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公开(公告)号：US11066582B2
公开(公告)日：2021-07-20
申请号：US16572797
申请日：2019-09-17
申请人： Milliken & Company
发明人： Shulong Li
IPC分类号： C09J161/14 , C08L15/00 , C08L21/02 , C08L61/12 , C08L9/10 , C08L61/06 , B29D30/38 , B60C1/00 , C08K5/07 , C08L7/02 , C08G8/06 , C08G8/22 , C08G85/00 , C09D161/12 , C09J119/00 , C09J119/02 , C09J161/12 , C09J163/00
摘要： This invention relates to improved adhesion compositions and textile materials and articles treated therewith. The improved adhesion composition comprises a non-crosslinked resorcinol-formaldehyde and/or resorcinol-furfural condensate (or a phenol-formaldehyde condensate that is soluble in water), a rubber latex, and an aldehyde component such as 2-furfuraldehyde. The composition may be applied to textile substrates and used for improving the adhesion between the treated textile substrates and rubber materials. End-use articles that contain the treated textile-rubber composite include, without limitation, automobile tires, belts, and hoses as well as printing blankets.
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公开(公告)号：US20210109448A1
公开(公告)日：2021-04-15
申请号：US17044772
申请日：2019-05-27
IPC分类号： G03F7/11 , C07C39/15 , C07C39/367 , C07C49/83 , C08G8/04 , C09D161/12 , H01L21/027 , H01L21/311
摘要： An object of the present invention is to provide a new compound that is useful as a film forming material for lithography and the like. The above object can be achieved by a compound represented by the following formula (1).
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公开(公告)号：US10514605B2
公开(公告)日：2019-12-24
申请号：US16044159
申请日：2018-07-24
IPC分类号： G03F7/004 , G03F7/11 , G03F7/32 , H01L21/033 , H01L21/311 , H01L21/308 , H01L21/02 , G03F7/09 , C09D161/00 , C08G16/02 , C09D161/34 , C08G14/04 , G03F7/16 , G03F7/20 , G03F7/38 , H01L21/027 , C08G8/04 , C08G8/22 , C09D161/12 , G03F7/039 , G03F7/075 , G03F7/42
摘要： The present invention provides a resist multilayer film-attached substrate, including a substrate and a resist multilayer film formed on the substrate, in which the resist multilayer film has an organic resist underlayer film difficultly soluble in ammonia hydrogen peroxide water, an organic film soluble in ammonia hydrogen peroxide water, a silicon-containing resist middle layer film, and a resist upper layer film laminated on the substrate in the stated order. There can be provided a resist multilayer film-attached substrate that enables a silicon residue modified by dry etching to be easily removed in a wet manner with a removing liquid harmless to a semiconductor apparatus substrate and an organic resist underlayer film required in the patterning process, for example, an ammonia aqueous solution containing hydrogen peroxide called SC1, which is commonly used in the semiconductor manufacturing process.
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公开(公告)号：US10294183B2
公开(公告)日：2019-05-21
申请号：US15125503
申请日：2015-03-13
IPC分类号： G03F7/11 , C07C39/15 , C08G8/04 , C09D161/06 , C07C37/68 , C08G8/10 , C09D161/12 , G03F7/16 , G03F7/20 , G03F7/32
摘要： The compound according to the present invention is represented by a specific formula. The compound according to the present invention has a structure according to the specific formula, and therefore can be applied to a wet process and is excellent in heat resistance and etching resistance. In addition, the compound according to the present invention has such a specific structure, and therefore has a high heat resistance, a relatively high carbon concentration, a relatively low oxygen concentration and also a high solvent solubility. Therefore, the compound according to the present invention can be used to form an underlayer film whose degradation is suppressed at high-temperature baking and which is also excellent in etching resistance to oxygen plasma etching or the like. Furthermore, the compound is also excellent in adhesiveness with a resist layer and therefore can form an excellent resist pattern.
