公开(公告)号：US10274688B2

公开(公告)日：2019-04-30

申请号：US16013737

申请日：2018-06-20

Applicant: INPHI CORPORATION

Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Masaki Kato

IPC: G02B6/42 ,  H04B10/40 ,  H04B10/516

Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

公开(公告)号：US09671580B1

公开(公告)日：2017-06-06

申请号：US15075021

申请日：2016-03-18

Applicant: INPHI CORPORATION

Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Masaki Kato ,  Chris Togami

IPC: H04B10/00 ,  G02B6/42 ,  H04B10/40 ,  H04B10/50 ,  G02B6/38 ,  G02B6/32 ,  H05K3/30 ,  H04B1/3827

CPC classification number: G02B6/4257 ,  G02B6/32 ,  G02B6/3849 ,  G02B6/3893 ,  G02B6/4206 ,  G02B6/4208 ,  G02B6/421 ,  G02B6/4246 ,  G02B6/4251 ,  G02B6/4271 ,  G02B6/428 ,  G02B6/4281 ,  G02B6/4284 ,  G02B6/4286 ,  G02B6/4292 ,  G02B6/4295 ,  G02F1/2255 ,  H04B1/3833 ,  H04B10/40 ,  H04B10/503 ,  H04B10/516 ,  H04J14/02 ,  H05K3/30

Abstract: An apparatus for packaging a photonic transceiver. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB installed inside the spatial volume over the base member with a pluggable connector at the back end. The apparatus includes one or more optical transmitting devices being mounted upside-down via a flex circuit board bended 180 degrees inward to a backside of the PCB and including a built-in TEC module in contact with the lid member. Furthermore, the apparatus includes a silicon photonics chip including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance-amplifier module. Moreover, the apparatus includes an optical input port and output port being back connected to the fiber-to-silicon attachment module.

公开(公告)号：US10025046B2

公开(公告)日：2018-07-17

申请号：US15672693

申请日：2017-08-09

Applicant: INPHI CORPORATION

Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Masaki Kato

IPC: H04B10/00 ,  G02B6/42 ,  H04B10/40

Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

公开(公告)号：US09759877B2

公开(公告)日：2017-09-12

申请号：US15375042

申请日：2016-12-09

Applicant: INPHI CORPORATION

Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Masaki Kato

IPC: H04B10/00 ,  G02B6/42 ,  H04B10/40

CPC classification number: G02B6/4246 ,  G02B6/421 ,  G02B6/4215 ,  G02B6/4249 ,  G02B6/4256 ,  G02B6/4278 ,  G02B6/428 ,  G02B6/4292 ,  H04B10/40 ,  H04B10/516

Abstract: A photonic transceiver apparatus in Quad Small Form-factor Pluggable (QSFP) package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a printed circuit board (PCB), installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

公开(公告)号：US09496959B1

公开(公告)日：2016-11-15

申请号：US14789290

申请日：2015-07-01

Applicant: Inphi Corporation

Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Masaki Kato

IPC: H04B10/00 ,  G02B6/12 ,  H04B10/40 ,  H04J14/02 ,  H04B10/516

CPC classification number: G02B6/4257 ,  G02B6/30 ,  G02B6/421 ,  G02B6/4243 ,  G02B6/4246 ,  G02B6/4251 ,  G02B6/4271 ,  G02B6/428 ,  G02B6/4284 ,  G02B6/4286 ,  G02B6/4292 ,  G02F1/2255 ,  G02F2001/212 ,  H04B10/40 ,  H04B10/516 ,  H04J14/02

Abstract: The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB installed inside the spatial volume over the base member with a pluggable connector at the back end. The apparatus includes one or more optical transmitting devices in transmit-optical-sub-assembly package, each being mounted upside-down on the PCB and including a built-in TEC module in contact with the lid member and a laser output port aiming toward the back end. Furthermore, the apparatus includes a silicon photonics chip including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance-amplifier module. Moreover, the apparatus includes an optical input port and output port being back connected to the fiber-to-silicon attachment module.

Abstract translation: 该装置包括具有底座构件，两个部分侧构件和盖构件的壳体，以在基座构件的后端提供具有开口的空间体积。 此外，该设备包括安装在基座部件上方的空间体积内的PCB，后端具有可插拔连接器。 该装置包括一个或多个透射 - 光学 - 组件封装中的光学传输装置，它们分别安装在PCB上，并且包括与盖构件接触的内置TEC模块和朝向 后端 此外，该装置包括硅光子芯片，其包括安装在PCB上的光纤至硅附着模块，并耦合到调制驱动器模块和跨阻抗放大器模块。 此外，该装置包括光输入端口和输出端口，其被连接到光纤到硅附接模块。