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    SYSTEM AND METHODS FOR COOLING ELECTRONIC EQUIPMENT
    11.
    发明申请
    SYSTEM AND METHODS FOR COOLING ELECTRONIC EQUIPMENT 审中-公开
    冷却电子设备的系统和方法

    公开(公告)号：US20160120067A1

    公开(公告)日：2016-04-28

    申请号：US14834746

    申请日：2015-08-25

    Applicant: INERTECH IP LLC

    Inventor： Gerald McDonnell ,  Earl Keisling ,  John Costakis

    IPC: H05K7/20

    CPC classification number: H05K7/20381 ,  F25B31/006 ,  F25B2600/021 ,  H05K7/2029 ,  H05K7/20327 ,  H05K7/20745 ,  H05K7/20827 ,  Y02B30/741 ,  Y10T29/49359

    Abstract: Systems and methods for cooling an inverter of a variable frequency drive that drives a compressor in a cooling system for electronic equipment are disclosed. The system includes a first fluid circuit that cools electronic equipment using a first fluid flowing therethrough and a second fluid circuit that free cools a second fluid flowing therethrough. The second fluid circuit cools the first fluid using the free-cooled second fluid. The system further includes a third fluid circuit that mechanically cools the second fluid using a third fluid flowing therethrough as a function of the wet bulb temperature of atmospheric air. The third fluid circuit includes at least one compressor compresses the third fluid and is driven by a motor coupled to the variable frequency drive. At least a portion of the first fluid flowing through the third fluid circuit is diverted to cool the inverter of the variable frequency drive.

    Abstract translation: 公开了用于冷却驱动电子设备的冷却系统中的压缩机的变频驱动器的逆变器的系统和方法。 该系统包括使用流过其中的第一流体冷却电子设备的第一流体回路，以及第二流体回路，其自由地冷却流过其中的第二流体。 第二流体回路使用自由冷却的第二流体冷却第一流体。 该系统还包括第三流体回路，其使用流过其中的第三流体作为大气空气的湿球温度的函数机械地冷却第二流体。 第三流体回路包括至少一个压缩机压缩第三流体并由耦合到变频驱动器的马达驱动。 流过第三流体回路的第一流体的至少一部分被转向以冷却变频驱动器的逆变器。

    COOLING SYSTEM INCLUDING A CONTROLLED ATMOSPHERIC HEAT REJECTION CYCLE WITH WATER RE-CAPTURE
    12.
    发明申请
    COOLING SYSTEM INCLUDING A CONTROLLED ATMOSPHERIC HEAT REJECTION CYCLE WITH WATER RE-CAPTURE 审中-公开
    包括控制大气热排放周期的冷却系统

    公开(公告)号：US20140096562A1

    公开(公告)日：2014-04-10

    申请号：US14050324

    申请日：2013-10-09

    Applicant: Inertech IP LLC

    Inventor： Gerald McDonnell ,  Earl Keisling

    IPC: F25B39/02

    CPC classification number: F25B39/028 ,  F24F5/0035 ,  F28C1/14 ,  F28D5/02

    Abstract: The present disclosure relates to a cooling system including a controlled atmospheric heat rejection cycle with water re-capture. The cooling system for cooling a heat load includes a first evaporative section configured to circulate a first fluid to enable heat transfer from the heat load to the first fluid, a second evaporative section in fluid communication with the first evaporative section and configured to circulate the first fluid, and a liquid refrigerant distribution unit in thermal communication with the second evaporative section. The liquid refrigerant distribution unit is configured to circulate a second fluid to enable heat transfer from the first fluid to the second fluid.

    Abstract translation: 本公开涉及一种包括具有水再捕获的受控大气排热循环的冷却系统。 用于冷却热负荷的冷却系统包括第一蒸发部分，其被配置为循环第一流体以使得能够从热负荷到第一流体的热传递;第二蒸发部分，其与第一蒸发部分流体连通并且构造成使第一流体循环 流体和与第二蒸发部热连通的液体制冷剂分配单元。 液体制冷剂分配单元构造成使第二流体循环，以使得能够从第一流体到第二流体的热传递。

    Systems and assemblies for cooling server racks
    13.
    发明授权
    Systems and assemblies for cooling server racks 有权

    公开(公告)号：US10448539B2

    公开(公告)日：2019-10-15

    申请号：US15590596

    申请日：2017-05-09

    Applicant: INERTECH IP LLC

    Inventor： Earl Keisling ,  John Costakis ,  Gerald McDonnell ,  Michael Welch

    IPC: H05K7/20 ,  H05K5/02

    Abstract: A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.

