METHOD AND APPARATUS FOR SURFACE TREATMENT OF SEMICONDUCTOR SUBSTRATES USING SEQUENTIAL CHEMICAL APPLICATIONS
    7.
    发明申请
    METHOD AND APPARATUS FOR SURFACE TREATMENT OF SEMICONDUCTOR SUBSTRATES USING SEQUENTIAL CHEMICAL APPLICATIONS 有权
    使用顺序化学应用的表面处理半导体基板的方法和装置

    公开(公告)号:US20100018553A1

    公开(公告)日:2010-01-28

    申请号:US12212559

    申请日:2008-09-17

    IPC分类号: B08B7/04 B08B13/00

    摘要: A system and method for removing polymer residue from around a metal gate structure formed on a surface of a substrate during a post-etch cleaning operation includes determining a plurality of process parameters associated with the metal gate structure and the polymer residue to be removed. A plurality of fabrication layers define the metal gate structure and the process parameters define characteristics of the fabrication layers and the polymer residue. A first cleaning chemistry and second cleaning chemistry are identified and a plurality of application parameters associated with the first and second cleaning chemistries are defined based on the process parameters. The first and second application chemistries are applied sequentially in a controlled manner using the application parameters to substantial remove the polymer residue while preserving the structural integrity of the gate structure.

    摘要翻译: 在蚀刻前清洁操作期间从形成在基板的表面上的金属栅极结构周围除去聚合物残留物的系统和方法包括确定与金属栅极结构和待除去的聚合物残余物相关联的多个工艺参数。 多个制造层限定了金属栅极结构,并且工艺参数限定了制造层和聚合物残余物的特性。 识别第一清洁化学品和第二清洁化学品,并且基于过程参数来定义与第一和第二清洁化学品相关联的多个施用参数。 使用应用参数以受控的方式顺序施加第一和第二施用化学物质,以显着除去聚合物残余物,同时保持栅极结构的结构完整性。

    APPARATUS AND SYSTEM FOR CLEANING A SUBSTRATE
    9.
    发明申请
    APPARATUS AND SYSTEM FOR CLEANING A SUBSTRATE 有权
    用于清洁基板的装置和系统

    公开(公告)号:US20090308413A1

    公开(公告)日:2009-12-17

    申请号:US11532493

    申请日:2006-09-15

    IPC分类号: B08B3/08

    摘要: An apparatus for cleaning a substrate is disclosed. The apparatus having a first head unit and a second head unit. The first head unit is positioned proximate to the surface of the substrate and has a first row of channels defined within configured to supply a foam to the surface of the substrate. The second head unit is positioned substantially adjacent to the first head unit and proximate to the surface of the substrate. A second and a third row of channels are defined within the second head unit. The second row of channels is configured to supply a fluid to the surface of the substrate. The third row of channels is configured to apply a vacuum to the surface of the substrate.

    摘要翻译: 公开了一种用于清洁衬底的设备。 该装置具有第一头单元和第二头单元。 第一头单元定位成接近基底的表面,并且具有限定在构造成向基底的表面提供泡沫的第一排通道。 第二头单元被定位成基本上与第一头单元相邻并且靠近衬底的表面。 第二和第三行通道被限定在第二头单元内。 第二排通道被配置成向衬底的表面提供流体。 第三排通道被配置为向基板的表面施加真空。

    System and method for contained chemical surface treatment
    10.
    发明申请
    System and method for contained chemical surface treatment 失效
    含化学表面处理的系统和方法

    公开(公告)号:US20090114249A1

    公开(公告)日:2009-05-07

    申请号:US11704435

    申请日:2007-02-08

    IPC分类号: B08B3/04

    摘要: An apparatus, system and method for preparing a surface of a substrate using a proximity head includes applying a non-Newtonian fluid between the surface of the substrate and a head surface of the proximity head. The non-Newtonian fluid defines a containment wall along one or more sides between the head surface and the surface of the substrate. The one or more sides provided with the non-Newtonian fluid define a treatment region on the substrate between the head surface and the surface of the substrate. A Newtonian fluid is applied to the surface of the substrate through the proximity head, such that the applied Newtonian fluid is substantially contained in the treatment region defined by the containment wall. The contained Newtonian fluid aids in the removal of one or more contaminants from the surface of the substrate. In one example, the non-Newtonian fluid can also be used to create ambient controlled isolated regions, which can assist in controlled processing of surfaces within the regions. In an alternate example, a second non-Newtonian fluid is applied to the treatment region instead of the Newtonian fluid. The second non-Newtonian fluid acts on one or more contaminants on the surface of the substrate substantially removing them from the surface of the substrate.

    摘要翻译: 使用接近头来制备基底的表面的装置,系统和方法包括在基底的表面和邻近头的头表面之间施加非牛顿流体。 非牛顿流体在头表面和基底表面之间沿着一个或多个侧面限定了容纳壁。 设置有非牛顿流体的一个或多个侧面限定了头表面和基底表面之间的基底上的处理区域。 通过邻近头将牛顿流体施加到基底的表面,使得所施加的牛顿流体基本上包含在由容纳壁限定的处理区域中。 所含的牛顿流体有助于从基底表面去除一种或多种污染物。 在一个示例中,非牛顿流体也可以用于创建环境控制的隔离区域,这可以有助于区域内的表面的受控处理。 在替代示例中,将第二非牛顿流体施加到处理区域而不是牛顿流体。 第二非牛顿流体作用于衬底表面上的一种或多种污染物,基本上将其从衬底的表面上除去。