公开(公告)号：US20230130104A1

公开(公告)日：2023-04-27

申请号：US17451827

申请日：2021-10-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Sushumna Iruvanti ,  James Busby ,  Philipp K. Buchling Rego ,  Steven Paul Ostrander ,  Thomas Anthony Wassick ,  William Santiago-Fernandez ,  Nihad Hadzic

IPC: H01L23/367 ,  H01L23/00 ,  H01L25/065 ,  H01L23/498 ,  H01L25/18

Abstract: A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.

公开(公告)号：US20210165052A1

公开(公告)日：2021-06-03

申请号：US16702160

申请日：2019-12-03

Applicant: International Business Machines Corporation

Inventor： Matthew Doyle ,  James Busby ,  Edward N. Cohen ,  John R. Dangler ,  Michael Fisher ,  Arthur Higby ,  David Clifford Long

IPC: G01R31/54 ,  H05K3/00 ,  H05K1/18 ,  H05K1/02

Abstract: An electronic system can include an electronic module and a trace circuit that provides a perimeter that encloses the electronic module. A sensing circuit within the electronic system can be configured to detect a discontinuity in the perimeter. In response to detecting the discontinuity in the perimeter, the sensing circuit can initiate, from a response device, a response signal.

公开(公告)号：US20200187367A1

公开(公告)日：2020-06-11

申请号：US16792233

申请日：2020-02-15

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Arthur Higby ,  James Busby ,  David C. Long ,  Robert Weiss ,  Michael Fisher ,  Tristen Gaudette

IPC: H05K3/46 ,  H01L23/31 ,  H05K1/02 ,  G06F21/87

Abstract: A process for deforming a flex circuit using a fixture assembly including a base plate having a recess, a wrinkle reducer plate, a stiffening block and a punch. The process including heating the fixture assembly; applying a force to the punch deforming the flex circuit into the recess in the base plate; holding the punch in contact with the flex circuit while heating the fixture assembly; cooling the fixture assembly with the punch in contact with the flex circuit; subsequent to cooling the fixture assembly, removing the force of the punch; and removing the flex circuit from the fixture assembly. The flex circuit having a recessed portion resulting from deforming the flex circuit into the recess in the base plate and a flat portion surrounding the recessed portion.

公开(公告)号：US11614497B2

公开(公告)日：2023-03-28

申请号：US16702077

申请日：2019-12-03

Applicant: International Business Machines Corporation

Inventor： Matthew Doyle ,  James Busby ,  Edward N. Cohen ,  John R. Dangler ,  Gerald Bartley ,  Michael Fisher ,  Arthur Higby ,  David Clifford Long ,  Mark J. Jeanson ,  Darryl Becker

IPC: G01R31/52 ,  H05K1/02 ,  G06F30/30 ,  H05K7/20 ,  H05K3/00 ,  G01K15/00 ,  H02H7/20

Abstract: An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.

公开(公告)号：US11493565B2

公开(公告)日：2022-11-08

申请号：US16702160

申请日：2019-12-03

Applicant: International Business Machines Corporation

Inventor： Matthew Doyle ,  James Busby ,  Edward N. Cohen ,  John R. Dangler ,  Michael Fisher ,  Arthur Higby ,  David Clifford Long

IPC: G01R31/54 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00

Abstract: An electronic system can include an electronic module and a trace circuit that provides a perimeter that encloses the electronic module. A sensing circuit within the electronic system can be configured to detect a discontinuity in the perimeter. In response to detecting the discontinuity in the perimeter, the sensing circuit can initiate, from a response device, a response signal.

公开(公告)号：US11382210B1

公开(公告)日：2022-07-05

申请号：US17124621

申请日：2020-12-17

Applicant: International Business Machines Corporation

Inventor： John R. Dangler ,  Arthur J Higby ,  Philipp K Buchling Rego ,  David Clifford Long ,  James Busby ,  Matthew Doyle ,  Edward N. Cohen ,  Michael Fisher ,  William Santiago-Fernandez

IPC: H05K1/02 ,  H05K1/03 ,  H05K5/02 ,  H05K3/44

Abstract: A uniform thickness flex circuit is taught that uses more than one dielectric layer. A first dielectric layer is more flexible and capable of reliably bending at a radius of curvature at which a second dielectric layer cannot be reliably bent. The second dielectric layer has at least one more desirable electrical characteristic than the first dielectric area, for example leakage. Use of the uniform thickness flex circuit to protect sensitive material in an electronic enclosure is also described.

