-
公开(公告)号：US06773576B2
公开(公告)日：2004-08-10
申请号：US10251377
申请日：2002-09-20
IPC分类号： C25F302
摘要： A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.
摘要翻译： 可以使用特定的阳极组件来提供用于在半导体晶片上进行的电镀操作，平面化操作和电镀和平面化操作中的任何一种的解决方案。 阳极组件包括设置在其中执行操作的室内的可旋转轴，连接到轴的阳极壳体和附接到阳极壳体的多孔垫支撑板。 支撑板具有适于支撑面向晶片的焊盘的顶表面，并且与阳极壳体一起限定阳极腔。 可以在阳极腔中设置消耗性阳极以向溶液提供电镀材料。 还提供了可以将溶液输送到所述阳极腔的溶液输送结构。 溶液输送结构可以包含在进行操作的室内。 护罩还可以安装在轴和相关主轴之间，以防止溶液从腔室泄漏。
-
公开(公告)号：US06884334B2
公开(公告)日：2005-04-26
申请号：US10041058
申请日：2001-12-28
申请人： Konstantin Volodarsky , Boguslaw A. Nigorski , Rimma Volodarsky , Douglas W. Young , Cyprian Uzoh , Homayoun Talieh
发明人： Konstantin Volodarsky , Boguslaw A. Nigorski , Rimma Volodarsky , Douglas W. Young , Cyprian Uzoh , Homayoun Talieh
IPC分类号： C25D7/12 , H01L21/00 , H01L21/02 , H01L21/3063 , C25D5/00
CPC分类号： H01L21/6719 , C25D7/12 , C25D17/001 , H01L21/67028 , Y10S134/902
摘要： The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.
摘要翻译： 本发明涉及一种用于进行多个处理步骤的容纳室，例如沉积，抛光，蚀刻，改性，漂洗，清洁和干燥工件上的表面。 在本发明的一个实例中，室用于在半导体晶片上化学机械地沉积导电材料。 然后可以使用相同的容纳室来冲洗和清洁相同的晶片。 结果，本发明消除了对用于沉积导电材料和清洁晶片的单独处理站的需要。 因此，利用本发明，降低了成本和物理空间，同时提供了使用容纳室在晶片表面上执行多个工艺的有效的装置和方法。
-
公开(公告)号：US20050040049A1
公开(公告)日：2005-02-24
申请号：US10914490
申请日：2004-08-10
IPC分类号： B23H7/00 , C25D5/08 , C25D7/12 , C25D17/10 , H01L21/288 , H01L21/768
CPC分类号： C25D17/001 , C25D5/08 , C25D17/008 , C25D17/10 , H01L21/2885 , H01L21/7684 , H01L21/76877
摘要： A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.
摘要翻译： 可以使用特定的阳极组件来提供用于在半导体晶片上进行的电镀操作，平面化操作和电镀和平面化操作中的任何一种的解决方案。 阳极组件包括设置在其中执行操作的室内的可旋转轴，连接到轴的阳极壳体和附接到阳极壳体的多孔垫支撑板。 支撑板具有适于支撑面向晶片的焊盘的顶表面，并且与阳极壳体一起限定阳极腔。 可以在阳极腔中设置消耗性阳极以向溶液提供电镀材料。 还提供了可以将溶液输送到所述阳极腔的溶液输送结构。 溶液输送结构可以包含在进行操作的室内。 护罩还可以安装在轴和相关主轴之间，以防止溶液从腔室泄漏。
-
公开(公告)号：US06352623B1
公开(公告)日：2002-03-05
申请号：US09466014
申请日：1999-12-17
申请人： Konstantin Volodarsky , Boguslaw A. Nagorski , Rimma Volodarsky , Douglas W. Young , Cyprian Uzoh , Homayoun Talieh
发明人： Konstantin Volodarsky , Boguslaw A. Nagorski , Rimma Volodarsky , Douglas W. Young , Cyprian Uzoh , Homayoun Talieh
IPC分类号： C25B900
CPC分类号： H01L21/6719 , C25D7/12 , C25D17/001 , H01L21/67028 , Y10S134/902
摘要： The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.
