公开(公告)号：US07761274B1

公开(公告)日：2010-07-20

申请号：US09707486

申请日：2000-11-07

Applicant: Jack D. Pippin

Inventor： Jack D. Pippin

IPC: G06F17/50

CPC classification number: G06F1/324 ,  G05D23/19 ,  G05F3/265 ,  G05F3/267 ,  G06F1/206 ,  G06F11/3024 ,  G06F11/3058 ,  G06F11/3093 ,  Y02D10/16 ,  Y10T307/773

Abstract: A temperature-based clock frequency controller is implemented in an integrated circuit such as a microprocessor. The temperature-based clock frequency controller includes a register to store a threshold temperature value, a thermal sensor, and clock adjustment logic to decrease a clock frequency in response to the thermal sensor indicating that the threshold temperature value has been exceeded. In a microprocessor implementation, the microprocessor contains a plurality of thermal sensors each placed in one of a plurality of different locations across the integrated circuit and an averaging mechanism to calculate an average temperature from the plurality of thermal sensors. Threshold adjustment logic increases the threshold temperature value to a new threshold temperature value in response to the thermal sensor indicating that the threshold temperature value has been exceeded. Threshold adjustment logic further lowers the new threshold temperature to detect decreases in temperature. In addition, the microprocessor contains halt logic that halts operation of the microprocessor when the temperature attains a critical temperature.

Abstract translation: 基于温度的时钟频率控制器在诸如微处理器的集成电路中实现。 基于温度的时钟频率控制器包括用于存储阈值温度值的寄存器，热传感器和时钟调整逻辑，以响应于表示已经超过阈值温度值的热传感器来减小时钟频率。 在微处理器实现中，微处理器包含多个热传感器，每个热传感器分别放置在跨越集成电路的多个不同位置中的一个中，并且平均机构用于计算来自多个热传感器的平均温度。 阈值调整逻辑响应于热传感器指示阈值温度值已被超过，将阈值温度值增加到新的阈值温度值。 阈值调整逻辑进一步降低新的阈值温度以检测温度的降低。 此外，微处理器包含停止逻辑，当温度达到临界温度时，停止微处理器的操作。

公开(公告)号：US07587262B1

公开(公告)日：2009-09-08

申请号：US09707448

申请日：2000-11-07

Applicant: Jack D. Pippin

Inventor： Jack D. Pippin

IPC: G05D23/01

CPC classification number: G06F1/324 ,  G05D23/19 ,  G05F3/265 ,  G05F3/267 ,  G06F1/206 ,  G06F11/3024 ,  G06F11/3058 ,  G06F11/3093 ,  Y02D10/16 ,  Y10T307/773

Abstract: A temperature averaging thermal sensor is implemented in an integrated circuit such as a microprocessor. The temperature averaging thermal sensor monitors the temperature of the integrated circuit in a plurality of different locations across the integrated circuit, calculates an average temperature and generates an output to indicate that the average temperature of the integrated circuit has attained a pre-programmed threshold temperature. In a microprocessor implementation, the microprocessor contains a plurality of thermal sensors each placed in one of a plurality of different locations across the integrated circuit and an averaging mechanism to calculate an average temperature from the plurality of thermal sensors. Sense circuitry reads the programmable input values and generates an interrupt when the temperature of the microprocessor reaches a threshold temperature. In addition to a temperature averaging thermal sensor, the microprocessor contains halt logic that halts operation of the microprocessor when the temperature attains a critical temperature.

Abstract translation: 温度平均热传感器在诸如微处理器的集成电路中实现。 温度平均热传感器监测跨越集成电路的多个不同位置的集成电路的温度，计算平均温度并产生输出，以指示集成电路的平均温度达到预编程的阈值温度。 在微处理器实现中，微处理器包含多个热传感器，每个热传感器分别放置在跨越集成电路的多个不同位置中的一个中，并且平均机构用于计算来自多个热传感器的平均温度。 检测电路读取可编程输入值，并在微处理器的温度达到阈值温度时产生中断。 除了温度平均热传感器之外，微处理器还包含停止逻辑，当温度达到临界温度时，微处理器的运行停止。

公开(公告)号：US06980918B2

公开(公告)日：2005-12-27

申请号：US10821292

申请日：2004-04-09

Applicant: Stephen H. Gunther ,  Frank Binns ,  Jack D. Pippin ,  Linda J. Rankin ,  Edward A. Burton ,  Douglas M. Carmean ,  John M. Bauer

Inventor： Stephen H. Gunther ,  Frank Binns ,  Jack D. Pippin ,  Linda J. Rankin ,  Edward A. Burton ,  Douglas M. Carmean ,  John M. Bauer

IPC: G01K7/01 ,  G06F1/20 ,  G06F15/00

CPC classification number: G06F1/206 ,  G01K7/015 ,  G06F1/3237 ,  G06F1/324 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/128 ,  Y02D10/16 ,  Y02D10/172

Abstract: An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visibility element. The temperature detection element includes a temperature sensor for detecting die temperature. The power modulation element may reduce the power consumption of an IC device by directly lowering the power consumption of the IC device, by limiting the speed at which the IC device executes instructions, by limiting the number of instructions executed by the IC device, or by a combination of these techniques. The control element allows for control over the behavior of the thermal management system, and the visibility element allows external devices to monitor the status of the thermal management system.

