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11.
公开(公告)号:US20230069221A1
公开(公告)日:2023-03-02
申请号:US17961611
申请日:2022-10-07
Applicant: JSR CORPORATION
Inventor: Tomoaki SEKO , Tatsuya Sakai , Kazunori Sakai , Yusuke Anno
Abstract: A composition for resist underlayer film formation, includes: a polysiloxane compound including a first structural unit represented by formula (1); and a solvent. X represents an organic group comprising at least one structure selected from the group consisting of a hydroxy group, a carbonyl group, and an ether bond; a is an integer of 1 to 3, wherein in a case in which a is no less than 2, a plurality of Xs are identical or different from each other; R1 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms, wherein is a group other than X; and b is an integer of 0 to 2, wherein in a case in which b is 2, two R1s are identical or different from each other, and wherein a sum of a and b is no greater than 3.
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公开(公告)号:US11320739B2
公开(公告)日:2022-05-03
申请号:US16100501
申请日:2018-08-10
Applicant: JSR CORPORATION
Inventor: Goji Wakamatsu , Naoya Nosaka , Tsubasa Abe , Kazunori Sakai , Yuushi Matsumura , Hayato Namai
Abstract: A composition for resist underlayer film formation, includes a first compound and a solvent. The first compound includes a first group represented by formula (1) and a partial structure comprising an aromatic ring. In the formula (1), R1 represents a single bond or an oxygen atom, R2 represents a divalent chain or alicyclic hydrocarbon group having 1 to 30 carbon atoms, and * denotes a bonding site to a moiety other than the first group of the first compound. *—R1—R2—CN (1)
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公开(公告)号:US11215928B2
公开(公告)日:2022-01-04
申请号:US16354344
申请日:2019-03-15
Applicant: JSR CORPORATION
Inventor: Kazunori Takanashi , Hiroki Nakatsu , Kazunori Sakai , Ichihiro Miura
IPC: G03F7/11 , C07D265/16 , G03F7/09 , H01L21/027 , C07D413/14 , C09D165/00 , G03F7/16 , C09D161/12
Abstract: A composition for resist underlayer film formation contains: a first compound including at least one oxazine structure fused to an aromatic ring; and a solvent. The first compound preferably includes a partial structure represented by formula (1). In formula (1), R2 to R5 each independently represent a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; Ar1 represents a group obtained by removing (n+3) or (n+2) hydrogen atoms on the aromatic ring from an arene having 6 to 20 carbon atoms; R6 represents a hydroxy group, a halogen atom, a nitro group or a monovalent organic group having 1 to 20 carbon atoms; and n is an integer of 0 to 9.
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公开(公告)号:US20190243247A1
公开(公告)日:2019-08-08
申请号:US16388238
申请日:2019-04-18
Applicant: JSR CORPORATION
Inventor: Naoya NOSAKA , Goji Wakamatsu , Tsubasa Abe , Yuushi Matsumura , Yoshio Takimoto , Shin-ya Nakafuji , Kazunori Sakai
IPC: G03F7/11 , C08G61/02 , C09D165/00 , G03F7/16 , G03F7/20 , G03F7/26 , C07C35/37 , C07C33/28 , C07C35/44 , C07C43/166 , H01L21/027 , H01L21/308
CPC classification number: G03F7/11 , C07C33/28 , C07C35/37 , C07C35/44 , C07C43/166 , C07C2602/42 , C07C2603/20 , C07C2603/50 , C07C2603/54 , C08F299/02 , C08G61/02 , C08G2261/1414 , C08G2261/1422 , C08G2261/1424 , C08G2261/148 , C09D165/00 , G03F7/162 , G03F7/168 , G03F7/20 , G03F7/26 , H01L21/027 , H01L21/0273 , H01L21/3065 , H01L21/3081
Abstract: A composition for resist underlayer film formation contains a compound having a group represented by formula (1), and a solvent. R1 represents an organic group having 2 to 10 carbon atoms and having a valency of (m+n), wherein the carbon atoms include two carbon atoms that are adjacent to each other, with a hydroxy group or an alkoxy group bonding to one of the two carbon atoms, and with a hydrogen atom bonding to another of the two carbon atoms; L1 represents an ethynediyl group or a substituted or unsubstituted ethenediyl group; R2 represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; n is an integer of 1 to 3; * denotes a bonding site to a moiety other than the group represented by the formula (1) in the compound; and m is an integer of 1 to 3.
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