-
公开(公告)号：US06478936B1
公开(公告)日：2002-11-12
申请号：US09568584
申请日：2000-05-11
IPC分类号： C25B1103
摘要： A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.
摘要翻译： 可以使用特定的阳极组件来提供用于在半导体晶片上进行的电镀操作，平面化操作和电镀和平面化操作中的任何一种的解决方案。 阳极组件包括设置在其中执行操作的室内的可旋转轴，连接到轴的阳极壳体和附接到阳极壳体的多孔垫支撑板。 支撑板具有适于支撑面向晶片的焊盘的顶表面，并且与阳极壳体一起限定阳极腔。 可以在阳极腔中设置消耗性阳极以向溶液提供电镀材料。 还提供了可以将溶液输送到所述阳极腔的溶液输送结构。 溶液输送结构可以包含在进行操作的室内。 护罩还可以安装在轴和相关主轴之间，以防止溶液从腔室泄漏。
-
16.发明授权
公开(公告)号：US5913714A
公开(公告)日：1999-06-22
申请号：US153817
申请日：1998-09-15
IPC分类号： B24B37/04 , B24B41/047 , B24B53/007 , B24B1/00
CPC分类号： B24B37/30 , B24B37/04 , B24B41/047 , B24B53/017
摘要： A polishing pad dressing method uses a polishing head for polishing a semiconductor wafer. This polishing head includes a housing, a wafer carrier movably mounted to the housing, and a pad dressing element movably mounted to the housing. The wafer carrier forms a wafer-supporting surface, and the dressing element surrounds the wafer-supporting surface. A first fluid actuator is coupled to the dressing element to bias the pad dressing element with respect to the housing, and a second fluid actuator is coupled to the wafer carrier to bias the wafer carrier with respect to the housing. First and second fluid conduits are coupled to the first and second actuators, respectively, such that fluid pressures in the first and second actuators are separately and independently adjustable with respect to one another. Biasing forces on the dressing element can thereby be dynamically adjusted with respect to biasing forces on the carrier during a polishing operation.
摘要翻译： 抛光垫修整方法使用用于抛光半导体晶片的抛光头。 该抛光头包括壳体，可移动地安装到壳体的晶片载体和可移动地安装到壳体的垫修整元件。 晶片载体形成晶片支撑表面，并且修整元件围绕晶片支撑表面。 第一流体致动器联接到修整元件以相对于壳体偏置衬垫修整元件，并且第二流体致动器联接到晶片载体以相对于壳体偏置晶片载体。 第一和第二流体管道分别联接到第一和第二致动器，使得第一和第二致动器中的流体压力彼此独立且可独立地调节。 因此，可以在抛光操作期间相对于载体上的偏压力动态地调整修整元件上的偏压力。
-
公开(公告)号：US06612915B1
公开(公告)日：2003-09-02
申请号：US09472523
申请日：1999-12-27
IPC分类号： B24B700
摘要： A work piece carrier head can carry a semiconductor wafer during both plating and polishing operations. The carrier head includes a first component secured to a shaft by which the carrier head can be rotated, translated, and moved up and down, a second component connected to the first component and movable by fluid pressure relative to the first component between retracted and extended positions, and a third component connected to the first and second components for up and down movement between wafer loading or unloading and wafer plating or polishing positions. The third carrier head component includes a contact element by which electrical contact with the wafer is provided to permit wafer plating.