Abstract translation: 集成的片上热管理系统，提供IC器件的闭环温度控制和执行IC器件热管理的方法。 热管理系统包括温度检测元件，功率调制元件，控制元件和可见度元件。 温度检测元件包括用于检测管芯温度的温度传感器。 功率调制元件可以通过直接降低IC器件的功耗来限制IC器件执行指令的速度，通过限制由IC器件执行的指令的数量，或者通过 这些技术的组合。 控制元件允许控制热管理系统的行为，并且可见性元件允许外部设备监视热管理系统的状态。

公开(公告)号：US06789037B2

公开(公告)日：2004-09-07

申请号：US09784255

申请日：2001-02-14

Applicant: Stephen H. Gunther ,  Frank Binns ,  Jack D. Pippin ,  Linda J. Rankin ,  Edward A. Burton ,  Douglas M. Carmean ,  John M. Bauer

Inventor： Stephen H. Gunther ,  Frank Binns ,  Jack D. Pippin ,  Linda J. Rankin ,  Edward A. Burton ,  Douglas M. Carmean ,  John M. Bauer

IPC: G01K710

CPC classification number: G06F1/206 ,  G01K7/015 ,  G06F1/3237 ,  G06F1/324 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/128 ,  Y02D10/16 ,  Y02D10/172

Abstract: An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visibility element. The temperature detection element includes a temperature sensor for detecting die temperature. The power modulation element may reduce the power consumption of an IC device by directly lowering the power consumption of the IC device, by limiting the speed at which the IC device executes instructions, by limiting the number of instructions executed by the IC device, or by a combination of these techniques. The control element allows for control over the behavior of the thermal management system, and the visibility element allows external devices to monitor the status of the thermal management system.

公开(公告)号：US06393374B1

公开(公告)日：2002-05-21

申请号：US09281237

申请日：1999-03-30

Applicant: Linda J. Rankin ,  Edward A. Burton ,  Stephen H. Gunther ,  Jack D. Pippin

Inventor： Linda J. Rankin ,  Edward A. Burton ,  Stephen H. Gunther ,  Jack D. Pippin

IPC: G01N2500

CPC classification number: G06F1/206 ,  G01K7/015 ,  G06F1/3237 ,  G06F1/324 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/128 ,  Y02D10/16 ,  Y02D10/172

Abstract: A method and apparatus for power throttling to manage the temperature of an IC. A temperature sensor is manufactured on the same die as the IC components. The temperature sensor generates an output in response to junction temperature of the IC components. A state machine is coupled to receive the output of the temperature sensor and to provide power reduction functions in response to the temperature sensor output exceeding a maximum thermal value. The maximum thermal value is less than the maximum allowable temperature of the IC corresponding to maximum power consumption. Thus, the invention reduces power consumption at a thermal value lower that a potentially catastrophic value rather than shutting down the IC when catastrophic failure is imminent.

Abstract translation: 用于节电控制IC的温度的方法和装置。 温度传感器在与IC部件相同的芯片上制造。 温度传感器响应于IC组件的结温而产生输出。 状态机被耦合以接收温度传感器的输出并且响应于温度传感器输出超过最大热值而提供功率降低功能。 最大热值小于对应于最大功耗的IC的最大允许温度。 因此，本发明降低了低于潜在灾难性值的热值的功率消耗，而不是在灾难性故障即将发生时关闭IC。

公开(公告)号：US6006169A

公开(公告)日：1999-12-21

申请号：US1606

申请日：1997-12-31

Applicant: Bal S. Sandhu ,  Jack D. Pippin ,  Edward A. Burton

Inventor： Bal S. Sandhu ,  Jack D. Pippin ,  Edward A. Burton

IPC: G05F3/24 ,  G01K1/00

CPC classification number: G05F3/245

Abstract: An integrated circuit has circuitry formed by a fabrication process. The circuitry has an electrical characteristic that is different from a predetermined value due to variations in the fabrication process. The electrical characteristic is responsive to a level of a current, and a current source of the integrated circuit is configured to be selectably enabled to adjust the level of the current to move the electrical characteristic closer to the predetermined value.

Abstract translation: 集成电路具有通过制造工艺形成的电路。 电路具有由于制造工艺的变化而与预定值不同的电特性。 电特性响应于电流水平，并且集成电路的电流源被配置为可选择地使能以调整电流的电平以将电特性更接近预定值。