公开(公告)号：US20180252772A1

公开(公告)日：2018-09-06

申请号：US15447095

申请日：2017-03-01

Applicant: Intel Corporation

Inventor： Abram M. Detofsky ,  Evan M. Fledell ,  Mustapha A. Abdulai ,  John M. Peterson ,  Dinia P. Kitendaugh ,  Pooya Tadayon ,  Jin Pan ,  David Shia

IPC: G01R31/3185 ,  G01R31/28

CPC classification number: G01R31/31908 ,  G01R31/2886 ,  G01R31/31905

Abstract: A testing system and process comprises a converged test platform for structural testing and system testing of an integrated circuit device. The testing system comprises a converged test platform supported by a baseboard of an automated test assembly. The converged test platform comprises a DUT socket for testing an integrated circuit device, at least one testing electronic component selectively electrically coupled to the DUT socket by at least one switch operable to electrically switch at least some testing signals between the automated testing assembly and the DUT socket to the at least one testing electronic component for both structural testing and system testing of the integrated circuit device within the same test flow. The switch(es) and testing electronic component(s) (e.g., an FPGA) can be reprogrammable for testing flexibility and faster through put. Associated processes and methods are provided for both class and system testing using the converged test platform for back-end and front-end testing.

公开(公告)号：US20180003764A1

公开(公告)日：2018-01-04

申请号：US15200997

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Sankaran M. Menon ,  Rehan M. Sheikh ,  Rolf H. Kuehnis ,  John Michael Peterson ,  Asifur Rahman ,  Abram M. Detofsky ,  Mohsen Fazlian

IPC: G01R31/28 ,  H04B1/40 ,  H04W4/00 ,  H04W88/06

CPC classification number: G01R31/2834 ,  H04B1/40 ,  H04W4/80 ,  H04W24/06 ,  H04W88/06

Abstract: The disclosed systems, devices, and methods may provide for wireless testing of devices and, in particular, wireless testing of semiconductor devices comprising integrated circuits, memory, and logic circuitry that can be present on a wafer. The semiconductor devices can be tested for functional defects by applying one or more test patterns to the semiconductor devices. Further, for devices under test that do not have built-in wireless connectivity (for example, those that do not have a built-in Bluetooth low-energy engine), the disclosure describes systems and methods that the devices under test can use for external wireless connectivity (e.g., an external board having Bluetooth low-energy) on the low-bandwidth interface. In one example embodiment, for high-bandwidth scan testing, wireless connectivity modules (such as those implementing WiFi or WiGig) are described, which can be used to meet the bandwidth requirements of the one or more tests.

公开(公告)号：US20160291083A1

公开(公告)日：2016-10-06

申请号：US15185468

申请日：2016-06-17

Applicant: INTEL CORPORATION

Inventor： John C. Johnson ,  James G. MAVEETY ,  Abram M. Detofsky ,  James E. Neeb

IPC: G01R31/28

CPC classification number: G01R31/2874 ,  G01R1/0458 ,  G01R1/06722 ,  G01R1/06783 ,  G01R1/44 ,  G01R31/2642 ,  G01R31/2875 ,  G01R31/2891 ,  H05K7/20

Abstract: A thermal controller includes a thermal control interface to receive test data from an automated test equipment (ATE) system and dynamically adjust a target setpoint temperature based on the data and a dynamic thermal controller to receive the target setpoint temperature from the thermal control interface and control a thermal actuator based on the target setpoint temperature.

Abstract translation: 热控制器包括用于从自动测试设备（ATE）系统接收测试数据的热控制接口，并且基于该数据动态地调整目标设定点温度和动态热控制器以从热控制接口和控制接收目标设定点温度 基于目标设定点温度的热致动器。

公开(公告)号：US09255945B2

公开(公告)日：2016-02-09

申请号：US14202291

申请日：2014-03-10

Applicant: Intel Corporation

Inventor： Abram M. Detofsky ,  Todd P. Albertson ,  David Shia

IPC: G01R31/00 ,  G01R1/04 ,  G01B7/31 ,  G01R1/067 ,  G01R31/28 ,  H05K1/02

CPC classification number: G01R1/0408 ,  G01B7/31 ,  G01R1/0483 ,  G01R1/06794 ,  G01R31/2891 ,  H05K1/0268 ,  H05K2203/162 ,  H05K2203/166

Abstract: Methods and structures for testing a microelectronic packaging structure/device are described. Those methods may include placing a device in a floating carrier, wherein the floating carrier is coupled to a socket housing by pin dowels disposed in four corners of the socket housing, and wherein at least two actuating motors are disposed within the socket housing, and micro adjusting the device by utilizing a capacitive coupled or a fiber optic alignment system wherein a maximum measured capacitance or maximum measured intensity between alignment structures disposed in the socket housing and alignment package balls disposed within the device indicate optimal alignment of the device. Methods further include methods for active co-planarity detection through the use of a capacitive-coupled techniques.

Abstract translation: 描述了用于测试微电子封装结构/器件的方法和结构。 这些方法可以包括将设备放置在浮动载体中，其中浮动载体通过设置在插座壳体的四个角落中的销钉联接到插座壳体，并且其中至少两个致动马达设置在插座壳体内，并且微型 通过利用电容耦合或光纤对准系统来调节装置，其中设置在插座壳体中的对准结构和设置在装置内的对准封装球之间的最大测量电容或最大测量强度表示装置的最佳对准。 方法还包括通过使用电容耦合技术进行有源共平面检测的方法。