公开(公告)号：US10593176B2

公开(公告)日：2020-03-17

申请号：US16190209

申请日：2018-11-14

Applicant: InvenSense, Inc.

Inventor： Vamshi Gangumalla ,  Sankalp Dayal ,  Calin Miclaus ,  Karthik Katingari ,  Rob Dick ,  Paul Schreier

IPC: H04N7/18 ,  G08B13/20 ,  G01L13/06 ,  G08B13/08 ,  G01L19/12 ,  G01L19/02 ,  G01L27/00 ,  G01P13/00 ,  G08B29/24

Abstract: A security system for a building comprises a pressure sensor and a computer system communicatively coupled with the pressure system. The pressure sensor coupled to a movable portion of a window in the building. The computer system is configured to: receive a first pressure measurement from the pressure sensor; compare the first pressure measurement to a reference pressure measurement; and based on the comparison, detect that the movable portion of the window has moved.

公开(公告)号：US11499884B2

公开(公告)日：2022-11-15

申请号：US16518879

申请日：2019-07-22

Applicant: InvenSense, Inc.

Inventor： Calin Miclaus ,  Chung-Hsien Lin ,  Jye Ren ,  Tim Piessens ,  Pei-Wen Yen ,  Manish Sharma-Kulamarva

IPC: G01N25/56 ,  G01N27/12 ,  G01L19/06 ,  G01L19/00 ,  G01L9/00 ,  G01N27/22 ,  G01N27/04

Abstract: A device includes a sensor die, an electrical coupling, a substrate, a liquid detection unit, and a housing unit. The sensor die is coupled to the substrate via the electrical coupling. The liquid detection unit electrically is coupled to the sensor die. The housing unit and the substrate are configured to house the sensor die, the liquid detection unit, and the electrical coupling. The housing unit comprises an opening that exposes the sensor die to an environment external to the housing unit. The liquid detection unit detects presence of liquid within an interior environment of the housing unit. In some embodiments, the device further includes a gel filled within the interior environment of the housing unit covering the sensor die and the substrate. The gel, e.g., silicone, fluoro silicone, etc., is configured to protect the sensor die, the electrical coupling, and the substrate from exposure to the liquid.

公开(公告)号：US20220098030A1

公开(公告)日：2022-03-31

申请号：US17549207

申请日：2021-12-13

Applicant: InvenSense, Inc.

Inventor： Pei-Wen Yen ,  Ting-Yuan Liu ,  Jye Ren ,  Chung-Hsien Lin ,  Joseph Seeger ,  Calin Miclaus

IPC: B81B7/00

Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.

公开(公告)号：US10893628B2

公开(公告)日：2021-01-12

申请号：US16246296

申请日：2019-01-11

Applicant: InvenSense, Inc.

Inventor： Sankalp Dayal ,  Vamshi Gangumalla ,  Zaryab Hamavand ,  Calin Miclaus

IPC: H05K7/20 ,  G01F1/88 ,  H05K7/14 ,  G06F1/3296 ,  G06F1/3228

Abstract: A circuit board cooling system comprises a cooling unit comprising fans, pressures sensors that measure air pressure at their locations, and a sensor processing unit coupled with the pressure sensors. The cooling unit operates according to an operating configuration and generates air flow to cool a portion of a circuit board. The pressure sensors comprise a first pressure sensor located between the portion of the circuit board and the cooling unit; and a second pressure sensor located such that the portion of the circuit board is between the second pressure sensor and the cooling unit. A sensor processing unit is configured to: obtain the air pressure data measured by the plurality of pressure sensors; and adjust the operating configuration of the cooling unit based on a cooling specification and a comparison of the obtained air pressure data measured by the first pressure sensor and the second pressure sensor.

公开(公告)号：US20200087142A1

公开(公告)日：2020-03-19

申请号：US16574037

申请日：2019-09-17

Applicant: InvenSense, Inc.

Inventor： Pei-Wen Yen ,  Ting-Yuan Liu ,  Jye Ren ,  Chung-Hsien Lin ,  Joseph Seeger ,  Calin Miclaus

IPC: B81B7/00

Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.