公开(公告)号：US20190041922A1

公开(公告)日：2019-02-07

申请号：US16052590

申请日：2018-08-01

Applicant: Intel Corporation

Inventor： Prakash Kurma Raju ,  Babu Triplicane Gopikrishnan ,  Bijendra Singh ,  Prasanna Pichumani ,  Doddi Raghavendra ,  Harish Jagadish ,  Gopinath Kandasamy ,  David Pidwerbecki

IPC: G06F1/20 ,  G06F1/16 ,  H05K7/20

Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.

公开(公告)号：US09727102B2

公开(公告)日：2017-08-08

申请号：US13937501

申请日：2013-07-09

Applicant: Intel Corporation

Inventor： Paul Gwin ,  Harish Jagadish ,  Narasimha Shastri ,  Madhukar Patil

IPC: G06F1/20 ,  H05K5/03 ,  H05K5/00 ,  H05K1/09

CPC classification number: G06F1/20 ,  G06F1/203 ,  H05K1/09 ,  H05K5/00 ,  H05K5/03 ,  Y10T29/49826

Abstract: Techniques for providing airflow through an electronic device are described herein. An example of an electronic device includes an integrated display and a circuit board comprising a processor, a memory, and a driver circuit coupled to the integrated display. A housing encloses the integrated display and the circuit board, wherein the housing is comprised of at least two panels wherein at least one of the panels is formed from a porous material configured to allow air flow through the panel.

公开(公告)号：USD737824S1

公开(公告)日：2015-09-01

申请号：US29465786

申请日：2013-08-30

Applicant: INTEL CORPORATION

Designer： Harish Jagadish ,  Gokul Subramaniam ,  Madhukar Patil