylacryloyl group, propargyl group, or cyanoallyl group; a thermoplastic elastomer; an epoxy resin; and a bismaleimide.

公开(公告)号：US20220204442A1

公开(公告)日：2022-06-30

申请号：US17138254

申请日：2020-12-30

Applicant: Industrial Technology Research Institute

Inventor： Jyh-Long JENG ,  Jeng-Yu TSAI ,  Wei-Ta YANG

IPC: C07C271/58 ,  C08G18/34 ,  C08G18/78

Abstract: A compound, a resin composition and a laminated substrate thereof are provided. The compound has a structure represented by Formula (I) wherein A1 is C24-48 alkylene group, C24-48 alkenylene group, C24-48 alkynylene group, C24-48 alicyclic alkylene group, C24-48 alicyclic alkenylene group, or C24-48 alicyclic alkynylene group. A2 is C2-12 alkylene group, C6-C25 arylene group with two reactive groups, C4-8 cycloalkylene group, C5-25 heteroarylene group, divalent C7-C25 alkylaryl group, divalent C7-25 acylaryl group, divalent C6-25 aryl ether group, or divalent C7-25 acyloxyaryl group; and, n≥1.

公开(公告)号：US20230101144A1

公开(公告)日：2023-03-30

申请号：US17888269

申请日：2022-08-15

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yi-Syuan WANG ,  Jeng-Yu TSAI ,  Chi-En KUAN ,  Jyh-Long JENG ,  Chih-Ming HU ,  Chen-Hsi CHENG

IPC: C08G73/10 ,  C08J5/18 ,  C07D307/89

Abstract: An anhydride compound, polyimide, and thin film are provided. The anhydride compound has a chemical structure of wherein R1 is each of R4 is independently C1-6 alkylene group, m is an integer of 0 to 10, and m′ is an integer of 1 to 10; n is an integer of 1 to 10, each of R2 is independently hydrogen, saturated or unsaturated C1-6 hydrocarbon group, CF3, silanol group, silyl group, or Al(OH)3; and R3 is silanol group, silyl group, or Al(OH)3. The anhydride compound can be reacted with a diamine compound to form a polyimide.

公开(公告)号：US20220204697A1

公开(公告)日：2022-06-30

申请号：US17139088

申请日：2020-12-31

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Jyh-Long JENG ,  Jeng-Yu TSAI ,  Wei-Ta YANG

IPC: C08G73/10 ,  G03F7/038 ,  G03F7/028

Abstract: A polymer and a resin composition thereof are provided. The polymer includes a first repeat unit represented by Formula (I) and a second repeat unit represented by Formula (II) wherein A1 is C24-48 alkylene, C24-48 alkenylene, C24-48 alkynylene, C24-48 alicyclic alkylene, C24-48 alicyclic alkenylene, or C24-48 alicyclic alkynylene. A2 and A4, independently having at least one reactive group, are independently C6-25 arylene, C4-8 cycloalkylene, C5-25 heteroarylene, divalent C7-25 alkylaryl, divalent C7-25 acylaryl, divalent C6-25 aryl ether, divalent C7-25 acyloxyaryl, or divalent C6-25 sulfonylaryl; and, A3 is substituted or unsubstituted C6-25 arylene, C4-8 cycloalkylene, C5-25 heteroarylene, divalent C7-25 alkylaryl, divalent C7-25 acylaryl, divalent C6-25 aryl ether, divalent C7-25 acyloxyaryl, or divalent C6-25 sulfonylaryl.

公开(公告)号：US20190203067A1

公开(公告)日：2019-07-04

申请号：US16232766

申请日：2018-12-26

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Jyh-Long JENG ,  Jeng-Yu TSAI ,  Yen-Yi CHU ,  Wei-Ta YANG

IPC: C09D145/00 ,  C09D4/06 ,  H01B3/44

CPC classification number: C09D145/00 ,  C09D4/06 ,  H01B3/441 ,  H01B3/447 ,  H01B3/448

Abstract: A composition, an insulating material, and a method for preparing an insulating material are provided. The composition includes (a) 100 parts by weight of oligomer of Formula (I) (b) 20-50 parts by weight of polymer having at least two reactive functional groups, wherein the reactive functional group is a reactive-double-bond-containing functional group; (c) 1-5 parts by weight of photoinitiator; (d) 0.5-2 parts by weight of thermal initiator; and (e) 0.5-2 parts by weight of photoacid generator.

公开(公告)号：US20170174880A1

公开(公告)日：2017-06-22

申请号：US14974547

申请日：2015-12-18

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Jyh-Long JENG ,  Jeng-Yu TSAI ,  Wei-Ta YANG

IPC: C08L63/10 ,  H01B3/40 ,  C08G59/14 ,  C08K3/36 ,  C08K5/1515

CPC classification number: C08L63/10 ,  C08G59/1433 ,  C08G59/24 ,  C08K3/36 ,  C08K5/1515 ,  C08L63/00 ,  H01B3/40 ,  C08L49/00

Abstract: A solventless resin composition with a low dielectric constant and a substrate structure are provided. The composition includes: (a) 20-50 parts by weight of a copolymer having the structure of Formula (I) wherein, i, j, k, l, and m are independently an integer from 1 to 10; (b) 50-80 parts by weight of a compound having the structure of Formula (II) (c) 80-100 parts by weight of a hardener; and (d) 70-100 parts by weight of an inorganic filler.