公开(公告)号：US20230307379A1

公开(公告)日：2023-09-28

申请号：US17703768

申请日：2022-03-24

Applicant: Intel Corporation

Inventor： Phil GENG ,  Patrick NARDI ,  Ravindranath V. MAHAJAN ,  Dingying David XU ,  Prasanna RAGHAVAN ,  John HARPER ,  Sanjoy SAHA ,  Yang JIAO

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L23/49816

Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and a die coupled to the package substrate. In an embodiment, the electronic package further comprises a stiffener on the package substrate surrounding the die. In an embodiment, the stiffener is a ring with one or more corner regions and one or more beams. In an embodiment, each beam is between a pair of corner regions, and the one or more corner regions have a first thickness and the one or more beams have a second thickness that is greater than the first thickness.

公开(公告)号：US20230273654A1

公开(公告)日：2023-08-31

申请号：US18195072

申请日：2023-05-09

Applicant: Intel Corporation

Inventor： Xiang LI ,  George VERGIS ,  Phil GENG

IPC: G06F1/18

CPC classification number: G06F1/181 ,  H05K1/14

Abstract: A standalone top cover retention mechanism can attach to the top of an array of tall (e.g., 2U) DIMMs to provide structural support. In one example, the DIMM cover is attached to two or more DIMMs without attaching to the chassis. The DIMM cover can mitigate shock and vibration related failures at the DIMM level without significant interference with platform thermal mechanical solutions.

公开(公告)号：US20230092972A1

公开(公告)日：2023-03-23

申请号：US18070433

申请日：2022-11-28

Applicant: Intel Corporation

Inventor： Phil GENG ,  Guixiang TAN ,  Yanbing SUN ,  Xiang LI ,  George VERGIS ,  Sanjoy K. SAHA

IPC: H05K7/10 ,  H05K1/11 ,  H01L23/473 ,  H05K7/20 ,  H05K7/14

Abstract: An apparatus is described. The apparatus includes a DIMM cooling assembly. The DIMM cooling assembly includes first and second heat spreaders to be respectively disposed on first and second sides of the DIMM's circuit board. The first and second sides having respective memory chips. The DIMM cooling assembly includes a heat dissipative structure. The DIMM's circuit board is to be disposed between the heat dissipative structure and a printed circuit board that the DIMM is to be plugged into. The DIMM cooling assembly includes fixturing elements to apply compressive forces toward the respective side edges of the DIMM's circuit board to the heat spreaders.

公开(公告)号：US20220208645A1

公开(公告)日：2022-06-30

申请号：US17696694

申请日：2022-03-16

Applicant: Intel Corporation

Inventor： Olaotan ELENITOBA-JOHNSON ,  Eric ERIKE ,  Jeffory L. SMALLEY ,  Ulises ENCARNACION ,  Ralph V. MIELE ,  Phil GENG ,  Sri Priyanka TUNUGUNTLA ,  Shaun G. IMMEKER

IPC: H01L23/40

Abstract: An apparatus is described. The apparatus includes a back plate. The apparatus includes a bolster plate that is secured to the back plate with a back bolt. The bolster plate has a window. The apparatus includes a circuit board between the back plate and the bolster plate. A semiconductor chip package is electro-mechanically coupled to the circuit board within the window. The apparatus includes a load stud that emanates from a face of the bolster plate. The back bolt emanates from an opposite face of the bolster plate. The load stud and back bolt are oriented along a same axis that is orthogonal to the face and the opposite face. The apparatus includes a heat sink. The apparatus includes a loading plate. The heat sink is mounted to the loading plate. The loading plate has a fixturing element that is secured to the load stud to secure the loading plate to the bolster plate.

公开(公告)号：US20250071938A1

公开(公告)日：2025-02-27

申请号：US18897955

申请日：2024-09-26

Applicant: Intel Corporation

Inventor： Jin YANG ,  David SHIA ,  Mohanraj PRABHUGOUD ,  Olaotan ELENITOBA-JOHNSON ,  Craig JAHNE ,  Phil GENG

IPC: H05K7/20

Abstract: Examples described herein relate to a cold plate. An example apparatus includes a first layer with one or more channels to receive fluid. The example apparatus further includes a second layer that is more rigid than the first layer. The second layer is to be mounted to the first layer and separated from the first layer by a gasket to reduce corrosion of the second layer.

公开(公告)号：US20240242740A1

公开(公告)日：2024-07-18

申请号：US18622813

申请日：2024-03-29

Applicant: Intel Corporation

Inventor： Phil GENG ,  Xiang LI ,  George VERGIS

IPC: G11C5/04 ,  H05K1/14 ,  H05K1/18

CPC classification number: G11C5/04 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/10159 ,  H05K2201/10189

Abstract: A retainer to inhibit movement of dual in-line memory modules (DIMMs) that are removably inserted into connectors attached to a printed circuit board (PCB) of a system. Inhibiting movement of the DIMMs, especially taller DIMMs, such as the higher height 2 U and 4 U DIMMs, mitigates the effects of operational vibration causing intermittent electrical discontinuity between DIMM and the PCB. The retainer inhibits movement of DIMMs at the connector component level by constraining all or a portion of top edges of DIMMs inserted into connectors. The retainer is implemented independently of the design of the system-level chassis. The retainer is shaped into any of a bracket or frame from multiple rigid horizontal, vertical and oblique members that permit airflow to the DIMMs and connectors retained therein.

公开(公告)号：US20220174843A1

公开(公告)日：2022-06-02

申请号：US17676100

申请日：2022-02-18

Applicant: Intel Corporation

Inventor： Phil GENG ,  Ralph V. MIELE ,  David SHIA ,  Sandeep AHUJA ,  Jeffory L. SMALLEY

IPC: H05K7/20 ,  H05K7/14

Abstract: An apparatus is described. The apparatus includes a bolster plate having a first fixturing element and a strap. The strap is positioned along a frame arm of the bolster plate. The strap has a second fixturing element to be fixed to a cooling mass. The strap is to diminish movement of the cooling mass along the frame arm's dimension and a dimension that is orthogonal to the frame arm's dimension. A semiconductor chip package is to be placed in a window opening formed by the bolster plate's frame arms. The cooling mass is to be thermally coupled to the semiconductor chip package.

公开(公告)号：US20210378099A1

公开(公告)日：2021-12-02

申请号：US17381092

申请日：2021-07-20

Applicant: Intel Corporation

Inventor： Phil GENG ,  Timothy Glen HANNA ,  Xiaoning YE ,  Sandeep AHUJA ,  Jacob MCMILLIAN ,  Ralph V. MIELE ,  David SHIA ,  Jeffory L. SMALLEY

IPC: H05K1/18 ,  H01L23/367 ,  H01L23/40 ,  H05K1/02

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package loading assembly having a heat sink and a first magnetic material, the first magnetic material to be mechanically coupled to a first side of a printed circuit board that is opposite a second side of the printed circuit board where input/outputs (I/Os) of the semiconductor chip package interface with the printed circuit board. The first magnetic material to be positioned between the printed circuit board and a second magnetic material. The first magnetic material is to be magnetically attracted to the second magnetic material to impede movement of the heat sink.