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公开(公告)号：US10047244B2
公开(公告)日：2018-08-14
申请号：US14804507
申请日：2015-07-21
发明人： Daisuke Kori , Tsutomu Ogihara , Motoaki Iwabuchi
IPC分类号： C08G8/20 , C09D161/26 , G03F7/11 , C09D161/12 , C09D165/00 , H01L21/027 , H01L21/311 , C08G8/04 , G03F7/004 , G03F7/039 , G03F7/075 , G03F7/09 , G03F7/20 , G03F7/32 , G03F7/16
摘要： The present invention provides a method for producing a composition for forming an organic film, the composition being used in a process of manufacturing a semiconductor apparatus, the method including the steps of (1) washing a compound having an aromatic skeleton by an acid, (2) preparing a composition solution containing the washed compound, (3) filtering the prepared composition solution through a filter, and (4) putting the filtered composition solution into a container made of an organic resin. There can be provided a method for producing a composition for forming an organic film that can form an organic film in which defects after dry etching are reduced.
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公开(公告)号：US10047186B2
公开(公告)日：2018-08-14
申请号：US15529475
申请日：2015-10-08
申请人： DIC Corporation
发明人： Tomoyuki Imada , Yusuke Sato
摘要： The present invention provides a photosensitive composition having excellent heat resistance, low absorbance at the exposure light at wavelengths of g-line, h-line, and i-line, and satisfactory sensitivity even when the thickness of a resist film is increased, and also provides a resist material, a coating film thereof, a novolac phenol resin suitable for these applications, and a method for producing the phenol resin. Specifically, there is provided a novolac phenol resin produced by reacting a phenolic trinuclear compound (A) with formaldehyde under an acid catalyst, the phenolic trinuclear compound (A) including a phenolic trinuclear compound (A1) produced by condensation reaction of dialkyl-substituted phenol with a hydroxyl group-containing aromatic aldehyde and a phenol trinuclear compound (A2) produced by condensation reaction of dialkyl-substituted phenol having alkyl groups at the 2- and 3-positions, 2- and 5-position, the 3- and 4-positions, or 3- and 5-positions with an aromatic aldehyde not having a hydroxyl group, wherein the molar ratio of the phenolic trinuclear compound (A1) to the phenolic trinuclear compound (A2) is 20:80 to 90:10.
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7.发明授权公开(公告)号：US10017664B2
公开(公告)日：2018-07-10
申请号：US14786044
申请日：2014-05-08
IPC分类号： C07C39/15 , G03F7/11 , G03F7/32 , C07C37/68 , G03F7/16 , C09D179/02 , C09D179/04 , C09D161/12 , G03F7/09 , H01L21/311 , C08G73/06
CPC分类号： C09D179/02 , C08G73/06 , C09D161/12 , C09D179/04 , G03F7/091 , G03F7/094 , H01L21/31138 , H01L21/31144
摘要： Resist underlayer film-forming composition for forming resist underlayer film with high dry etching resistance, wiggling resistance and exerts good flattening property and embedding property for uneven parts, including resin obtained by reacting organic compound A including aromatic ring and aldehyde B having at least two aromatic hydrocarbon ring groups having phenolic hydroxy group and having structure wherein the aromatic hydrocarbon ring groups are bonded through tertiary carbon atom. The aldehyde B may be compound of Formula (1): The obtained resin may have a unit structure of Formula (2): Ar1 and Ar2 each are C6-40 aryl group. The organic compound A including aromatic ring may be aromatic amine or phenolic hydroxy group-containing compound. The composition may contain further solvent, acid and/or acid generator, or crosslinking agent. Forming resist pattern used for semiconductor production, including forming resist underlayer film by applying the resist underlayer film-forming composition onto semiconductor substrate and baking it.
