-
公开(公告)号：US07520285B2
公开(公告)日：2009-04-21
申请号：US10957260
申请日：2004-09-30
申请人： James P. Garcia
发明人： James P. Garcia
IPC分类号： B08B3/00
CPC分类号： H01L21/67028 , H01L21/02057 , H01L21/6704 , H01L21/67051 , Y10S134/902
摘要： A method for processing a substrate is provided which includes applying fluid onto a surface of the substrate from a portion of a plurality of inlets and removing at least the fluid from the surface of the substrate where the removing being processed as the fluid is applied to the surface. The applying the fluid and the removing the fluid forms a segment of a fluid meniscus on the surface of the substrate.
摘要翻译： 提供了一种用于处理基板的方法，其包括从多个入口的一部分将流体施加到基板的表面上，并且至少从基板的表面去除流体，其中当流体被施加到所述基板 表面。 施加流体和除去流体在衬底的表面上形成流体弯液面的一段。
-
12.发明授权Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces 有权使用多个保持在晶片表面附近的入口和出口来干燥半导体晶片表面的方法和装置公开(公告)号：US07234477B2
公开(公告)日：2007-06-26
申请号：US10261839
申请日：2002-09-30
申请人： John M. de Larios , Mike Ravkin , Carl Woods , Fritz Redeker , James P. Garcia , Afshin Nickhou
发明人： John M. de Larios , Mike Ravkin , Carl Woods , Fritz Redeker , James P. Garcia , Afshin Nickhou
CPC分类号： H01L21/67051 , B08B3/04 , G03F7/30 , H01L21/67028 , H01L21/67034 , Y10S134/902
摘要： One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously.
摘要翻译： 提供了一种衬底制备系统的许多实施例之一，其包括具有头表面的头部，其头表面靠近衬底的表面。 该系统还包括用于通过头部将第一流体输送到基底表面的第一导管和用于通过头部将第二流体输送到基底表面的第二导管，其中第二流体不同于第一流体 流体。 该系统还包括第三导管，用于从基板的表面移除第一流体和第二流体中的每一个，其中第一导管，第二导管和第三导管基本上同时作用。
-
13.发明授权Substrate processing using a fluid re-circulation system in a wafer scrubbing system 失效使用晶片洗涤系统中的流体再循环系统的基板处理公开(公告)号：US06851436B1
公开(公告)日：2005-02-08
申请号：US10186908
申请日：2002-06-28
CPC分类号： H01L21/67046 , B08B3/00 , B08B3/04 , Y10S134/902
摘要： A system and method for re-circulating processing fluids in a substrate processing system is provided. A fluid re-circulation system for a brush box processing tool includes a supply tank into which processing chemicals, DI water, or other processing fluids are introduced into the system from an external source. Processing chemicals are provided to the brush box and dispensed to process a substrate. Dispensed fluids drain from the brush box into a diverter through which fluids either flow to waste, or into a collection tank. Fluids from the collection tank flow into the supply tank to re-circulate for wafer processing. The re-circulation system includes filters for maintaining chemical purity, and chemical concentration is monitored and adjusted as necessary.
摘要翻译： 提供了一种用于在基板处理系统中再循环处理流体的系统和方法。 用于刷盒处理工具的流体再循环系统包括供料罐，其中处理化学品，去离子水或其它处理流体从外部源引入其中。 将处理化学品提供给刷盒并分配以处理基底。 分配的流体从刷子箱排出到分流器中，流体通过该分流器流动到废物处，或者进入收集罐。 来自收集罐的流体流入供应罐以重新循环用于晶片处理。 再循环系统包括保持化学纯度的过滤器，并根据需要对化学浓度进行监测和调整。
-
公开(公告)号：US07389783B2
公开(公告)日：2008-06-24
申请号：US10817133
申请日：2004-04-01
IPC分类号： B08B3/02
CPC分类号： H01L21/67063 , B05C9/02 , H01L21/02052 , H01L21/67023 , H01L21/67028 , H01L21/67034 , H01L21/6704 , H01L21/67051 , H01L21/6708 , Y10S134/902
摘要： An apparatus for processing a substrate is provided which includes a first manifold module to generate a fluid meniscus on a substrate surface. The apparatus also includes a second manifold module to connect with the first manifold module and also to move the first manifold module into close proximity to the substrate surface to generate the fluid meniscus.
