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11.
公开(公告)号:US11417830B2
公开(公告)日:2022-08-16
申请号:US16024709
申请日:2018-06-29
申请人: Intel Corporation
发明人: Tanay Gosavi , Sasikanth Manipatruni , Chia-Ching Lin , Gary Allen , Kaan Oguz , Kevin O'Brien , Noriyuki Sato , Ian Young , Dmitri Nikonov
摘要: Embodiments herein relate to magnetically doping a spin orbit torque electrode (SOT) in a magnetic random access memory apparatus. In particular, the apparatus may include a free layer of a magnetic tunnel junction (MTJ) coupled to a SOT electrode that is magnetically doped to apply an effective magnetic field on the free layer, where the free layer has a magnetic polarization in a first direction and where current flowing through the magnetically doped SOT electrode is to cause the magnetic polarization of the free layer to change to a second direction that is substantially opposite to the first direction.
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公开(公告)号:US11276730B2
公开(公告)日:2022-03-15
申请号:US16246360
申请日:2019-01-11
申请人: Intel Corporation
发明人: Kevin O'Brien , Christopher Wiegand , Tofizur Rahman , Noriyuki Sato , Gary Allen , James Pellegren , Angeline Smith , Tanay Gosavi , Sasikanth Manipatruni , Kaan Oguz , Benjamin Buford , Ian Young
摘要: A perpendicular spin orbit memory device includes a first electrode having a magnetic material and platinum and a material layer stack on a portion of the first electrode. The material layer stack includes a free magnet, a fixed magnet above the first electrode, a tunnel barrier between the free magnet and the fixed magnet and a second electrode coupled with the fixed magnet.
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公开(公告)号:US20200343301A1
公开(公告)日:2020-10-29
申请号:US16396451
申请日:2019-04-26
申请人: Intel Corporation
发明人: Benjamin Buford , Angeline Smith , Noriyuki Sato , Tanay Gosavi , Kaan Oguz , Christopher Wiegand , Kevin O'Brien , Tofizur Rahman , Gary Allen , Sasikanth Manipatruni , Emily Walker
摘要: A memory apparatus includes a first electrode having a spin orbit material. The memory apparatus further includes a first memory device on a portion of the first electrode and a first dielectric adjacent to a sidewall of the first memory device. The memory apparatus further includes a second memory device on a portion of the first electrode and a second dielectric adjacent to a sidewall of the second memory device. A second electrode is on and in contact with a portion of the first electrode, where the second electrode is between the first memory device and the second memory device. The second electrode has a lower electrical resistance than an electrical resistance of the first electrode. The memory apparatus further includes a first interconnect structure and a second interconnect, each coupled with the first electrode.
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公开(公告)号:US20190305216A1
公开(公告)日:2019-10-03
申请号:US15942231
申请日:2018-03-30
申请人: Intel Corporation
发明人: Tanay Gosavi , Sasikanth Manipatruni , Kaan Oguz , Ian Young , Kevin O'Brien , Gary Allen , Noriyuki Sato
摘要: An apparatus is provided which comprises: a magnetic junction having a magnet with a first magnetization; an interconnect adjacent to the magnetic junction, wherein the interconnect comprises an antiferromagnetic (AFM) material which is doped with a doping material (Pt, Ni, Co, or Cr) and a structure adjacent to the interconnect such that the magnetic junction and the structure are on opposite surfaces of the interconnect, wherein the structure comprises a magnet with a second magnetization substantially different from the first magnetization.
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