公开(公告)号：US20070210511A1

公开(公告)日：2007-09-13

申请号：US11372288

申请日：2006-03-09

Applicant: Joseph Ferrara

Inventor： Joseph Ferrara

IPC: B65H5/02 ,  B65H29/54 ,  B65H29/20

CPC classification number: B65H29/40 ,  B65H29/54 ,  B65H29/58 ,  B65H2301/4213

Abstract: A paper or sheet buffering system is provided which avoids having to shut down the entire system when the paper path or transport is overloaded. A rotating disk having an attached collection and dispensing finger(s) is used to pull excess sheets off the transport and hold them until it is suitable to dispense them back on to the transport.

Abstract translation: 提供了一种纸张或纸张缓冲系统，其避免了当纸张路径或运输过载时必须关闭整个系统。 具有附接的收集和分配手指的旋转盘用于将多余的片材从运输工具拉出并保持它们，直到其适合于将它们分配回到运输工具上。

公开(公告)号：US20050184253A1

公开(公告)日：2005-08-25

申请号：US10786660

申请日：2004-02-25

Applicant: Michael Ioannou ,  Mehran Asdigha ,  Joseph Ferrara

Inventor： Michael Ioannou ,  Mehran Asdigha ,  Joseph Ferrara

IPC: H01J37/20 ,  H01J37/317 ,  H01L21/265

CPC classification number: H01J37/3171 ,  H01J2237/20228

Abstract: The present invention is directed to a scanning apparatus and method for processing a substrate, wherein the scanning apparatus comprises a base portion and a rotary subsystem. The rotary subsystem comprises a first link comprising a first joint, wherein the first link is rotatably coupled to the base portion by the first joint, and a second link comprising a second joint, wherein the second link is rotatably coupled to the first link by the second joint. The first joint and the second joint are spaced a predetermined distance from one another. The second link further comprising an end effector whereon the substrate resides, and wherein the end effector is operably coupled to the second link. The end effector is further spaced from the second joint by the predetermined distance, wherein a rotation of the first link and second link in a respective first direction and second direction is operable to linearly oscillate the end effector along a linear first scan path, and wherein the rotational velocity of the first link and second link does not cross zero.

Abstract translation: 本发明涉及一种用于处理基板的扫描装置和方法，其中扫描装置包括基部和旋转子系统。 所述旋转子系统包括第一连杆，所述第一连杆包括第一接头，其中所述第一连杆通过所述第一接头可旋转地联接到所述基座部分;以及第二连杆，包括第二接头，其中所述第二连杆通过 第二关节 第一关节和第二关节彼此隔开预定的距离。 所述第二连杆还包括位于所述基板上的端部执行器，并且其中所述端部执行器可操作地联接到所述第二连杆。 末端执行器与第二关节进一步间隔预定距离，其中第一连杆和第二连杆在相应的第一方向和第二方向上的旋转可操作以沿着线性第一扫描路径线性振荡末端执行器，并且其中 第一连杆和第二连杆的旋转速度不为零。

公开(公告)号：US06774373B2

公开(公告)日：2004-08-10

申请号：US10628170

申请日：2003-07-28

Applicant: Joseph Ferrara

Inventor： Joseph Ferrara

IPC: H01J37317

CPC classification number: H01J37/3171 ,  H01J37/20 ,  H01J2237/20207 ,  H01J2237/20214 ,  H01J2237/24528 ,  H01L21/68764 ,  H01L21/68771

Abstract: An ion beam implanter includes an ion beam source for generating an ion beam moving along a beam line and an implantation chamber wherein a workpiece is positioned to intersect the ion beam for ion implantation of a surface of the workpiece by the ion beam. The ion beam implanter further includes a workpiece support structure coupled to the implantation chamber and supporting the workpiece. The workpiece support structure includes a first rotation member rotatably coupled to the implantation chamber and including an opening extending through the rotation member and aligned with an opening in a wall of the implantation chamber. The workpiece support structure further includes a second rotation member rotatably coupled to the first rotation member and having an axis of rotation offset from an axis of rotation of the first rotation member, the second rotation member overlying the opening of the first rotation member. The workpiece support structure also includes a third member fixedly attached to the second rotation member, the third member including a rotatable drive supporting the workpiece. The first rotation member, the second rotation member and the rotatable drive of the third rotation member rotate to move the workpiece along a path of travel for implantation of the implantation surface wherein a distance that the ion beam moves through the implantation chamber before striking the implantation surface of the workpiece is constant.

