公开(公告)号：US20140170795A1

公开(公告)日：2014-06-19

申请号：US14135519

申请日：2013-12-19

Applicant: Intevac, Inc.

Inventor： Vinay Prabhakar ,  Babak Adibi

IPC: H01L31/18

CPC classification number: H01L31/0516 ,  H01J37/32412 ,  H01J37/32422 ,  H01J37/32623 ,  H01J2237/20 ,  H01J2237/3365 ,  H01L21/266 ,  H01L21/426 ,  H01L31/0682 ,  H01L31/1804 ,  H01L31/188 ,  Y02E10/50 ,  Y02E10/547 ,  Y02P70/521

Abstract: A grid for minimizing effects of ion divergence in plasma ion implant. The plasma grid is made of a flat plate having a plurality of holes, wherein the holes are arranged in a plurality of rows and a plurality of columns thereby forming beamlets of ions that diverge in one direction. A mask is used to form the implanted shapes on the wafer, wherein the holes in the mask are oriented orthogonally to the direction of beamlet divergence.

Abstract translation: 用于最小化离子发散在等离子体离子注入中的网格。 等离子体格栅由具有多个孔的平板制成，其中孔布置成多行和多个列，从而形成沿一个方向发散的离子束。 掩模用于在晶片上形成植入的形状，其中掩模中的孔与子束发散的方向垂直。

公开(公告)号：US20130115764A1

公开(公告)日：2013-05-09

申请号：US13672652

申请日：2012-11-08

Applicant: Intevac, Inc.

Inventor： Terry Pederson ,  Henry Hieslmair ,  Moon Chun ,  Vinay Prabhakar ,  Babak Adibi ,  Terry Bluck

IPC: H01L21/677 ,  H01L21/265

CPC classification number: H01L21/6833 ,  H01L21/26506 ,  H01L21/67745 ,  H01L21/6776 ,  H01L21/681 ,  H01L21/6831 ,  H01L31/1876 ,  H02N13/00 ,  Y02E10/50 ,  Y02P70/521

Abstract: A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers. Cooling channels in the processing chucks are used to create air cushion to assist in aligning the wafers when delivered by the pickup head.

Abstract translation: 用于处理衬底的系统具有真空外壳和位于处理真空外壳内的处理区中的晶片的处理室。 提供两个轨道组件，一个在处理区域的每一侧。 两个卡盘阵列，每个在一个导轨组件上，使得每个卡盘阵列悬挂在一个导轨组件上并支撑多个卡盘。 轨道组件联接到升降机构，其将轨道放置在用于处理的上部位置，并且在较低位置处返回用于装载新晶片的卡盘组件。 拾取头组件将晶片从传送器装载到卡盘组件上。 拾取头具有从晶片的前侧拾取晶片的多个静电卡盘。 处理卡盘中的冷却通道用于产生气垫，以在由拾取头传送时帮助对准晶片。