Abstract:
One aspect is a method that includes identifying, by a power via placement tool executing on a processor of a circuit design system, a source and a sink of a voltage domain of a multi-layer circuit board based on a design file defining a layout of the multi-layer circuit board. A number of power vias to support a maximum current demand from the source to the sink is determined. Positions of a plurality of the power vias are determined at locations of the multi-layer circuit board forming paths through the power vias between the source and the sink and having a substantially equal total path length through each total path defined between the source and the sink through at least one of the power vias. The design file is modified to include the power vias at the positions.
Abstract:
An electronic device including a plurality of interconnects are orthogonally arranged in a grid pattern and evenly spaced by a first distance, the plurality of interconnects include: a first conductor pair with conductors arranged next to each other in a first direction, the first direction is oriented diagonally relative to the orthogonal grid pattern, a second conductor pair with conductors arranged next to each other in a second direction substantially perpendicular to the first direction, each conductor of the second conductor pair is spaced by the first distance from each signal conductor of the first conductor pair, and a third conductor pair with conductors arranged next to each other in a third direction substantially parallel to the first direction, each conductors of the third conductor pair is spaced by the first distance from one of the signal elements of the second conductor pair.
Abstract:
Embodiments of the present invention are directed to a computer-implemented method of simulating forward traveling voltages in a simulated circuit. The method includes inserting a traveling wave probe, via a processor, at an observation point of a simulated transmission line. The processor applies a first signal at an input of the traveling wave probe, and evaluates an output of the traveling wave probe. The processor next determines an instantaneous wave forward voltage and an instantaneous wave backward voltage at the traveling wave probe, and displays the instantaneous wave forward voltage and the instantaneous wave backward voltage via an output device.
Abstract:
Embodiments of the present invention are directed to a computer-implemented method of simulating forward traveling voltages in a simulated circuit. The method includes inserting a traveling wave probe, via a processor, at an observation point of a simulated transmission line. The processor applies a first signal at an input of the traveling wave probe, and evaluates an output of the traveling wave probe. The processor next determines an instantaneous wave forward voltage and an instantaneous wave backward voltage at the traveling wave probe, and displays the instantaneous wave forward voltage and the instantaneous wave backward voltage via an output device.
Abstract:
A method to generate a reduced delay twinaxial SPICE model is provided. The method may include measuring near-end S-parameter components and far-end S-parameter components of a twinaxial cable, reducing an original time delay of the far-end S-parameter components by multiplying each of the far-end S-parameter components by a complex exponential based on an equivalent delay length, a signal frequency, and an effective dielectric constant, simulating a signal transmitted across a twinaxial cable by running a 4-port SPICE model using the near-end S-parameter components and the multiplied far-end S-parameter components, and recording a magnitude and a phase of the transmitted signal with respect to frequency as outputs of the reduced delay twinaxial SPICE model.
Abstract:
One aspect is a method that includes identifying, by a power via placement tool executing on a processor of a circuit design system, a source and a sink of a voltage domain of a multi-layer circuit board based on a design file defining a layout of the multi-layer circuit board. A number of power vias to support a maximum current demand from the source to the sink is determined. Positions of a plurality of the power vias are determined at locations of the multi-layer circuit board forming paths through the power vias between the source and the sink and having a substantially equal total path length through each total path defined between the source and the sink through at least one of the power vias. The design file is modified to include the power vias at the positions.
Abstract:
A method to generate a reduced delay twinaxial SPICE model is provided. The method may include measuring near-end S-parameter components and far-end S-parameter components of a twinaxial cable, reducing an original time delay of the far-end S-parameter components by multiplying each of the far-end S-parameter components by a complex exponential based on an equivalent delay length, a signal frequency, and an effective dielectric constant, simulating a signal transmitted across a twinaxial cable by running a 4-port SPICE model using the near-end S-parameter components and the multiplied far-end S-parameter components, and recording a magnitude and a phase of the transmitted signal with respect to frequency as outputs of the reduced delay twinaxial SPICE model.
Abstract:
In one embodiment, a method includes positioning a first signal pad in a first layer of a printed circuit board and positioning a second signal pad in a second layer of the printed circuit board. The second signal pad is positioned to form an embedded capacitance between the first signal pad and the second signal pad. The embedded capacitance between the first signal pad and the second signal pad is configured to carry a signal between the first layer and the second layer absent a signal via.
Abstract:
A method of forming a mixed mode response from a single ended mode input includes modeling a first voltage controlled current source based on relative values of a vpositive input signal and a vnegative input signal and modeling a second voltage controlled current source based on relative values of the vpositive input signal and the vnegative input signal. A method of forming a single ended mode response from a mixed mode input modeling a first voltage controlled current source based on relative values of a vDIFFin input signal and a vCOMMin input signal and modeling a second voltage controlled current source based on relative values of the vDIFFin input signal and the vCOMMin input signal, the second voltage controlled being connected to ground through a second terminating impedance that is equal to the reference impedance (Z0).
Abstract:
An electronic device including a plurality of interconnects are orthogonally arranged in a grid pattern and evenly spaced by a first distance, the plurality of interconnects include: a first conductor pair with conductors arranged next to each other in a first direction, the first direction is oriented diagonally relative to the orthogonal grid pattern, a second conductor pair with conductors arranged next to each other in a second direction substantially perpendicular to the first direction, each conductor of the second conductor pair is spaced by the first distance from each signal conductor of the first conductor pair, and a third conductor pair with conductors arranged next to each other in a third direction substantially parallel to the first direction, each conductors of the third conductor pair is spaced by the first distance from one of the signal elements of the second conductor pair.