公开(公告)号：US20110302357A1

公开(公告)日：2011-12-08

申请号：US13153189

申请日：2011-06-03

Applicant: Jason A. Sullivan

Inventor： Jason A. Sullivan

IPC: G06F12/02 ,  G06F13/20 ,  H04N7/01

CPC classification number: G06F13/409 ,  G09G5/006 ,  Y02D10/14 ,  Y02D10/151

Abstract: Systems and methods for dynamic multi-link compilation partitioning. In particular, some implementations of the present invention relate to systems and methods for connecting a computer processing unit to a video display through the use of a wide variety of video display connectors. The present invention further relates to a dynamic interface incorporating USB, PCI-express, SATA, I2C, and power management bus (PMBus) technologies. Further still, some implementations of the present invention relate to an openly connected dynamic storage system whereby the storage capacity of a processing unit is increased by coupling additional storage components to the processing unit via a dynamic interface connector that is interposedly connected. Some implementations of the invention further relate to a customizable grouping of PCIe lanes to provide for a flexible allocation of the lanes to customize the characteristic of the board set, while reducing the power consumption, improving the bandwidth and speed of the device, reducing the cost of the device and providing serial data transfer architecture to provide multiple busses.

Abstract translation: 动态多链路编译分区的系统和方法。 特别地，本发明的一些实现涉及通过使用各种各样的视频显示连接器将计算机处理单元连接到视频显示器的系统和方法。 本发明还涉及一种包含USB，PCI-express，SATA，I2C和电源管理总线（PMBus）技术的动态接口。 此外，本发明的一些实现涉及一种开放连接的动态存储系统，由此通过经由插入式连接的动态接口连接器将附加存储组件耦合到处理单元来增加处理单元的存储容量。 本发明的一些实现还涉及PCIe通道的可定制分组，以提供通道的灵活分配以定制板组的特性，同时降低功耗，提高设备的带宽和速度，降低成本 的设备，并提供串行数据传输架构来提供多个总线。

公开(公告)号：US07817412B2

公开(公告)日：2010-10-19

申请号：US11833852

申请日：2007-08-03

Applicant: Jason A. Sullivan

Inventor： Jason A. Sullivan

IPC: G06F1/16

CPC classification number: H05K5/02 ,  G06F1/16 ,  G06F1/181 ,  G06F1/20

Abstract: The present invention features a non-peripherals-based processing control unit having an encasement module that is very small and durable compared to conventional computer encasement structures. The process control unit is capable of being incorporated into various devices and/or environments, of accepting applied and impact loads, of functioning as a load bearing structure, as well as being able to be processed coupled together with one or more processing control units to provide scaled processing power. The processing control unit of the present invention further features a unique method of cooling using natural convection, as well as utilizing known cooling means, such as liquid or thermoelectric cooling.

Abstract translation: 本发明的特征在于一种非外围设备的处理控制单元，其具有与传统的计算机外壳结构相比非常小和耐用的封装模块。 过程控制单元能够被并入各种装置和/或环境中，以承受用作承载结构的应用和冲击载荷，并且能够被处理与一个或多个处理控制单元耦合在一起 提供缩放的处理能力。 本发明的处理控制单元进一步具有使用自然对流冷却的独特方法，以及利用已知的冷却装置，例如液体或热电冷却。

公开(公告)号：US07256991B2

公开(公告)日：2007-08-14

申请号：US10691473

申请日：2003-10-22

Applicant: Jason A. Sullivan

Inventor： Jason A. Sullivan

IPC: H05K7/00

CPC classification number: H05K5/02 ,  G06F1/16 ,  G06F1/181 ,  G06F1/20

Abstract: The present invention features a non-peripherals-based processing control unit having an encasement module that is very small and durable compared to conventional computer encasement structures. The process control unit is capable of being incorporated into various devices and/or environments, of accepting applied and impact loads, of functioning as a load bearing structure, as well as being able to be processed coupled together with one or more processing control units to provide scaled processing power. The processing control unit of the present invention further features a unique method of cooling using natural convection, as well as utilizing known cooling means, such as liquid or thermoelectric cooling.

