公开(公告)号：US11435816B2

公开(公告)日：2022-09-06

申请号：US17215104

申请日：2021-03-29

Applicant: Intel Corporation

Inventor： Efraim Rotem ,  Doron Rajwan ,  Eliezer Weissmann ,  Nir Rosenzweig ,  Eric Distefano ,  Ishmael F. Santos ,  James G. Hermerding, II

IPC: G06F1/00 ,  G06F1/3296 ,  G06F1/3228 ,  G06F9/30 ,  G06F1/324

Abstract: In one embodiment, a processor includes at least one core to execute instructions and a power controller coupled to the at least one core. The power controller may include a first logic to cause the at least one core to exit an idle state and enter into a maximum performance state for a first time duration, thereafter enter into an intermediate power state for a second time duration, and thereafter enter into a sustained performance state. Other embodiments are described and claimed.

公开(公告)号：US20180157298A1

公开(公告)日：2018-06-07

申请号：US15647745

申请日：2017-07-12

Applicant: Intel Corporation

Inventor： Ketan R. Shah ,  Tawfik M. Rahal-Arabi ,  Eric Distefano ,  James G. Hermerding, II

IPC: G06F1/20 ,  G06F1/26

CPC classification number: G06F1/206 ,  G06F1/26 ,  G06F1/3203 ,  Y02D10/16

Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.

公开(公告)号：US09465418B2

公开(公告)日：2016-10-11

申请号：US14570969

申请日：2014-12-15

Applicant: Intel Corporation

Inventor： Ketan R. Shah ,  Tawfik M. Rahal-Arabi ,  Eric Distefano ,  James G. Hermerding, II

IPC: G06F1/26 ,  G06F1/20 ,  G06F1/32

CPC classification number: G06F1/206 ,  G06F1/26 ,  G06F1/3203 ,  Y02D10/16

Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.

公开(公告)号：US20150185795A1

公开(公告)日：2015-07-02

申请号：US14645330

申请日：2015-03-11

Applicant: Intel Corporation

Inventor： Eric Distefano ,  Guy M. Therien ,  Vasudevan Srinivasan ,  Tawfik Rahal-Arabi ,  Venkatesh Ramani ,  Ryan D. Wells ,  Stephen H. Gunther ,  Jeremy Shrall ,  James Hermerding, II

IPC: G06F1/20

CPC classification number: G06F1/3234 ,  G06F1/206 ,  G06F1/26 ,  Y02D10/16

Abstract: A technique to change a thermal design power (TDP) value. In one embodiment, one or more environmental or user-driven changes may cause a processor's TDP value to be changed. Furthermore, in some embodiments a change in TDP may alter a turbo mode target frequency.

Abstract translation: 一种改变热设计功耗（TDP）值的技术。 在一个实施例中，一个或多个环境或用户驱动的改变可以导致处理器的TDP值被改变。 此外，在一些实施例中，TDP的改变可以改变涡轮模式目标频率。

公开(公告)号：US20150100800A1

公开(公告)日：2015-04-09

申请号：US14570969

申请日：2014-12-15

Applicant: Intel Corporation

Inventor： Ketan R. Shah ,  Tawfik M. Rahal-Arabi ,  Eric Distefano ,  James G. Hermerding, II

IPC: G06F1/20

CPC classification number: G06F1/206 ,  G06F1/26 ,  G06F1/3203 ,  Y02D10/16

Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.