摘要翻译： 工件载体头可以在电镀和抛光操作期间承载半导体晶片。 承载头包括固定到轴的第一部件，承载头可以通过该第一部件旋转，平移和上下移动;第二部件，连接到第一部件并且可相对于第一部件在流体压力下相对于第一部件在缩回和延伸之间移动 位置，以及连接到第一和第二部件的第三部件，用于晶片装载或卸载以及晶片电镀或抛光位置之间的上下移动。 第三载体头部件包括接触元件，通过该接触元件提供与晶片的电接触以允许晶片电镀。
-
公开(公告)号：US06533646B2
公开(公告)日：2003-03-18
申请号：US09745653
申请日：2000-12-21
IPC分类号： B24B722
CPC分类号： B24B37/30
摘要： A polishing head for performing chemical-mechanical polishing on a linear polisher has a dual stage wafer carrier assembly that incorporates a removable subcarrier. When in use, a main pressure chamber exerts a downforce on the subcarrier housing, while a separate secondary pressure chamber residing between the subcarrier housing and the subcarrier exerts a slightly different downforce on the subcarrier. Since the second pressure chamber exerts the downforce pressure directly on the subcarrier, the direct pressure application, as well as a more uniform distribution of pressure ensures for an improvement to the uniformity of pressure distribution. Additionally, the easily removal subcarrier allows for faster and easier removal of the subcarrier for cleaning and maintenance, as well as for changing inserts and improving process repeatability.
摘要翻译： 用于在线性抛光机上进行化学机械抛光的抛光头具有结合可拆卸副载波的双级晶片载体组件。 当使用时，主压力室在副载波壳体上施加下压力，而位于副载波壳体和副载波之间的单独的次级压力室在副载波上施加稍微不同的下压力。 由于第二压力室直接在副载波上施加下压力，所以直接施加压力以及更均匀的压力分布确保了压力分布的均匀性的改善。 此外，容易去除副载波允许更快更容易地去除用于清洁和维护的子载波，以及用于改变插入件并提高过程重复性。
-
公开(公告)号：US06244946B1
公开(公告)日：2001-06-12
申请号：US08838381
申请日：1997-04-08
IPC分类号： B24B722
CPC分类号： B24B37/30
摘要： A polishing head for performing chemical-mechanical polishing on a linear polisher has a dual stage wafer carrier assembly that incorporates a removable subcarrier. When in use, a main pressure chamber exerts a downforce on the subcarrier housing, while a separate secondary pressure chamber residing between the subcarrier housing and the subcarrier exerts a slightly different downforce on the subcarrier. Since the second pressure chamber exerts the downforce pressure directly on the subcarrier, the direct pressure application, as well as a more uniform distribution of pressure ensures for an improvement to the uniformity of pressure distribution. Additionally, the easily removal subcarrier allows for faster and easier removal of the subcarrier for cleaning and maintenance, as well as for changing inserts and improving process repeatability.
摘要翻译： 用于在线性抛光机上进行化学机械抛光的抛光头具有结合可拆卸副载波的双级晶片载体组件。 当使用时，主压力室在副载波壳体上施加下压力，而位于副载波壳体和副载波之间的单独的次级压力室在副载波上施加稍微不同的下压力。 由于第二压力室直接在副载波上施加下压力，所以直接施加压力以及更均匀的压力分布确保了压力分布的均匀性的改善。 此外，容易去除副载波允许更快更容易地去除用于清洁和维护的子载波，以及用于改变插入件并提高过程重复性。
-
20.发明授权Polishing head for chemical mechanical polishing using linear planarization technology 失效抛光头采用线性平面化技术进行化学机械抛光公开(公告)号：US06425812B1
公开(公告)日：2002-07-30
申请号：US09475543
申请日：1999-12-30
IPC分类号： B24B722
CPC分类号： B24B37/30
摘要： A polishing head for performing chemical-mechanical polishing on a linear polisher has a flexible diaphragm coupling between a wafer carrier and a support housing which houses the wafer carrier. The diaphragm allows the carrier to move-substantially in the vertical direction within the housing, but a center shaft assembly limits movement in the horizontal direction.
摘要翻译： 用于在线性抛光机上进行化学机械抛光的抛光头具有在晶片载体和容纳晶片载体的支撑壳体之间的柔性膜片联接。 隔膜允许载体基本上在壳体内沿垂直方向移动，但是中心轴组件限制了在水平方向上的移动。
-
-
-
-
-
-
-
-
-
搜索结果
25 条记录 (耗时 0.018 秒)