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公开(公告)号：US09751283B2
公开(公告)日：2017-09-05
申请号：US14346194
申请日：2012-09-27
IPC分类号： B32B15/09 , B32B15/092 , B32B15/088 , B32B15/098 , B32B15/08 , B32B27/36 , B65D6/00 , B32B15/18 , B32B27/08 , B32B27/20 , C08J7/04 , C09D167/07 , C09D167/03 , C09D167/06 , B32B1/02 , B32B27/38 , C09D167/02 , C09D167/08 , B32B27/42 , C09D167/04 , C09D167/00 , B32B9/04 , C09D163/10 , C09D161/04 , C09D161/12 , C09D163/08 , C09D161/06 , C09D161/16 , C09D161/14 , C09D163/00 , C09D163/04 , C09D163/06
CPC分类号： B32B15/09 , B32B1/02 , B32B9/041 , B32B15/08 , B32B15/092 , B32B15/098 , B32B15/18 , B32B27/08 , B32B27/20 , B32B27/36 , B32B27/38 , B32B27/42 , B32B2250/03 , B32B2255/06 , B32B2255/205 , B32B2264/00 , B32B2264/102 , B32B2264/104 , B32B2270/00 , B32B2307/306 , B32B2307/518 , B32B2307/558 , B32B2307/702 , B32B2307/714 , B32B2363/00 , B32B2367/00 , B32B2439/66 , B32B2439/70 , B65D7/42 , C08J7/047 , C08J2367/02 , C08J2367/04 , C08J2367/06 , C08J2367/07 , C08J2367/08 , C08J2461/04 , C08J2461/06 , C08J2461/08 , C08J2461/10 , C08J2461/12 , C08J2461/14 , C08J2463/00 , C08J2463/02 , C08J2463/04 , C08J2463/06 , C08J2463/08 , C08J2463/10 , C08J2467/02 , C08J2467/03 , C08J2467/04 , C08J2467/06 , C08J2467/07 , C08J2467/08 , C08J2477/00 , C08J2479/02 , C09D161/04 , C09D161/06 , C09D161/12 , C09D161/14 , C09D161/16 , C09D163/00 , C09D163/04 , C09D163/06 , C09D163/08 , C09D163/10 , C09D167/00 , C09D167/02 , C09D167/025 , C09D167/03 , C09D167/04 , C09D167/06 , C09D167/07 , C09D167/08 , Y10T428/31522 , Y10T428/31529 , Y10T428/31681 , C08K5/0091 , C08L61/04 , C08L63/00 , C08L77/00 , C08L79/02
摘要： The resin-coated metal sheet for containers includes a resin coating layer (A) having a multilayered structure mainly composed of a polyester resin on at least one surface thereof. The resin coating layer (A) includes a resin layer (a1). The resin layer (a1) adheres to the metal sheet, contains (i) a polyester resin, (ii) a phenolic resin, (iii) a metal alkoxide compound and/or a metal chelate compound, (iv) an epoxy resin, and (v) at least one selected from the group consisting of polyamine resins, polyamidoamine resins, and polyamide resins, and is mainly composed of the polyester resin. Preferably, a polyester film (a2) is disposed on the resin layer (a1).
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公开(公告)号：US09693553B2
公开(公告)日：2017-07-04
申请号：US15134806
申请日：2016-04-21
发明人： Curtis Elliott
IPC分类号： A01N25/10 , A61K47/40 , A01N43/653 , A01N43/54 , C02F1/50 , B09C1/08 , B01J20/32 , B09C1/00 , C02F1/28 , C08G8/22 , C08G8/36 , C08G8/38 , C09D161/12 , C09D161/14 , C08G65/26 , C02F1/68 , B01J20/12 , B01J20/26 , A01N37/34 , C02F1/42 , C08G65/328 , C08G65/331 , C09D171/02 , C08G65/337 , C02F3/00 , C02F103/06 , C02F103/08 , C02F101/30
CPC分类号： A01N25/10 , A01N37/34 , A01N43/54 , A01N43/653 , A61K47/40 , B01J20/12 , B01J20/262 , B01J20/267 , B01J20/3204 , B01J20/3272 , B01J20/3293 , B09C1/002 , B09C1/08 , C02F1/285 , C02F1/42 , C02F1/50 , C02F1/683 , C02F1/688 , C02F3/00 , C02F2101/306 , C02F2103/06 , C02F2103/08 , C02F2305/04 , C08G8/22 , C08G8/36 , C08G8/38 , C08G65/2612 , C08G65/328 , C08G65/331 , C08G65/3317 , C08G65/337 , C08L2205/05 , C09D161/12 , C09D161/14 , C09D171/02
摘要： Storage stable polyhydroxylated aromatic ether adducts of polyalkylene oxide are described. Reactive compositions are formed by combining an ether adduct with an aldehyde, optionally further adding a phenolic-aldehyde prepolymer. The reactive compositions are cured by removing water, by acidification, or both. The cured compositions sorb solvated compounds from environments containing water. The cured compositions are also useful for pre-loading with compounds that are subsequently released at a controlled rate into environments containing water.
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公开(公告)号：US2169361A
公开(公告)日：1939-08-15
申请号：US53774631
申请日：1931-05-15
发明人： SIEGFRIED KOHN
IPC分类号： C08G8/20 , C09D161/12
CPC分类号： C08G8/20 , C09D161/12
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