Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
    2.
    发明授权
    Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization 失效
    用于调理用于化学机械平面化的抛光垫的方法和装置

    公开(公告)号:US06328637B1

    公开(公告)日:2001-12-11

    申请号:US09612992

    申请日:2000-07-10

    IPC分类号: B24B100

    CPC分类号: B24B53/017 B24B49/16 B24D5/02

    摘要: A method and apparatus for conditioning a polishing pad is described. The method includes steps of moving a cylindrical roller having an abrasive substance affixed to it against a moving polishing pad. The roller may be passively rotated by contact with the polishing pad, or actively reciprocated, while maintaining a pressure against the polishing pad. The apparatus includes a cylindrical roller attached to one or more pressure application devices mechanically connected to the roller.

    摘要翻译: 描述了一种用于调节抛光垫的方法和装置。 该方法包括将具有固定在其上的磨料的圆柱滚子移动到移动的抛光垫上的步骤。 辊可以通过与抛光垫接触而被动地旋转,或者主动往复运动,同时保持对抛光垫的压力。 该装置包括一个连接到一个或多个压力施加装置的圆柱滚子,该压力施加装置机械地连接到滚子上。

    FAST SUBSTRATE LOADING ON POLISHING HEAD WITHOUT MEMBRANE INFLATION STEP
    7.
    发明申请
    FAST SUBSTRATE LOADING ON POLISHING HEAD WITHOUT MEMBRANE INFLATION STEP 有权
    快速底板装载在无膜渗透步骤的抛光头上

    公开(公告)号:US20070289124A1

    公开(公告)日:2007-12-20

    申请号:US11757069

    申请日:2007-06-01

    IPC分类号: H05K13/04

    摘要: The present invention relates to an apparatus and method for improving and speeding up substrate loading process. One embodiment provides a method for vacuum chucking a substrate. The method comprises venting a center chamber of a flexible membrane configured for mounting the substrate, moving the substrate such that a backside of the substrate is in full contact with the flexible membrane, and vacuuming the center chamber to vacuum chuck the backside of the substrate to the flexible membrane.

    摘要翻译: 本发明涉及一种用于改善和加速基板加载过程的装置和方法。 一个实施例提供了用于真空吸附衬底的方法。 该方法包括将配置用于安装衬底的柔性膜的中心室排出,移动衬底,使得衬底的背面与柔性膜完全接触,并且抽真空中心室以将衬底的背面真空吸附到 柔性膜。

    Carrier head with a vibration reduction feature for a chemical mechanical polishing system
    8.
    发明授权
    Carrier head with a vibration reduction feature for a chemical mechanical polishing system 有权
    具有用于化学机械抛光系统的减振特征的承载头

    公开(公告)号:US06739958B2

    公开(公告)日:2004-05-25

    申请号:US10102083

    申请日:2002-03-19

    IPC分类号: B24B2900

    CPC分类号: B24B37/30

    摘要: Embodiments of the present invention are directed to a carrier head for positioning a substrate on a polishing surface. The carrier head includes a housing connectable to a drive shaft to rotate therewith; a base; a detachable plate removably mounted on top of the housing; a gimbal mechanism connecting the housing to the base to permit the base to move with respect to the housing such that the base remains substantially parallel to the polishing surface; and a flexible membrane defining a mounting surface for the substrate.

    摘要翻译: 本发明的实施例涉及一种用于将基板定位在抛光表面上的载体头。 承载头包括可连接到驱动轴以与其一起旋转的壳体; 一个基地 可拆卸地安装在所述壳体的顶部上的可拆卸板; 将所述壳体连接到所述基座的万向架机构,以允许所述基座相对于所述壳体移动,使得所述基座保持基本上平行于所述抛光表面; 以及限定用于基底的安装表面的柔性膜。

    Platen for retaining polishing material
    9.
    发明授权
    Platen for retaining polishing material 有权
    压板用于保留抛光材料

    公开(公告)号:US06592439B1

    公开(公告)日:2003-07-15

    申请号:US09709769

    申请日:2000-11-10

    IPC分类号: B24B2900

    摘要: Generally, a method and apparatus for retaining polishing material is provided. In one embodiment, the apparatus includes a platen having a top surface, a plurality of channels and one or more vacuum ports. The top surface is adapted to support the polishing material. The plurality of channels are formed in a polishing area of the top surface. The vacuum ports are disposed in the platen and at least one port is in communication with at least one of the channels. Upon application of a vacuum to the ports, the channels remove fluids under the polishing material while securing the polishing material to the top surface.

    摘要翻译: 通常,提供了用于保持抛光材料的方法和装置。 在一个实施例中,该装置包括具有顶表面,多个通道和一个或多个真空端口的压板。 顶表面适于支撑抛光材料。 多个通道形成在顶表面的抛光区域中。 真空端口设置在压板中,并且至少一个端口与至少一个通道连通。 当向端口施加真空时,通道在将抛光材料固定到顶表面的同时移除抛光材料下面的流体。

    Fast substrate loading on polishing head without membrane inflation step
    10.
    发明授权
    Fast substrate loading on polishing head without membrane inflation step 有权
    抛光头上的快速衬底加载,无膜充气步骤

    公开(公告)号:US07527271B2

    公开(公告)日:2009-05-05

    申请号:US11757069

    申请日:2007-06-01

    IPC分类号: B23B31/30

    摘要: The present invention relates to an apparatus and method for improving and speeding up substrate loading process. One embodiment provides a method for vacuum chucking a substrate. The method comprises venting a center chamber of a flexible membrane configured for mounting the substrate, moving the substrate such that a backside of the substrate is in full contact with the flexible membrane, and vacuuming the center chamber to vacuum chuck the backside of the substrate to the flexible membrane.

    摘要翻译: 本发明涉及一种用于改善和加速基板加载过程的装置和方法。 一个实施例提供了用于真空吸附衬底的方法。 该方法包括将配置用于安装衬底的柔性膜的中心室排出,移动衬底,使得衬底的背面与柔性膜完全接触,并且抽真空中心室以将衬底的背面真空吸附到 柔性膜。