Hybridly integrated component and method for the production thereof
    1.
    发明授权
    Hybridly integrated component and method for the production thereof 有权
    混合组合成分及其制备方法

    公开(公告)号:US09212048B2

    公开(公告)日:2015-12-15

    申请号:US13890363

    申请日:2013-05-09

    IPC分类号: B81B3/00 B81C1/00

    摘要: A hybridly integrated component includes an ASIC element having a processed front side, a first MEMS element having a micromechanical structure extending over the entire thickness of the first MEMS substrate, and a first cap wafer mounted over the micromechanical structure of the first MEMS element. At least one structural element of the micromechanical structure of the first MEMS element is deflectable, and the first MEMS element is mounted on the processed front side of the ASIC element such that a gap exists between the micromechanical structure and the ASIC element. A second MEMS element is mounted on the rear side of the ASIC element. The micromechanical structure of the second MEMS element extends over the entire thickness of the second MEMS substrate and includes at least one deflectable structural element.

    摘要翻译: 混合集成部件包括具有经处理的前侧的ASIC元件,具有在第一MEMS基板的整个厚度上延伸的微机械结构的第一MEMS元件和安装在第一MEMS元件的微机械结构上的第一盖晶片。 第一MEMS元件的微机械结构的至少一个结构元件是可偏转的,并且第一MEMS元件安装在ASIC元件的经处理的正面上,使得在微机械结构和ASIC元件之间存在间隙。 第二个MEMS元件安装在ASIC元件的后侧。 第二MEMS元件的微机械结构在第二MEMS基板的整个厚度上延伸,并且包括至少一个可偏转的结构元件。

    HYBRID INTEGRATED COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF
    2.
    发明申请
    HYBRID INTEGRATED COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF 有权
    混合集成组件及其制造方法

    公开(公告)号:US20130299924A1

    公开(公告)日:2013-11-14

    申请号:US13890450

    申请日:2013-05-09

    IPC分类号: B81B3/00 B81C1/00

    摘要: A component system includes at least one MEMS element, a cap for a micromechanical structure of the MEMS element, and at least one ASIC substrate. The micromechanical structure of the MEMS element is implemented in the functional layer of an SOI wafer. The MEMS element is mounted face down, with the structured functional layer on the ASIC substrate, and the cap is implemented in the substrate of the SOI wafer. The ASIC substrate includes a starting substrate provided with a layered structure on both sides. At least one circuit level is implemented in each case both in the MEMS-side layered structure and in the rear-side layered structure of the ASIC substrate. In the ASIC substrate, at least one ASIC through contact is implemented which electrically contacts at least one circuit level of the rear-side layered structure and/or at least one circuit level of the MEMS-side layered structure.

    摘要翻译: 组件系统包括至少一个MEMS元件,用于MEMS元件的微机械结构的盖以及至少一个ASIC基板。 MEMS元件的微机械结构在SOI晶片的功能层中实现。 MEMS元件面朝下安装,ASIC结构上的结构化功能层,并且帽被实现在SOI晶片的衬底中。 ASIC基板包括在两侧设置有分层结构的起始衬底。 在ASIC基板的MEMS侧分层结构和后侧层叠结构中,每种情况都至少实现一个电路电平。 在ASIC基板中,实现至少一个ASIC接触,其电接触后侧分层结构的至少一个电路电平和/或MEMS侧分层结构的至少一个电路电平。

    HYBRID INTEGRATED COMPONENT
    4.
    发明申请
    HYBRID INTEGRATED COMPONENT 有权
    混合集成组件

    公开(公告)号:US20140117475A1

    公开(公告)日:2014-05-01

    申请号:US14059202

    申请日:2013-10-21

    IPC分类号: B81B7/00

    摘要: A component has at least one MEMS element and at least one cap made of a semiconductor material. The cap, in addition to its mechanical function as a terminus of a cavity and protection of the micromechanical structure, is provided with an electrical functionality. The micromechanical structure of the MEMS element of the component is situated in a cavity between a carrier and the cap, and includes at least one structural element which is deflectable out of the component plane within the cavity. The cap includes at least one section extending over the entire thickness of the cap, which is electrically insulated from the adjoining semiconductor material in such a way that it may be electrically contacted independently from the remaining sections of the cap.

