公开(公告)号：US20220308564A1

公开(公告)日：2022-09-29

申请号：US17209574

申请日：2021-03-23

Applicant: International Business Machines Corporation

Inventor： Kirk D. Peterson ,  Steven Paul Ostrander ,  Stephanie E Allard ,  Charles L. Reynolds ,  Sungjun Chun ,  Daniel M. Dreps ,  Brian W. Quinlan ,  Sylvain Pharand ,  Jon Alfred Casey ,  David Edward Turnbull ,  Pascale Gagnon ,  Jean Labonte ,  Jean-Francois Bachand ,  Denis Blanchard

IPC: G05B19/418

Abstract: Multicomponent module assembly by identifying a failed site on a laminate comprising a plurality of sites, adding a machine discernible mark associated with the failed site, placing an electrically good element at a successful site; and providing an MCM comprising the laminate, and the electrically good element.

公开(公告)号：US11239183B2

公开(公告)日：2022-02-01

申请号：US16779529

申请日：2020-01-31

Applicant: International Business Machines Corporation

Inventor： Tuhin Sinha ,  Krishna R. Tunga ,  Brian W. Quinlan ,  Charles Leon Arvin ,  Steven Paul Ostrander ,  Thomas Weiss

IPC: H01L23/00 ,  H01L23/367 ,  H01L23/16 ,  H01L23/14 ,  H01L21/48 ,  H01L23/66 ,  H01L23/538

Abstract: A multi-chip module (MCM) package includes an organic laminate substrate; first and second semiconductor device chips that are mounted to a top side of the substrate and that define a chip gap region between opposing edges of the chips; and a stiffener that is embedded in the bottom side of the substrate. The stiffener extends across a stiffening region, which underlies the chip gap region, and does not protrude beyond a bottom side metallization of the substrate.

公开(公告)号：US20230130104A1

公开(公告)日：2023-04-27

申请号：US17451827

申请日：2021-10-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Sushumna Iruvanti ,  James Busby ,  Philipp K. Buchling Rego ,  Steven Paul Ostrander ,  Thomas Anthony Wassick ,  William Santiago-Fernandez ,  Nihad Hadzic

IPC: H01L23/367 ,  H01L23/00 ,  H01L25/065 ,  H01L23/498 ,  H01L25/18

Abstract: A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.

公开(公告)号：US11308257B1

公开(公告)日：2022-04-19

申请号：US17122550

申请日：2020-12-15

Applicant: International Business Machines Corporation

Inventor： Dureseti Chidambarrao ,  David Wolpert ,  Atsushi Ogino ,  Matthew T. Guzowski ,  Steven Paul Ostrander ,  Tuhin Sinha ,  Michael Stewart Gray

IPC: G06F30/30 ,  G06F30/398 ,  G06F30/392 ,  H01L23/48 ,  G06F119/14

Abstract: A structure including a plurality of dielectric regions is described. The structure can include a rivet cell. The rivet cell can include a set of stacked vias. The rivet cell can extend through a stress hotspot of the structure. A length of the rivet cell can thread through at least one dielectric region among the plurality of dielectric regions. The rivet cell can be among a number of rivet cells inserted in the stress hotspot. The stress hotspot can be among a plurality of stress hotspots across the structure. A length of the rivet cell can be based on a model of a relationship between the length of the rivet cell and an energy release rate of the structure. The rivet cell can thread through an interface between a first dielectric region and a second dielectric region having different dielectric constants.

公开(公告)号：US20240213217A1

公开(公告)日：2024-06-27

申请号：US18086575

申请日：2022-12-21

Applicant: International Business Machines Corporation

Inventor： David Michael Audette ,  Grant Wagner ,  Steven Paul Ostrander ,  Hubert Harrer ,  Arvind Kumar ,  Thomas Anthony Wassick ,  Matthew Sean Grady ,  Sungjun Chun

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/538 ,  H01L25/00

CPC classification number: H01L25/0655 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/14 ,  H01L24/16 ,  H01L25/50 ,  H01L2224/1412 ,  H01L2224/16227

Abstract: An apparatus includes a chip package that has a chip connection surface and has an array of micro-bumps on the chip connection surface. The array of micro-bumps includes a plurality of subarrays of micro-bumps. Micro-bumps within each subarray are spaced apart by a chip pitch and the subarrays within the array are spaced apart by a card pitch that is an integer multiple of the chip pitch. The apparatus also includes a laminate circuit card that has a card connection surface that faces the chip connection surface of the chip package and that has an array of card pads adjacent to the card connection surface. The card pads are spaced apart by the card pitch, and each of the card pads is aligned to and electrically connected with a corresponding subarray of micro-bumps. In some embodiments, an interposer connects the card pads to the micro-bumps, and may include decoupling capacitors.

公开(公告)号：US11882645B2

公开(公告)日：2024-01-23

申请号：US17451827

申请日：2021-10-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Sushumna Iruvanti ,  James Busby ,  Philipp K Buchling Rego ,  Steven Paul Ostrander ,  Thomas Anthony Wassick ,  William Santiago-Fernandez ,  Nihad Hadzic

IPC: H05K1/02 ,  H01L23/00 ,  G06F21/86

CPC classification number: H05K1/0201 ,  G06F21/86 ,  H01L23/57 ,  H05K1/0275

Abstract: A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.

公开(公告)号：US20210242139A1

公开(公告)日：2021-08-05

申请号：US16779529

申请日：2020-01-31

Applicant: International Business Machines Corporation

Inventor： Tuhin Sinha ,  Krishna R. Tunga ,  Brian W. Quinlan ,  Charles Leon Arvin ,  Steven Paul Ostrander ,  Thomas Weiss

IPC: H01L23/00 ,  H01L23/367 ,  H01L23/16 ,  H01L23/14 ,  H01L21/48 ,  H01L23/66 ,  H01L23/538

Abstract: A multi-chip module (MCM) package includes an organic laminate substrate; first and second semiconductor device chips that are mounted to a top side of the substrate and that define a chip gap region between opposing edges of the chips; and a stiffener that is embedded in the bottom side of the substrate. The stiffener extends across a stiffening region, which underlies the chip gap region, and does not protrude beyond a bottom side metallization of the substrate.