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    Pressure-induced battery pack venting with filtering
    2.
    发明授权
    Pressure-induced battery pack venting with filtering 有权

    公开(公告)号：US10950831B2

    公开(公告)日：2021-03-16

    申请号：US16189011

    申请日：2018-11-13

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Noah Singer ,  Prabjit Singh ,  John G. Torok ,  David C. Long

    IPC: H01M2/10 ,  H01M10/52 ,  H01M2/12 ,  H01M10/653

    Abstract: A battery pack is provided which includes an enclosure. The enclosure includes a battery cell compartment and a vent. The battery cell compartment is a sealed compartment, except for the vent, and the vent facilitates pressure-induced venting of gas from the battery cell compartment. One or more battery cells are disposed within the battery cell compartment, and the battery pack also includes a filter system associated with the enclosure. The filter system filters the pressure-induced venting of gas from the battery cell compartment resulting from a thermal runaway event at a battery cell of the one or more battery cells within the battery cell compartment of the enclosure.

    Overlapping, discrete tamper-respondent sensors
    3.
    发明授权
    Overlapping, discrete tamper-respondent sensors 有权

    公开(公告)号：US10685146B2

    公开(公告)日：2020-06-16

    申请号：US16358956

    申请日：2019-03-20

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： William L. Brodsky ,  John R. Dangler ,  Phillip Duane Isaacs ,  David C. Long ,  Michael T. Peets

    IPC: G06F21/86 ,  G06F21/87 ,  H05K1/02 ,  H05K5/02 ,  G06F21/75 ,  H01R12/59 ,  H05K5/03

    Abstract: Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.

    Method of fabricating a tamper-respondent assembly with region(s) of increased susceptibility to damage
    5.
    发明授权
    Method of fabricating a tamper-respondent assembly with region(s) of increased susceptibility to damage 有权

    公开(公告)号：US10271434B2

    公开(公告)日：2019-04-23

    申请号：US15249676

    申请日：2016-08-29

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： John R. Dangler ,  David C. Long ,  Michael T. Peets

    IPC: H05K1/02 ,  H05K3/10 ,  H05K1/09

    Abstract: Methods of fabricating tamper-respondent assemblies provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming, at least in part, at least one tamper-detect network, such as one or more resistive networks. The circuit lines are disposed on at least one of the first side or the second side of the at least one flexible layer. At least one region of the tamper-respondent sensor is fabricated with increased susceptibility to damage from mechanical stress associated with a tamper event. The at least one region of increased susceptibility to damage facilitates detection of the tamper event by the tamper-respondent sensor.

    Tamper-respondent assemblies with bond protection
    6.
    发明授权
    Tamper-respondent assemblies with bond protection 有权

    公开(公告)号：US10264665B2

    公开(公告)日：2019-04-16

    申请号：US15835557

    申请日：2017-12-08

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： William L. Brodsky ,  James A. Busby ,  Zachary T. Dreiss ,  Michael J. Fisher ,  David C. Long ,  William Santiago-Fernandez ,  Thomas Weiss

    IPC: H05K1/02 ,  H05K5/02 ,  G06F21/87 ,  H05K1/18

    Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly. In enhanced embodiments, the conductive trace(s) is a chemically compromisable conductor susceptible to damage during a chemical attack on the adhesive within the external bond region(s).

    Method of fabricating tamper-respondent sensor
    7.
    发明授权
    Method of fabricating tamper-respondent sensor 有权

    公开(公告)号：US10257939B2

    公开(公告)日：2019-04-09

    申请号：US15249663

    申请日：2016-08-29

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： John R. Dangler ,  Phillip Duane Isaacs ,  David C. Long

    IPC: H05K1/02 ,  H05K3/10 ,  G06F21/72 ,  G06F21/87 ,  H05K1/03 ,  H05K1/14 ,  H05K1/16 ,  H05K3/06 ,  H05K3/36

    Abstract: Methods of fabricating tamper-respondent electronic circuit structures and electronic assembly packages are provided which include, at least in part, a tamper-respondent sensor including one or more formed flexible layers of, for instance, a dielectric material, having opposite first and second sides, and circuit lines defining at least one resistive network. The circuit lines are disposed on at least one of the first side or the second side of the formed flexible layer(s). The formed flexible layer(s) with the circuit lines includes curvatures, and the circuit lines overlie, at least in part, the curvatures of the formed flexible layer(s). In certain embodiments, the formed flexible layer(s) may be one or more corrugated layers or one or more flattened, folded layers.

    Enclosure with inner tamper-respondent sensor(s)
    10.
    发明授权
    Enclosure with inner tamper-respondent sensor(s) 有权
    带有内部篡改传感器的外壳

    公开(公告)号：US09591776B1

    公开(公告)日：2017-03-07

    申请号：US14865651

    申请日：2015-09-25

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： William L. Brodsky ,  John R. Dangler ,  Zachary T. Dreiss ,  David C. Long ,  Michael T. Peets ,  William Santiago-Fernandez ,  Thomas Weiss

    IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K5/02

    CPC classification number: H05K5/0247 ,  G06F1/00 ,  H05K5/0208 ,  H05K13/00

    Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include an electronic enclosure and a tamper-respondent electronic circuit structure. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner main surface, and an inner sidewall surface which has at least one inner-sidewall corner. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner sidewall surface of the electronic enclosure. The tamper-respondent sensor includes multiple slots provided therein. The multiple slots facilitate disposing the tamper-respondent sensor to cover the at least one inner-sidewall corner of the inner sidewall surface by allowing for one or more regions of overlap of the tamper-respondent sensor at the at least one inner-sidewall corner of the electronic enclosure.

    Abstract translation: 提供了防篡改组件和制造方法，其包括电子外壳和篡改响应的电子电路结构。 电子外壳至少部分地包围至少一个待保护的电子部件，并且包括内部主表面和具有至少一个内侧壁角的内侧壁表面。 篡改答复电子电路结构包括至少部分地覆盖电子外壳的内侧壁表面的防篡改传感器。 篡改传感器包括其中提供的多个槽。 多个插槽有助于将篡改答复传感器设置成覆盖内侧壁表面的至少一个内侧壁角，通过允许篡改响应传感器的至少一个内侧壁角的一个或多个重叠区域 电子机箱。

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