公开(公告)号：US12282060B2

公开(公告)日：2025-04-22

申请号：US18119921

申请日：2023-03-10

Applicant: Infineon Technologies AG

Inventor： Nee Wan Khoo ,  Soon Lai Kho

IPC: G01R31/28 ,  G01R1/073 ,  G01R3/00

Abstract: An apparatus for testing semiconductor devices is disclosed. In one example, the apparatus includes a rolling contactor comprising a first cylindrical rotatable holder, a plurality of test pin sets, each one of the test pin sets being connected to the cylindrical rotatable holder. Each one of the test pin sets comprises a plurality of test pins, and a substrate configured to support a plurality of semiconductor devices. The semiconductor devices comprising one or more contact elements on a main surface thereof remote from the substrate, wherein the first cylindrical rotatable holder and the substrate are arranged relative to each other so that due to a rotating movement of the first cylindrical rotatable holder the test pins of the test pin sets are successively contacted with the contact elements of the semiconductor devices.

公开(公告)号：US20240302426A1

公开(公告)日：2024-09-12

申请号：US18119076

申请日：2023-03-08

Applicant: Infineon Technologies AG

Inventor： Soon Lai Kho ,  Nee Wan Khoo

IPC: G01R31/26

CPC classification number: G01R31/2601

Abstract: A method includes providing a semiconductor package comprising an encapsulant body and a plurality of leads that protrude out from the encapsulant body, providing a semiconductor device testing apparatus including a package holder, a plurality of contact test probes, and a lead extender, arranging the semiconductor package within the package holder, actuating the semiconductor device testing apparatus such that a first one of the contact test probes directly contacts a first one of the leads and such that a second one of the contact test probes directly contacts the lead extender, and applying a test current to the semiconductor package such that part of the test current flows through the first one of the contact test probes directly contacting the first one of the leads and such that part of the test current flows through the second one of the contact test probes directly contacting the lead extender.

公开(公告)号：US09274163B2

公开(公告)日：2016-03-01

申请号：US13779544

申请日：2013-02-27

Applicant: Infineon Technologies AG

Inventor： Theng Chao Long ,  Nee Wan Khoo

IPC: G01R31/26 ,  G01R31/28

Abstract: In one embodiment, a method of testing a semiconductor component includes loading a plurality of semiconductor components into a main turret of a turret handler, transporting the plurality of semiconductor components using the main turret to a test area, and splitting the plurality of semiconductor components into a first set and a second set. The method further includes testing a first semiconductor component in the first set at a first test pad using a tester while transporting a second semiconductor component in the second set to a second test pad and testing the second semiconductor component using the tester while transporting the first semiconductor component out of the first test pad. The first set and the second set are merged into the plurality of semiconductor components and the plurality of semiconductor components are transported away from the test area using the main turret.

公开(公告)号：US20150064849A1

公开(公告)日：2015-03-05

申请号：US14015148

申请日：2013-08-30

Applicant: Infineon Technologies AG

Inventor： Nee Wan Khoo ,  Lay Yeap Lim

IPC: H01L23/00

CPC classification number: H01L24/89 ,  H01L21/561 ,  H01L22/14 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49541 ,  H01L23/49558 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/50 ,  H01L2224/73265 ,  H01L2224/73269 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/157 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lead frame strip includes connected unit lead frames each having a die paddle, a tie bar directly connecting the die paddle to a periphery of the unit lead frame, leads directly connected to the periphery of the unit lead frame and projecting toward the die paddle, and an opening in the periphery adjacent the tie bar. The openings in the periphery of the unit lead frames are spanned with an electrically insulating material that connects the tie bar of each unit lead frame to the periphery of the unit lead frame. The direct connections between the tie bars and the periphery of the unit lead frames are severed prior to subsequent processing, so that the tie bars remain connected to the periphery of the unit lead frames by the electrically insulating material and the die paddles are electrically disconnected from the periphery of the unit lead frames.

Abstract translation: 引线框架条包括连接的单元引线框架，每个引线框架都具有管芯焊盘，将管芯焊盘直接连接到单元引线框架的外围的引导杆直接连接到单元引线框架的周边并朝向管芯焊盘突出， 以及在连接杆附近的周边的开口。 单元引线框架周边的开口用电绝缘材料跨接，每个单元引线框架的连接杆连接到单元引线框架的外围。 在后续处理之前，连接杆和单元引线框架的周边之间的直接连接被切断，使得连接杆通过电绝缘材料保持连接到单元引线框架的外围，并且管芯焊盘与电绝缘材料电连接 单元引线框的周边。

公开(公告)号：US20150063969A1

公开(公告)日：2015-03-05

申请号：US14017358

申请日：2013-09-04

Applicant: Infineon Technologies AG

Inventor： Nee Wan Khoo ,  Horst Groeninger

IPC: H01L21/68

CPC classification number: G01R1/0466 ,  G01R1/0483 ,  H01L24/75 ,  H01L2224/75704

Abstract: A semiconductor device is aligned by placing the semiconductor device in a nest between first and second sections of the nest when the nest is in a receiving position in which the first and second sections are spaced further apart from one another than when the nest is in an aligning position. The nest is moved from the receiving position to the aligning position with the semiconductor device in the nest so that the first and second sections are spaced closer to one another and align the semiconductor device in the nest. The semiconductor device is removed from the nest after the semiconductor device is aligned.

Abstract translation: 当巢处于接收位置时，将半导体器件放置在嵌套的第一和第二部分之间的嵌套中，使半导体器件对准，其中第一和第二部分彼此间隔开，比嵌套在 对齐位置。 嵌套从接收位置移动到与嵌套中的半导体器件的对准位置，使得第一和第二部分彼此间隔开并将半导体器件对准在嵌套中。 在半导体器件对准之后，将半导体器件从巢中移除。

公开(公告)号：US20140239998A1

公开(公告)日：2014-08-28

申请号：US13779544

申请日：2013-02-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Theng Chao Long ,  Nee Wan Khoo

IPC: G01R31/26

CPC classification number: G01R31/2601 ,  G01R31/26 ,  G01R31/28 ,  G01R31/2893

Abstract: In one embodiment, a method of testing a semiconductor component includes loading a plurality of semiconductor components into a main turret of a turret handler, transporting the plurality of semiconductor components using the main turret to a test area, and splitting the plurality of semiconductor components into a first set and a second set. The method further includes testing a first semiconductor component in the first set at a first test pad using a tester while transporting a second semiconductor component in the second set to a second test pad and testing the second semiconductor component using the tester while transporting the first semiconductor component out of the first test pad. The first set and the second set are merged into the plurality of semiconductor components and the plurality of semiconductor components are transported away from the test area using the main turret.

Abstract translation: 在一个实施例中，测试半导体部件的方法包括将多个半导体部件加载到转台处理器的主转台中，使用主转台将多个半导体部件传送到测试区域，并将多个半导体部件分成 第一组和第二组。 该方法还包括使用测试仪在第一测试垫中测试第一组中的第一半导体组件，同时将第二组中的第二半导体组件传输到第二测试焊盘，并使用测试仪测试第二半导体组件，同时传送第一半导体 组件出第一个测试板。 第一组和第二组被合并到多个半导体部件中，并且使用主转台将多个半导体部件从测试区域运送出去。