公开(公告)号：US12193142B2

公开(公告)日：2025-01-07

申请号：US18063136

申请日：2022-12-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Trevor Timpane ,  Layne A. Berge ,  Patryk Gumann ,  Sean Hart ,  Curtis Eugene Larsen ,  Michael Good

IPC: H05K1/09 ,  G06N10/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/02 ,  H05K3/32 ,  H10N60/81 ,  H05K1/11

Abstract: A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.

公开(公告)号：US11900217B2

公开(公告)日：2024-02-13

申请号：US18055435

申请日：2022-11-15

Applicant: International Business Machines Corporation

Inventor： Nicholas T. Bronn ,  Patryk Gumann ,  Sean Hart ,  Salvatore B. Olivadese

IPC: G06N10/00 ,  H01P3/06 ,  H01P5/08

CPC classification number: G06N10/00 ,  H01P3/06 ,  H01P5/085

Abstract: A quantum computer includes a refrigeration system under vacuum including a containment vessel, a qubit chip contained within a refrigerated vacuum environment defined by the containment vessel. The quantum computer further includes a plurality of interior electromagnetic waveguides and a plurality of exterior electromagnetic waveguides. The quantum computer further includes a hermetic connector assembly operatively connecting the interior electromagnetic waveguides to the exterior electromagnetic waveguides while maintaining the refrigerated vacuum environment. The hermetic connector assembly includes an exterior multi-waveguide connector, an interior multi-waveguide connector, and a dielectric plate arranged between and hermetically sealed with the exterior multi-waveguide connector and the interior multi-waveguide connector. The dielectric plate permits electromagnetic energy when carried by the interior and exterior pluralities of electromagnetic waveguides to pass therethrough.

公开(公告)号：US20230055578A1

公开(公告)日：2023-02-23

申请号：US18048470

申请日：2022-10-21

Applicant: International Business Machines Corporation

Inventor： Nicholas Torleiv Bronn ,  Daniela Florentina Bogorin ,  Patryk Gumann ,  Sean Hart ,  Salvatore Bernardo Olivadese

IPC: G06N10/00 ,  H04L1/00 ,  G06N10/70

Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.

公开(公告)号：US11551125B2

公开(公告)日：2023-01-10

申请号：US16281657

申请日：2019-02-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Nicholas T. Bronn ,  Patryk Gumann ,  Sean Hart ,  Salvatore B. Olivadese

IPC: G06N10/00 ,  H01P3/06 ,  H01P5/08

Abstract: A quantum computer includes a refrigeration system under vacuum including a containment vessel, a qubit chip contained within a refrigerated vacuum environment defined by the containment vessel. The quantum computer further includes a plurality of interior electromagnetic waveguides and a plurality of exterior electromagnetic waveguides. The quantum computer further includes a hermetic connector assembly operatively connecting the interior electromagnetic waveguides to the exterior electromagnetic waveguides while maintaining the refrigerated vacuum environment. The hermetic connector assembly includes an exterior multi-waveguide connector, an interior multi-waveguide connector, and a dielectric plate arranged between and hermetically sealed with the exterior multi-waveguide connector and the interior multi-waveguide connector. The dielectric plate permits electromagnetic energy when carried by the interior and exterior pluralities of electromagnetic waveguides to pass therethrough.

公开(公告)号：US11425841B2

公开(公告)日：2022-08-23

申请号：US16561920

申请日：2019-09-05

Applicant: International Business Machines Corporation

Inventor： Sean Hart ,  Daniela Florentina Bogorin ,  Nicholas Torleiv Bronn ,  Patryk Gumann ,  Salvatore Bernardo Olivadese

IPC: H05K7/20 ,  G06N10/00 ,  F25B9/12 ,  F25D3/10 ,  G06F1/20 ,  H01L39/04 ,  H01L39/24

Abstract: Devices, systems, methods, and computer-implemented methods to facilitate employing thermalizing materials in an enclosure for quantum computing devices are provided. According to an embodiment, a system can comprise a quantum computing device and an enclosure having the quantum computing device disposed within the enclosure. The system can further comprise a thermalizing material disposed within the enclosure, with the thermalizing material being adapted to thermally link a cryogenic device to the quantum computing device.