    摘要翻译: 元件具有至少一个MEMS元件和至少一个由半导体材料制成的盖。 盖子除了作为空腔的终端的机械功能以及微机械结构的保护之外,还具有电功能。 元件的MEMS元件的微机械结构位于载体和盖之间的空腔中,并且包括至少一个结构元件,其可在空腔内偏离组件平面。 该帽包括至少一个在盖的整个厚度上延伸的部分,其与相邻的半导体材料电绝缘,使得其可以独立于帽的其余部分电接触。

    Micromechanical Angular Acceleration Sensor and Method for Measuring an Angular Acceleration
    5.
    发明申请
    Micromechanical Angular Acceleration Sensor and Method for Measuring an Angular Acceleration 有权
    微机械角加速度传感器和测量角加速度的方法

    公开(公告)号:US20120297878A1

    公开(公告)日:2012-11-29

    申请号:US13479746

    申请日:2012-05-24

    IPC分类号: G01P15/097

    CPC分类号: G01P15/0922 H01L41/1132

    摘要: A micromechanical angular acceleration sensor for measuring an angular acceleration is disclosed. The sensor includes a substrate, a seismic mass, at least one suspension, which fixes the seismic mass to the substrate in a deflectable manner, and at least one piezoresistive and/or piezoelectric element for measuring the angular acceleration. The piezoresistive and/or piezoelectric element is arranged in a cutout of the seismic mass. A corresponding method and uses of the sensor are also disclosed.

    摘要翻译: 公开了一种用于测量角加速度的微机械角加速度传感器。 传感器包括基板,抗震块,至少一个悬架,其以可偏转的方式将地震质量固定到基板,以及用于测量角加速度的至少一个压阻和/或压电元件。 压阻和/或压电元件布置在地震块的切口中。 还公开了传感器的相应方法和用途。

    METHOD FOR CALIBRATING YAW RATE SENSORS
    7.
    发明申请
    METHOD FOR CALIBRATING YAW RATE SENSORS 有权
    校准速率传感器的方法

    公开(公告)号:US20140116108A1

    公开(公告)日:2014-05-01

    申请号:US14059217

    申请日:2013-10-21

    IPC分类号: G01P21/00

    CPC分类号: G01C19/5755 G01C25/005

    摘要: A method for calibrating a selected yaw rate sensor includes: determining a scaling function between a yaw rate sensitivity and a test signal sensitivity of a yaw rate sensor selected for carrying out a test and denoted as first sampling yaw rate sensor is determined in a first method step, the scaling function being determined from a measured first sample yaw rate sensitivity and from a measured first sample test signal sensitivity of the sampling yaw rate sensor; calculating a production yaw rate sensitivity for a yaw rate sensor denoted as production yaw rate sensor from a measured production test signal sensitivity of the production yaw rate sensor and the scaling function; and subsequently calibrating the production yaw rate sensor with the aid of the production yaw rate sensitivity.

    摘要翻译: 用于校准所选择的偏航速率传感器的方法包括:以选择用于执行测试并表示为第一采样偏航速率传感器的偏航率传感器的偏航率敏感度和测试信号灵敏度之间的缩放函数确定为第一方法 根据测量的第一样品偏航角速度灵敏度和来自采样偏航率传感器的测量的第一采样测试信号灵敏度确定缩放函数; 根据生产偏航率传感器的测量生产测试信号灵敏度和缩放函数计算表示为生产横摆角速度传感器的横摆率传感器的制造横摆角速度灵敏度; 随后借助于制造偏航率灵敏度校准生产偏航率传感器。

    Micromechanical component, device for beam deflection of monochromatic light, and spectrometer
    8.
    发明授权
    Micromechanical component, device for beam deflection of monochromatic light, and spectrometer 有权
    微机械部件,单色光束偏转装置和光谱仪

