公开(公告)号：US20140091405A1

公开(公告)日：2014-04-03

申请号：US14044223

申请日：2013-10-02

申请人： Heribert WEBER

发明人： Heribert WEBER

IPC分类号： B81B3/00

CPC分类号： B81B3/0021 ,  B81B2201/0264 ,  B81C1/00246 ,  B81C2203/0714 ,  B81C2203/0771 ,  G01L9/0073

摘要： A pressure sensor component includes a MEMS component having at least one pattern element that is able to be deflected perpendicular to the component plane, which is equipped with at least one electrode of a measuring capacitor device, and an ASIC component having integrated circuit elements and at least one back end stack, at least one counter-electrode of the measuring capacitor device being developed in a metallization plane of the back end stack. The MEMS component is mounted on the back end pile of the ASIC component. The MEMS component includes at least one pressure-sensitive diaphragm pattern and is mounted on the ASIC component in such a way that the pressure-sensitive diaphragm pattern spans a cavity between the MEMS component and the back end stack of the ASIC component.

摘要翻译： 压力传感器部件包括具有至少一个能够垂直于部件平面偏转的图案元件的MEMS部件，该元件平面配备有测量电容器装置的至少一个电极和具有集成电路元件的ASIC部件 至少一个后端堆叠，所述测量电容器装置的至少一个对电极在后端堆叠的金属化平面中显影。 MEMS组件安装在ASIC组件的后端堆上。 MEMS部件包括至少一个压敏光阑图案，并且以这样的方式安装在ASIC部件上，使得压敏光阑图案跨越MEMS部件和ASIC部件的后端垛之间的空腔。

公开(公告)号：US20140117475A1

公开(公告)日：2014-05-01

申请号：US14059202

申请日：2013-10-21

申请人： Johannes CLASSEN ,  Axel FRANKE ,  Jens FREY ,  Heribert WEBER ,  Frank FISCHER ,  Patrick WELLNER ,  Mirko HATTASS ,  Daniel Christoph MEISEL

发明人： Johannes CLASSEN ,  Axel FRANKE ,  Jens FREY ,  Heribert WEBER ,  Frank FISCHER ,  Patrick WELLNER ,  Mirko HATTASS ,  Daniel Christoph MEISEL

IPC分类号： B81B7/00

CPC分类号： B81C1/00246 ,  B81C1/0023 ,  B81C2203/075 ,  B81C2203/0771 ,  H01L2224/48463

摘要： A component has at least one MEMS element and at least one cap made of a semiconductor material. The cap, in addition to its mechanical function as a terminus of a cavity and protection of the micromechanical structure, is provided with an electrical functionality. The micromechanical structure of the MEMS element of the component is situated in a cavity between a carrier and the cap, and includes at least one structural element which is deflectable out of the component plane within the cavity. The cap includes at least one section extending over the entire thickness of the cap, which is electrically insulated from the adjoining semiconductor material in such a way that it may be electrically contacted independently from the remaining sections of the cap.

摘要翻译： 元件具有至少一个MEMS元件和至少一个由半导体材料制成的盖。 盖子除了作为空腔的终端的机械功能以及微机械结构的保护之外，还具有电功能。 元件的MEMS元件的微机械结构位于载体和盖之间的空腔中，并且包括至少一个结构元件，其可在空腔内偏离组件平面。 该帽包括至少一个在盖的整个厚度上延伸的部分，其与相邻的半导体材料电绝缘，使得其可以独立于帽的其余部分电接触。

公开(公告)号：US20130285165A1

公开(公告)日：2013-10-31

申请号：US13865825

申请日：2013-04-18

申请人： Johannes CLASSEN ,  Heribert WEBER

发明人： Johannes CLASSEN ,  Heribert WEBER

IPC分类号： B81B7/00 ,  B81C3/00

CPC分类号： B81B7/008 ,  B81C1/00238 ,  B81C1/00246 ,  B81C3/001 ,  B81C2203/0735 ,  B81C2203/0771 ,  B81C2203/0785 ,  H01L2924/1433

摘要： A manufacturing method for hybrid integrated components having a very high degree of miniaturization is provided, which hybrid integrated components each have at least two MEMS elements each having at least one assigned ASIC element. Two MEMS/ASIC wafer stacks are initially created independently of one another in that two ASIC substrates are processed independently of one another; a semiconductor substrate is mounted on the processed surface of each of the two ASIC substrates, and a micromechanical structure is subsequently created in each of the two semiconductor substrates. The two MEMS/ASIC wafer stacks are mounted on top of each other, MEMS on MEMS. Only subsequently are the components separated.

摘要翻译： 提供了一种具有非常高的小型化的混合集成部件的制造方法，这些混合集成部件各自具有至少两个具有至少一个分配的ASIC元件的MEMS元件。 最初独立地创建两个MEMS / ASIC晶片堆叠，因为两个ASIC基板彼此独立地被处理; 将半导体衬底安装在两个ASIC衬底中的每一个的处理表面上，随后在两个半导体衬底中的每一个中形成微机械结构。 两个MEMS / ASIC晶片堆叠安装在MEMS之上。 只有随后的组件分离。

公开(公告)号：US20120032283A1

公开(公告)日：2012-02-09

申请号：US13206024

申请日：2011-08-09

申请人： Jens FREY ,  Heribert WEBER ,  Eckhard GRAF

发明人： Jens FREY ,  Heribert WEBER ,  Eckhard GRAF

IPC分类号： H01L29/84 ,  H01L21/02 ,  H01L31/09 ,  H01L29/82 ,  H01L29/66

CPC分类号： G01P15/125 ,  B81B7/02 ,  B81B2207/07 ,  B81B2207/095 ,  B81B2207/096 ,  B81B2207/097 ,  B81C2203/0118 ,  B81C2203/035 ,  G01L9/0048 ,  G01L9/0052 ,  G01L9/0073 ,  G01L19/0076 ,  G01L19/0092 ,  G01P15/0802 ,  G01R33/0286

摘要： A sensor module includes a substrate system which has multiple substrates situated one on top of the other and connected in each case via a wafer bond connection. The substrate system includes at least one first sensor substrate and at least one second sensor substrate, the first sensor substrate having a first sensor structure and the second sensor substrate having a second sensor structure. The first and second sensor structures are designed for detecting different characteristics. At least the first sensor structure includes a micromechanical functional structure. Moreover, a method for manufacturing such a sensor module is disclosed.

摘要翻译： 传感器模块包括具有多个基板的基板系统，该基板一个在另一个之上并且通过晶片接合连接在每种情况下连接。 衬底系统包括至少一个第一传感器衬底和至少一个第二传感器衬底，第一传感器衬底具有第一传感器结构，第二传感器衬底具有第二传感器结构。 第一和第二传感器结构被设计用于检测不同的特性。 至少第一传感器结构包括微机械功能结构。 此外，公开了一种用于制造这种传感器模块的方法。