公开(公告)号：US20220221107A1

公开(公告)日：2022-07-14

申请号：US17144932

申请日：2021-01-08

Applicant: International Business Machines Corporation

Inventor： Patryk Gumann ,  Valerio A. Grendanin ,  Sean Hart ,  David C. Mckay ,  Jerry M. Chow ,  David Zarsky ,  Gilbert Bauer

IPC: F17C3/08 ,  F25D19/00

Abstract: Techniques facilitating custom thermal shields for cryogenic environments are provided. In one example, a cryostat can comprise a thermal shield extending between a thermal stage and a base structure coupled to a bottom plate of an outer vacuum chamber. The thermal stage can be coupled to a top plate of the outer vacuum chamber. The thermal shield can provide access to a sample mounting surface encompassed within the thermal shield from a region external to the outer vacuum chamber via the top and bottom plates of the outer vacuum chamber.

公开(公告)号：US20210151575A1

公开(公告)日：2021-05-20

申请号：US16688386

申请日：2019-11-19

Applicant: International Business Machines Corporation

Inventor： Steven J. Holmes ,  Devendra K. Sadana ,  Sean Hart ,  Patryk Gumann ,  Stephen W. Bedell ,  Ning Li

IPC: H01L29/41 ,  G06N10/00 ,  B82Y10/00 ,  B82Y40/00 ,  H01L29/06 ,  H01L39/24 ,  H01L39/10

Abstract: Devices, systems, methods, computer-implemented methods, apparatus, and/or computer program products that can facilitate a suspended Majorana fermion device comprising an ion implant defined nanorod in a semiconducting device are provided. According to an embodiment, a quantum computing device can comprise a Majorana fermion device coupled to an ion implanted region. The quantum computing device can further comprise an encapsulation film coupled to the ion implanted region and a substrate layer. The encapsulation film suspends the Majorana fermion device in the quantum computing device.

公开(公告)号：US12020115B2

公开(公告)日：2024-06-25

申请号：US17026245

申请日：2020-09-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Daniela Florentina Bogorin ,  Nicholas Torleiv Bronn ,  Patryk Gumann ,  Sean Hart ,  Salvatore Bernardo Olivadese

IPC: G06N10/00 ,  F25B9/12 ,  H10N60/12

CPC classification number: G06N10/00 ,  F25B9/12 ,  H10N60/12

Abstract: A quantum computing system includes a dilution refrigerator having a plurality of chambers. A trapped ion computing device includes a first set of qubits in a given chamber of the plurality of chambers of the dilution refrigerator. A superconducting computing device having a second set of superconducting qubits is inside the given chamber of the plurality of chambers of the dilution refrigerator.

公开(公告)号：US11875225B2

公开(公告)日：2024-01-16

申请号：US18048470

申请日：2022-10-21

Applicant: International Business Machines Corporation

Inventor： Nicholas Torleiv Bronn ,  Daniela Florentina Bogorin ,  Patryk Gumann ,  Sean Hart ,  Salvatore Bernardo Olivadese

IPC: H03M13/00 ,  G06N10/00 ,  H04L1/00 ,  G06N10/70 ,  H04B10/90

CPC classification number: G06N10/00 ,  G06N10/70 ,  H04L1/0042 ,  H04L1/0056 ,  H04B10/90

Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.

公开(公告)号：US20230199936A1

公开(公告)日：2023-06-22

申请号：US18063136

申请日：2022-12-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Trevor Timpane ,  Layne A. Berge ,  Patryk Gumann ,  Sean Hart ,  Curtis Eugene Larsen ,  Michael Good

IPC: H05K1/02 ,  G06N10/00 ,  H05K1/09 ,  H05K1/18 ,  H05K3/02 ,  H05K3/32 ,  H10N60/81

CPC classification number: H05K1/0201 ,  G06N10/00 ,  H05K1/0225 ,  H05K1/09 ,  H05K1/18 ,  H05K3/02 ,  H05K3/32 ,  H10N60/81 ,  H05K1/023 ,  H05K1/115

Abstract: A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.