Abstract translation: 本发明的特征在于一种非外围设备的处理控制单元，其具有与传统的计算机外壳结构相比非常小和耐用的封装模块。 过程控制单元能够被并入各种装置和/或环境中，以承受用作承载结构的应用和冲击载荷，并且能够被处理与一个或多个处理控制单元耦合在一起 提供缩放的处理能力。 本发明的处理控制单元进一步具有使用自然对流冷却的独特方法，以及利用已知的冷却装置，例如液体或热电冷却。

公开(公告)号：US09606577B2

公开(公告)日：2017-03-28

申请号：US12843304

申请日：2010-07-26

Applicant: Jason A. Sullivan

Inventor： Jason A. Sullivan

IPC: H05K5/00 ,  G06F1/16 ,  G06F1/18 ,  G06F1/20

CPC classification number: G06F1/1616 ,  G06F1/16 ,  G06F1/1601 ,  G06F1/1613 ,  G06F1/1626 ,  G06F1/1632 ,  G06F1/18 ,  G06F1/181 ,  G06F1/20 ,  G06F2200/1631 ,  Y10T29/5313

Abstract: Systems and methods for providing a modular processing unit. A modular processing unit is provided as a platform that is lightweight, compact, and is configured to be selectively used alone or oriented with one or more additional processing units in an enterprise. In some implementations, a modular processing unit includes a non-peripheral based encasement, a cooling process (e.g., a thermodynamic convection cooling process, a forced air cooling process, and/or a liquid cooling process), an optimized circuit board configuration, optimized processing and memory ratios, and a dynamic back plane that provides increased flexibility and support to peripherals and applications. The modular processing unit is customizable and may be employed in association with all types of computer enterprises. The platform allows for a plethora of modifications that may be made with minimal impact to the modular unit, thereby enhancing the usefulness of the platform across all type of application.

公开(公告)号：US20150257297A1

公开(公告)日：2015-09-10

申请号：US14642644

申请日：2015-03-09

Applicant: Jason A. Sullivan

Inventor： Jason A. Sullivan

IPC: H05K5/04 ,  H05K5/03

CPC classification number: H05K5/04 ,  G06F1/1601 ,  G06F1/1613 ,  G06F1/1632 ,  G06F1/1656 ,  G06F1/181 ,  G06F1/20 ,  H05K5/03

Abstract: The present invention features a robust customizable computing system comprising: a processing control unit; an external object; and means for operably connecting the processing control unit to the external object, the processing control unit introducing intelligence into the external object, thus causing the external object to perform smart functions. The processing control unit preferably comprises: (a) an encasement module comprising a main support chassis having a plurality of wall supports and a plurality of junction centers containing means for supporting a computer component therein, a dynamic back plane that provides support for connecting peripheral and other computing components directly to a system bus without requiring an interface, means for enclosing the main support chassis and providing access to an interior portion of the encasement module; (b) one or more computer processing components disposed within the junction centers of the encasement module; and (c) means for cooling the interior portion of the encasement module.

Abstract translation: 本发明具有可靠的可定制计算系统，其包括：处理控制单元; 外部物体 以及用于将所述处理控制单元可操作地连接到所述外部对象的装置，所述处理控制单元将智能引入到所述外部对象中，从而使所述外部对象执行智能功能。 处理控制单元优选地包括：（a）包围模块，其包括具有多个壁支撑件的主支撑底盘和用于在其中支撑计算机部件的多个连接中心容纳装置，动态背板，其提供连接外围设备和 其他计算组件直接连接到系统总线而不需要接口，用于封装主支撑底盘并提供对包装模块的内部部分的访问的装置; （b）一个或多个计算机处理部件，其布置在包装模块的连接中心内; 和（c）用于冷却包装模块的内部部分的装置。

公开(公告)号：US20150254199A1

公开(公告)日：2015-09-10

申请号：US14588854

申请日：2015-01-02

Applicant: Jason A. Sullivan

Inventor： Jason A. Sullivan

IPC: G06F13/38 ,  G06F13/10

CPC classification number: G06F13/385 ,  G06F1/325 ,  G06F13/105

Abstract: Systems and methods for distributing computing resources utilize a base module having certain processing resources. A peripheral module is communicatively connected to the base module and is configured to utilize processing resources of the base module using one or more input/output devices connected to the peripheral module. The peripheral module uses a minimum of power, utilizes only enough computing resources to pass input/output signals between the input/output devices at the peripheral module and the base module, and provides access to an additional session of the operating system of the base module without requiring that a separate instance of the operating system be loaded into memory of the base module. The peripheral module may serve essentially as an intelligent mounting bracket.