摘要翻译： 提供了一种用于处理衬底的设备，其包括用于在衬底表面上产生流体弯液面的第一歧管模块。 该装置还包括与第一歧管模块连接并且还将第一歧管模块移动到靠近衬底表面以产生流体弯液面的第二歧管模块。
-
公开(公告)号：US07862663B2
公开(公告)日：2011-01-04
申请号：US12381643
申请日：2009-03-13
申请人： James P. Garcia
发明人： James P. Garcia
IPC分类号： B08B3/00
CPC分类号： H01L21/67028 , H01L21/02057 , H01L21/6704 , H01L21/67051 , Y10S134/902
摘要： A method for processing a substrate is provided which includes applying fluid onto a surface of the substrate from a portion of a plurality of inlets and removing at least the fluid from the surface of the substrate where the removing being processed as the fluid is applied to the surface. The applying the fluid and the removing the fluid forms a segment of a fluid meniscus on the surface of the substrate.
摘要翻译： 提供了一种用于处理基板的方法，其包括从多个入口的一部分将流体施加到基板的表面上，并且至少从基板的表面去除流体，其中当流体被施加到所述基板 表面。 施加流体和除去流体在衬底的表面上形成流体弯液面的一段。
-
公开(公告)号：US20090037028A1
公开(公告)日：2009-02-05
申请号：US11664188
申请日：2005-09-22
申请人： James P. Garcia
发明人： James P. Garcia
CPC分类号： G05D11/132
摘要： A dispensing measuring system for dispensing a measure of fluid for use with a system to treat semiconductor workpieces is disclosed. The dispensing measuring system includes at least one feedline having a receiving tank having a volumetric capacity for receiving a measure of fluid. A sensor senses when the receiving tank has received the measure of fluid. A mix tank is attached to the at least one feedline for receiving the measure of fluid from the receiving tank to create a batch of fluid. A controller is electrically connected to the at least one feedline to control the flow of fluid through the at least one feedline. The controller is electrically connected to the mix tank. A connecting line is attached to the mix tank.
摘要翻译： 公开了一种用于分配与用于处理半导体工件的系统一起使用的流体测量的分配测量系统。 所述分配测量系统包括至少一个馈线，所述馈线具有接收罐，所述接收罐具有用于接收流体测量的容积。 传感器感测接收罐何时已经接收到流体的测量。 混合罐附接到至少一个进料管线，用于接收来自接收罐的流体测量值以产生一批流体。 控制器电连接到至少一个馈线以控制通过至少一个馈线的流体流。 控制器电连接到混合罐。 连接线连接到混合罐。
-
17.发明授权Methods for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces 失效使用保持在晶片表面附近的多个入口和出口干燥半导体晶片表面的方法公开(公告)号：US07387689B2
公开(公告)日：2008-06-17
申请号：US11750960
申请日：2007-05-18
申请人： John M. de Larios , Mike Ravkin , Carl Woods , Fritz Redeker , James P. Garcia
发明人： John M. de Larios , Mike Ravkin , Carl Woods , Fritz Redeker , James P. Garcia
CPC分类号： H01L21/67051 , B08B3/04 , G03F7/30 , H01L21/67028 , H01L21/67034 , Y10S134/902
摘要： Methods for processing substrate through a head that is configured to be placed in close non-contact proximity to a surface of a substrate are provided. One method includes applying a first fluid onto the surface of the substrate from conduits in the head when the head is in close proximity to the surface of the substrate and removing the first fluid from the surface of the substrate. The removing is processed just as first fluid is applied to the surface of the substrate, and the removing ensures that the applied first fluid is contained between a surface of the head and the surface of the substrate and the first fluid being applied and removed defines a controlled meniscus. The method further includes moving the controlled meniscus over different regions of the surface of the substrate when movement of the head or the substrate is dictated. The moving of the controlled meniscus enables processing of part or all of the surface of the substrate using the first fluid.