    COOLING SYSTEMS AND METHODS INCORPORATING A PLURAL IN-SERIES PUMPED LIQUID REFRIGERANT TRIM EVAPORATOR CYCLE
    15.
    发明申请
    COOLING SYSTEMS AND METHODS INCORPORATING A PLURAL IN-SERIES PUMPED LIQUID REFRIGERANT TRIM EVAPORATOR CYCLE 审中-公开
    冷却系统和方法，包括一系列串联泵送液体制冷剂蒸发器循环

    公开(公告)号：US20150211769A1

    公开(公告)日：2015-07-30

    申请号：US14682772

    申请日：2015-04-09

    Applicant: Inertech IP LLC

    Inventor： Gerald McDonnell ,  Earl Keisling

    IPC: F25B5/04 ,  F25B7/00 ,  F25B49/02 ,  F25B6/02

    CPC classification number: F25B5/04 ,  F25B6/02 ,  F25B7/00 ,  F25B23/006 ,  F25B25/005 ,  F25B41/00 ,  F25B49/02

    Abstract: The cooling systems and methods of the present disclosure relate to a plural in-series pumped liquid refrigerant trim evaporator cycle that may be incorporated into an existing cooling system to increase the efficiency of the existing cooling system. The cooling systems of the present disclosure include a first evaporator coil in thermal communication with an air intake flow to a heat load, such as a heat load being cooled by the existing cooling system, and a first liquid refrigerant distribution unit in thermal communication with the first evaporator coil. The cooling systems further includes a second evaporator coil disposed in series with the first evaporator coil in the air intake flow and in thermal communication with the air intake flow, and a second liquid refrigerant distribution unit in thermal communication with the second evaporator coil. A trim compression cycle of the second liquid refrigerant distribution unit is configured to incrementally further cool the air intake flow through the second evaporator coil when the temperature of the free-cooled first fluid flowing out of the main compressor of the second liquid refrigerant distribution unit exceeds a predetermined threshold temperature.

    Abstract translation: 本公开的冷却系统和方法涉及可并入现有冷却系统中的多个串联泵送的液体制冷剂修整蒸发器循环，以提高现有冷却系统的效率。 本公开的冷却系统包括与进气流与热负荷（例如由现有冷却系统冷却的热负荷）热连通的第一蒸发器盘管，以及与所述冷却系统热连通的第一液体制冷剂分配单元 第一蒸发器盘管。 冷却系统还包括与进气流中的第一蒸发器盘管串联布置并与进气流热连通的第二蒸发器盘管和与第二蒸发器盘管热连通的第二液体制冷剂分配单元。 第二液体制冷剂分配单元的调整压缩循环构成为，在从第二液体制冷剂分配单元的主压缩机流出的自由冷却的第一流体的温度超过第一蒸发器盘管时，进一步冷却通过第二蒸发器盘管的进气流量 预定的阈值温度。

    Space-saving high-density modular data systems and energy-efficient cooling systems
    18.
    发明授权
    Space-saving high-density modular data systems and energy-efficient cooling systems 有权

    公开(公告)号：US12048128B2

    公开(公告)日：2024-07-23

    申请号：US15701093

    申请日：2017-09-11

    Applicant: INERTECH IP LLC

    Inventor： Earl Keisling ,  John Costakis ,  Gerald McDonnell

    IPC: H05K7/20 ,  F25D17/00 ,  F28D15/00 ,  G06F1/20

    CPC classification number: H05K7/20827 ,  F25D17/00 ,  F28D15/00 ,  G06F1/20 ,  H05K7/20218 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20754 ,  H05K7/20818 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a common fluid and electrical circuit section that is configured to connect to adjacent common fluid and electrical circuit sections to form a common fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system.

    Air flow distribution system for data center server racks
    19.
    发明授权
    Air flow distribution system for data center server racks 有权

    公开(公告)号：US11547019B2

    公开(公告)日：2023-01-03

    申请号：US16928633

    申请日：2020-07-14

    Applicant: Inertech IP LLC

    Inventor： Earl Keisling ,  John Costakis ,  Gerald McDonnell

    IPC: H05K7/20 ,  F21V33/00 ,  F21W131/40

    Abstract: An air flow distribution system for cooling server racks includes at least one server rack partially defining a hot aisle and a cold aisle, a first air foil disposed above the server rack, and a second air foil disposed above the first air foil. The first air foil and the second air foil are configured to receive air from the hot aisle, and to form turbulent wake patterns in the cold aisle partially defined by the server rack. The air flow distribution system may include a convex ceiling member above the second air foil. A corresponding method includes causing air to be directed between a first air foil disposed above a server rack and a second air foil disposed above the first air foil to form turbulent wake patterns in the cold aisle. An electrical enclosure assembly includes a receptacle and a cover member configured as an air foil.

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