    公开(公告)号:US08711459B2

    公开(公告)日:2014-04-29

    申请号:US12925675

    申请日:2010-10-26

    申请人: Mirko Hattass

    发明人: Mirko Hattass

    IPC分类号: G02B26/08

    摘要: A micromechanical component includes a micromechanical unidimensional optical lattice structure for diffracting an incident light beam, and a linear drive connected to the lattice structure for compressing and/or stretching the lattice structure in the plane of the lattice structure. The lattice structure is of elastic design with regard to a change of shape resulting from the compressing and/or stretching. The micromechanical component may be incorporated in a device for beam deflection of monochromatic light or in a spectrometer.

    摘要翻译: 微机械部件包括用于衍射入射光束的微机械一维光栅结构,以及连接到晶格结构的线性驱动器,用于在晶格结构的平面中压缩和/或拉伸晶格结构。 关于由压缩和/或拉伸产生的形状变化,格子结构具有弹性设计。 微机械部件可以并入用于单色光或光谱仪中的光束偏转的装置中。

    HYBRIDLY INTEGRATED COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
    9.
    发明申请
    HYBRIDLY INTEGRATED COMPONENT AND METHOD FOR THE PRODUCTION THEREOF 有权
    混合组合成分及其生产方法

    公开(公告)号:US20130299928A1

    公开(公告)日:2013-11-14

    申请号:US13890363

    申请日:2013-05-09

    IPC分类号: B81B3/00 B81C1/00

    摘要: A hybridly integrated component includes an ASIC element having a processed front side, a first MEMS element having a micromechanical structure extending over the entire thickness of the first MEMS substrate, and a first cap wafer mounted over the micromechanical structure of the first MEMS element. At least one structural element of the micromechanical structure of the first MEMS element is deflectable, and the first MEMS element is mounted on the processed front side of the ASIC element such that a gap exists between the micromechanical structure and the ASIC element. A second MEMS element is mounted on the rear side of the ASIC element. The micromechanical structure of the second MEMS element extends over the entire thickness of the second MEMS substrate and includes at least one deflectable structural element.

    摘要翻译: 混合集成部件包括具有经处理的前侧的ASIC元件,具有在第一MEMS基板的整个厚度上延伸的微机械结构的第一MEMS元件和安装在第一MEMS元件的微机械结构上的第一盖晶片。 第一MEMS元件的微机械结构的至少一个结构元件是可偏转的,并且第一MEMS元件安装在ASIC元件的经处理的正面上,使得在微机械结构和ASIC元件之间存在间隙。 第二个MEMS元件安装在ASIC元件的后侧。 第二MEMS元件的微机械结构在第二MEMS基板的整个厚度上延伸,并且包括至少一个可偏转的结构元件。

    Rotation Rate Sensor
    10.
    发明申请
    Rotation Rate Sensor 有权
    转速传感器

    公开(公告)号:US20120067123A1

    公开(公告)日:2012-03-22

    申请号:US13234878

    申请日:2011-09-16

    IPC分类号: G01C19/56

    摘要: A micromechanical rotation rate sensor, in particular for use in motor vehicles, includes a substrate, at least one seismic mass, which is arranged in a sprung manner on the substrate, drive means for production of a periodic movement of the seismic mass, force detection means for detection of a Coriolis force, which acts on the seismic mass as a result of rotation about a rotation axis which is at right angles to the excitation direction, and measurement means, wherein the measurement means are designed for measurement of structural deviations of the rotation rate sensor.

    摘要翻译: 特别是用于机动车辆的微机械转速传感器包括基板,至少一个地震质量块,以弹簧方式布置在基板上,驱动装置,用于产生地震块的周期性运动,力检测 用于检测科里奥利力的装置,其作为围绕与激励方向成直角的旋转轴旋转的结果作用在地震质量上;以及测量装置,其中测量装置被设计用于测量结构偏差 转速传感器