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公开(公告)号：US11301011B2
公开(公告)日：2022-04-12
申请号：US16696072
申请日：2019-11-26
Applicant: INTEL CORPORATION
Inventor： Ketan R. Shah , Tawfik M. Rahal-Arabi , Eric DiStefano , James G. Hermerding, II
IPC: G06F1/26 , G06F1/32 , G06F1/20 , G06F1/3203
Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.
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公开(公告)号：US20200218319A1
公开(公告)日：2020-07-09
申请号：US16696072
申请日：2019-11-26
Applicant: INTEL CORPORATION
Inventor： Ketan R. Shah , Tawfik M. Rahal-Arabi , Eric DiStefano , James G. Hermerding, II
Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.
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公开(公告)号：US20170321873A1
公开(公告)日：2017-11-09
申请号：US15601207
申请日：2017-05-22
Applicant: Intel Corporation
Inventor： Ketan R. Shah , Sean M. Halton
IPC: F21V29/506 , F21V29/74 , F21V29/77 , H01L33/64 , F21V29/78 , F21K9/232 , F21V29/85 , F21V3/02 , F21V29/71 , F21V29/83 , F21V29/87 , F21V29/89 , F21Y2115/10 , F21V3/04 , F21Y101/00 , F21V29/70
CPC classification number: F21V29/506 , F21K9/135 , F21K9/232 , F21V3/02 , F21V3/061 , F21V3/062 , F21V29/70 , F21V29/71 , F21V29/74 , F21V29/745 , F21V29/77 , F21V29/773 , F21V29/78 , F21V29/83 , F21V29/85 , F21V29/87 , F21V29/89 , F21Y2101/00 , F21Y2101/02 , F21Y2115/10 , H01L24/00 , H01L33/642 , H01L2924/00 , H01L2924/0002
Abstract: Embodiments of the invention provide lighting systems that employ light-emitting diode (LED) chips as active lighting elements. Heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.
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Patent Agency Ranking
公开(公告)号：US20150100799A1
公开(公告)日：2015-04-09
申请号：US14570945
申请日：2014-12-15
Applicant: Intel Corporation
Inventor： Ketan R. Shah , Tawfik M. Rahal-Arabi , Eric Distefano , James G. Hermerding, II
CPC classification number: G06F1/206 , G06F1/26 , G06F1/3203 , Y02D10/16
Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.
Abstract translation: 描述了可配置的处理器热管理的装置，系统和方法的实施例。 例如，设备可以包括处理器，其被布置成以包括热限制模式，正常热限制模式和热限制模式的多个热模式操作，以及热管理逻辑，其可操作以基于 设备的一个或多个属性。 描述和要求保护其他实施例。
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公开(公告)号：US09710030B2
公开(公告)日：2017-07-18
申请号：US14570945
申请日：2014-12-15
Applicant: Intel Corporation
Inventor： Ketan R. Shah , Tawfik M. Rahal-Arabi , Eric Distefano , James G. Hermerding, II
CPC classification number: G06F1/206 , G06F1/26 , G06F1/3203 , Y02D10/16
Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.
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公开(公告)号：US20180157298A1
公开(公告)日：2018-06-07
申请号：US15647745
申请日：2017-07-12
Applicant: Intel Corporation
Inventor： Ketan R. Shah , Tawfik M. Rahal-Arabi , Eric Distefano , James G. Hermerding, II
CPC classification number: G06F1/206 , G06F1/26 , G06F1/3203 , Y02D10/16
Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.
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公开(公告)号：US09465418B2
公开(公告)日：2016-10-11
申请号：US14570969
申请日：2014-12-15
Applicant: Intel Corporation
Inventor： Ketan R. Shah , Tawfik M. Rahal-Arabi , Eric Distefano , James G. Hermerding, II
CPC classification number: G06F1/206 , G06F1/26 , G06F1/3203 , Y02D10/16
Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.
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公开(公告)号：US20150100800A1
公开(公告)日：2015-04-09
申请号：US14570969
申请日：2014-12-15
Applicant: Intel Corporation
Inventor： Ketan R. Shah , Tawfik M. Rahal-Arabi , Eric Distefano , James G. Hermerding, II
IPC: G06F1/20
CPC classification number: G06F1/206 , G06F1/26 , G06F1/3203 , Y02D10/16
Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.
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