Abstract translation: 用于分发计算资源的系统和方法利用具有某些处理资源的基本模块。 外围模块通信地连接到基本模块，并被配置为利用连接到外围模块的一个或多个输入/输出设备利用基本模块的处理资源。 外围模块使用最小功率，仅利用足够的计算资源在外围模块和基本模块之间的输入/输出设备之间传递输入/输出信号，并提供对基本模块操作系统的附加会话的访问 而不需要将操作系统的单独实例加载到基本模块的存储器中。 外围模块可以基本上用作智能安装支架。

公开(公告)号：US20140306586A1

公开(公告)日：2014-10-16

申请号：US14147530

申请日：2014-01-04

Applicant: Jason A. Sullivan

Inventor： Jason A. Sullivan

IPC: G06F1/18 ,  H05K5/02 ,  H05K5/00

CPC classification number: G06F1/181 ,  G06F1/18 ,  H05K5/0004 ,  H05K5/0239

Abstract: Systems and methods for providing modular packaging that includes a base that is configured to receive any of a number of tops or lids, wherein the particular top or lid used in association with the base is determined based upon the volume needed within the overall packaging to contain, support and protect the contents inside the packaging. In at least some implementations, the lid or top is configured to cover the item to be packaged and mate with the base to form an enclosure. The base includes a bottom portion and a top portion such that the combination forms a cavity for inclusion of other items to be packaged along with the item that is enclosed within the top or lid. The top portion of the base provides a mounting platform with a connector. An outer skin or covering is provided over the top and base combination.

Abstract translation: 用于提供模块化包装的系统和方法，其包括被配置为容纳多个顶部或盖子中的任何一个的基部，其中与基底相关联使用的特定顶部或盖子基于整个包装内所需的体积来确定 ，支持和保护包装内的内容。 在至少一些实施方式中，盖子或顶部构造成覆盖要包装的物品并与基座配合以形成外壳。 基部包括底部部分和顶部部分，使得该组合形成用于包含待包装的其它物品的空腔以及封闭在顶部或盖子内的物品。 底座的顶部提供了带连接器的安装平台。 在顶部和底部组合上提供外部皮肤或覆盖物。

公开(公告)号：US20130308266A1

公开(公告)日：2013-11-21

申请号：US13674056

申请日：2012-11-11

Applicant: Jason A. Sullivan

Inventor： Jason A. Sullivan

IPC: H05K7/20

CPC classification number: H05K7/20127 ,  G06F1/20 ,  H05K7/1497 ,  H05K7/20718 ,  H05K7/20736 ,  H05K7/20836

Abstract: Systems and methods for mounting a modular processing unit that is configured to be selectively used alone or with other processing units in an enterprise. A modular processing unit is provided as a platform that is lightweight, compact, and is configured to be selectively used alone or oriented with one or more additional processing units (including base modules and/or peripheral modules) in an enterprise. The one or more processing units are dynamically mounted based upon the particular enterprise needed and corresponding environment. In at least some implementations, shock mounting is included to provide for needed shock and vibe requirements. In some implementations, the mounting system includes a fixed mounting system for environments that need to be fixably secured. In other implementations, a selectively releasable connector is provided to allow for ease in mounting and removing the dynamically modular processing unit. In other implementations, a press-fit connector is provided to allow for ease in mounting and removing the dynamically modular processing unit.