公开(公告)号：US11244079B2

公开(公告)日：2022-02-08

申请号：US16574822

申请日：2019-09-18

Applicant: International Business Machines Corporation

Inventor： Matteo Cocchini ,  Silvio Dragone ,  Stefano Sergio Oggioni ,  James Busby ,  William Santiago-Fernandez

IPC: H04L9/06 ,  G06F21/75 ,  H05K1/02

Abstract: Provided is a method for masking a sensitive signal by injecting noise into planes of a printed circuit board (PCB). The method comprises detecting, by a secondary integrated circuit (IC), a noise signal on a shared plane of a PCB that includes the secondary IC. The noise signal may be analyzed to determine the characteristics of the noise signal. A masking signal may be generated based on the characteristics. The masking signal may then be injected onto the shared plane.

公开(公告)号：US20210081576A1

公开(公告)日：2021-03-18

申请号：US16574822

申请日：2019-09-18

Applicant: International Business Machines Corporation

Inventor： Matteo Cocchini ,  Silvio Dragone ,  Stefano Sergio Oggioni ,  James Busby ,  William Santiago-Fernandez

IPC: G06F21/75 ,  H05K1/02 ,  H04L9/06

Abstract: Provided is a method for masking a sensitive signal by injecting noise into planes of a printed circuit board (PCB). The method comprises detecting, by a secondary integrated circuit (IC), a noise signal on a shared plane of a PCB that includes the secondary IC. The noise signal may be analyzed to determine the characteristics of the noise signal. A masking signal may be generated based on the characteristics. The masking signal may then be injected onto the shared plane.

公开(公告)号：US20200267830A1

公开(公告)日：2020-08-20

申请号：US16278814

申请日：2019-02-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Arthur Higby ,  David Long ,  Michael Fisher ,  James Busby ,  John R. Dangler ,  Robert Weiss ,  Zachary Thomas Dreiss ,  Rorie Paul Reyes

IPC: H05K1/02 ,  H05K1/03

Abstract: Embodiments of the invention are directed to a method for creating a secure volume. A method includes adhering a flexible circuit to a surface of an enclosure. A first portion of the flexible circuit extends outward from the perimeter of the enclosure. A second portion of the flexible circuit is adhered to the center portion of the enclosure. Pressure is applied to the flexible circuit to ensure that it is affixed to the enclosure. The flexible circuit and the enclosure are then subjected to an annealing temperature. The duration and temperature are based on the adhesive and flexible circuit material. The extended portion of the flexible circuit is coated with an adhesive and folded over the second portion of the flexible circuit. Pressure is applied to the folded flexible circuit. The folded flexible circuit is then subjected to an annealing temperature.

公开(公告)号：US12207392B2

公开(公告)日：2025-01-21

申请号：US17933693

申请日：2022-09-20

Applicant: International Business Machines Corporation

Inventor： Matthew Doyle ,  David Clifford Long ,  Matteo Cocchini ,  Russell A. Budd ,  James Busby ,  Roger S. Krabbenhoft ,  Arthur J. Higby

IPC: H05K1/02 ,  H01P3/08 ,  H01P11/00

Abstract: An electronic component includes a first trace configured to transmit a first signal and a second trace configured to transmit a second signal. The electronic component further includes a layer of conductive material separated from the first and second traces by a layer of insulative material. The electronic component further includes a first vertical wall formed in direct contact with the layer of conductive material. The electronic component further includes a second vertical wall formed in direct contact with the layer of conductive material. The second vertical wall is separated from the first vertical wall by a void, and the void extends between the first trace and the second trace.