摘要翻译： 提供了通过头部处理基板的方法，该头被配置为与基板的表面紧密非接触地放置。 一种方法包括当头部紧邻衬底的表面并从衬底的表面去除第一流体时，将第一流体施加到衬底表面上的管道中。 当第一流体被施加到基板的表面上时，移除被处理，并且移除确保所施加的第一流体被包含在头部的表面和基底的表面之间，并且被施加和移除的第一流体限定了 受控半月板 所述方法还包括当限制头部或基底的运动时，将受控弯液面移动到衬底的表面的不同区域上。 受控弯液面的移动使得能够使用第一流体处理基板的部分或全部表面。
-
公开(公告)号：US06910240B1
公开(公告)日：2005-06-28
申请号：US10321688
申请日：2002-12-16
申请人： John M. Boyd , Fred C. Redecker , James P. Garcia
发明人： John M. Boyd , Fred C. Redecker , James P. Garcia
CPC分类号： H01L21/67046 , B08B1/04 , G11B23/505
摘要： A system, method and apparatus for cleaning a substrate edge includes a substrate supporting device for substantially supporting a substrate in a selected plane. The substrate has a circular shape, a circumferential edge, a front side and a back side. The edge has a bevel shaped cross-section. The substrate edge cleaning apparatus also includes a first edge cleaning roller that has an open curved scrubbing surface in contact with at least part of a first portion the edge of the substrate. An interaction of the first edge cleaning roller with the part of the first portion can also be adjusted dynamically.
摘要翻译： 用于清洁衬底边缘的系统，方法和装置包括用于在选定平面内基本上支撑衬底的衬底支撑装置。 基板具有圆形，圆周边缘，前侧和后侧。 该边缘具有斜面形状的横截面。 基板边缘清洁装置还包括第一边缘清洁辊，其具有与基板的边缘的第一部分的至少一部分接触的开放的弯曲洗涤表面。 也可以动态地调整第一边缘清洁辊与第一部分的一部分的相互作用。
-
公开(公告)号：US20090176360A1
公开(公告)日：2009-07-09
申请号：US12381643
申请日：2009-03-13
申请人： James P. Garcia
发明人： James P. Garcia
IPC分类号： H01L21/441 , B08B7/04 , H01L21/306
CPC分类号： H01L21/67028 , H01L21/02057 , H01L21/6704 , H01L21/67051 , Y10S134/902
摘要： A method for processing a substrate is provided which includes applying fluid onto a surface of the substrate from a portion of a plurality of inlets and removing at least the fluid from the surface of the substrate where the removing being processed as the fluid is applied to the surface. The applying the fluid and the removing the fluid forms a segment of a fluid meniscus on the surface of the substrate.
摘要翻译： 提供了一种用于处理基板的方法，其包括从多个入口的一部分将流体施加到基板的表面上，并且至少从基板的表面去除流体，其中当流体被施加到所述基板 表面。 施加流体和除去流体在衬底的表面上形成流体弯液面的一段。
-
20.发明授权Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus 失效使用动态液体弯月面处理衬底的斜边缘的方法和系统公开(公告)号：US07192488B2
公开(公告)日：2007-03-20
申请号：US11292490
申请日：2005-12-01
CPC分类号： B08B3/04 , H01L21/67028 , H01L21/67034 , H01L21/67051 , Y10S134/902
摘要： A system and method for processing an edge of a substrate includes an edge roller and a first proximity head. The first proximity head being mounted on the edge roller. The first proximity head capable of forming a meniscus and including a concave portion and multiple ports opening into the concave portion. The concave portion being capable of receiving an edge of a substrate and the ports including at least one process liquid injection port, at least one vacuum port and at least one surface tension control port.
摘要翻译： 用于处理衬底的边缘的系统和方法包括边缘辊和第一邻近头。 第一接近头安装在边缘辊上。 第一接近头部能够形成弯液面并且包括凹入部分和通向凹部的多个端口。 所述凹部能够容纳衬底的边缘，并且所述端口包括至少一个处理液体注入端口，至少一个真空端口和至少一个表面张力控制端口。
-
-
-
-
-
-
-
-
-
搜索结果
22 条记录 (耗时 0.025 秒)