Abstract translation: 用于安装模块化处理单元的系统和方法，其被配置为单独选择性地或与企业中的其他处理单元一起使用。 模块化处理单元被提供为轻量级，紧凑型的平台，并且被配置为单独选择性地使用或者与企业中的一个或多个附加处理单元（包括基本模块和/或外围模块）对齐。 基于所需的特定企业和相应的环境，一个或多个处理单元被动态地安装。 在至少一些实施方案中，包括冲击安装以提供所需的冲击和氛围要求。 在一些实施方案中，安装系统包括用于需要可固定固定的环境的固定安装系统。 在其他实施方式中，提供了可选择地可释放的连接器以允许容易地安装和移除动态模块化处理单元。 在其他实施方式中，提供压配合连接器以便于安装和移除动态模块化处理单元。

公开(公告)号：US20130264919A1

公开(公告)日：2013-10-10

申请号：US13628022

申请日：2012-09-26

Applicant: Jason A. Sullivan

Inventor： Jason A. Sullivan

IPC: H05K7/14 ,  H05K5/02

CPC classification number: H05K7/14 ,  G06F1/181 ,  H05K5/0204

Abstract: Systems and methods for mounting a modular processing unit that is configured to be selectively used alone or with other processing units in an enterprise. A modular processing unit is provided as a platform that is lightweight, compact, and is configured to be selectively used alone or oriented with one or more additional processing units (including base modules and/or peripheral modules) in an enterprise. The one or more processing units are dynamically mounted based upon the particular enterprise needed and corresponding environment. In at least some implementations, shock mounting is included to provide for needed shock and vibe requirements. In some implementations, the mounting system includes a fixed mounting system for environments that need to be fixably secured. In other implementations, a selectively releasable connector is provided to allow for ease in mounting and removing the dynamically modular processing unit. In other implementations, a press-fit connector is provided to allow for ease in mounting and removing the dynamically modular processing unit.

Abstract translation: 用于安装模块化处理单元的系统和方法，其被配置为单独选择性地或与企业中的其他处理单元一起使用。 模块化处理单元被提供为轻量级，紧凑型的平台，并且被配置为单独选择性地使用或者与企业中的一个或多个附加处理单元（包括基本模块和/或外围模块）对齐。 基于所需的特定企业和相应的环境，一个或多个处理单元被动态地安装。 在至少一些实施方案中，包括冲击安装以提供所需的冲击和氛围要求。 在一些实施方案中，安装系统包括用于需要可固定固定的环境的固定安装系统。 在其他实施方式中，提供了可选择地可释放的连接器以允许容易地安装和移除动态模块化处理单元。 在其他实施方式中，提供压配合连接器以便于安装和移除动态模块化处理单元。

公开(公告)号：US20090257179A1

公开(公告)日：2009-10-15

申请号：US11483956

申请日：2006-07-10

Applicant: Jason A. Sullivan

Inventor： Jason A. Sullivan

IPC: G06F1/16 ,  H05K13/04

CPC classification number: G06F1/1616 ,  G06F1/16 ,  G06F1/1601 ,  G06F1/1613 ,  G06F1/1626 ,  G06F1/1632 ,  G06F1/18 ,  G06F1/181 ,  G06F1/20 ,  G06F2200/1631 ,  Y10T29/5313

Abstract: Systems and methods for providing a dynamically modular processing unit. A modular processing unit is provided as a platform that is lightweight, compact, and is configured to be selectively used alone or oriented with one or more additional processing units in an enterprise. In some implementations, a modular processing unit includes a non-peripheral based encasement, a cooling process (e.g., a thermodynamic convection cooling process, a forced air cooling process, and/or a liquid cooling process), an optimized circuit board configuration, optimized processing and memory ratios, and a dynamic back plane that provides increased flexibility and support to peripherals and applications. The modular processing unit is customizable and may be employed in association with all types of computer enterprises. The platform allows for a plethora of modifications that may be made with minimal impact to the dynamically modular unit, thereby enhancing the usefulness of the platform across all type of application.

Abstract translation: 用于提供动态模块化处理单元的系统和方法。 提供了一种模块化处理单元作为轻量级，紧凑型的平台，并且被配置为单独选择性地使用或者与企业中的一个或多个附加处理单元定向。 在一些实施方式中，模块化处理单元包括非外围设备的包装，冷却过程（例如，热力对流冷却过程，强制空气冷却过程和/或液体冷却过程），优化的电路板配置，优化的 处理和内存比率以及动态背板，可为外围设备和应用提供更大的灵活性和支持。 模块化处理单元是可定制的，可以与所有类型的计算机企业结合使用。 该平台允许对动态模块化单元的最小影响进行大量的修改，从而增强平台跨所有类型应用的有用性。