公开(公告)号：US07750320B2

公开(公告)日：2010-07-06

申请号：US11644623

申请日：2006-12-22

Applicant: Joseph Ferrara ,  Bo H. Vanderberg ,  Michael A. Graf

Inventor： Joseph Ferrara ,  Bo H. Vanderberg ,  Michael A. Graf

IPC: G21K5/10

CPC classification number: H01J37/3171 ,  H01J37/09 ,  H01J2237/022 ,  H01J2237/024 ,  H01J2237/0458 ,  H01J2237/057 ,  H01J2237/24528 ,  H01J2237/30455 ,  H01J2237/30483 ,  H01J2237/31705

Abstract: A workpiece or semiconductor wafer is tilted as a ribbon beam is swept up and/or down the workpiece. In so doing, the implant angle or the angle of the ion beam relative to the workpiece remains substantially constant across the wafer. This allows devices to be formed substantially consistently on the wafer. Resolving plates move with the beam as the beam is scanned up and/or down. This allows desired ions to impinge on the wafer, but blocks undesirable contaminants.

Abstract translation: 当工件或半导体晶片沿着工件扫过和/或向下时，工件或半导体晶片被倾斜。 在这样做时，植入角度或离子束相对于工件的角度在晶片上保持基本恒定。 这允许在晶片上基本上一致地形成器件。 当光束向上扫描和/或向下扫描时，解析板随着光束移动。 这允许所需的离子撞击在晶片上，但阻止不期望的污染物。

公开(公告)号：US07699574B2

公开(公告)日：2010-04-20

申请号：US11765499

申请日：2007-06-20

Applicant: Joseph Ferrara

Inventor： Joseph Ferrara

IPC: H01L21/677

CPC classification number: H01L21/67213 ,  H01L21/67201 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67778 ,  Y10S414/139

Abstract: A transfer system for use with a tool for processing a work-piece at low or vacuum pressure such as an ion implanter for implanting silicon wafers. An enclosure defines a low pressure region for processing of work-pieces placed at a work-piece processing station within the low pressure region. A two tier multiple work-piece isolation load lock transfers work-pieces from a higher pressure region to the lower pressure for processing and back to said higher pressure subsequent to said processing. A first robot transfers work-pieces within the low pressure region from the load locks to a processing station within the low pressure region. Multiple other robots positioned outside the low pressure region transfers work-pieces to and from the two tier work-piece isolation load locks from a source of said work-pieces prior to processing and to a destination of said work-pieces after said processing.

Abstract translation: 一种用于在低或真空压力下处理工件的工具的转移系统，例如用于注入硅晶片的离子注入机。 外壳限定用于处理放置在低压区域内的工件处理站的工件的低压区域。 两层多件工件隔离负载锁将工件从较高压力区域转移到较低压力以进行处理，并在所述处理之后转回所述较高压力。 第一机器人将低压区域内的工件从负载锁传送到低压区域内的处理站。 位于低压区域之外的多个其它机器人在处理之前将工件与来自所述工件的来源的两层工件隔离负载锁转移到所述工件的所述处理之后的所述工件的目的地。

公开(公告)号：US20080138175A1

公开(公告)日：2008-06-12

申请号：US11634697

申请日：2006-12-06

Applicant: Robert J. Mitchell ,  Joseph Ferrara

Inventor： Robert J. Mitchell ,  Joseph Ferrara

IPC: H01L21/677 ,  B65H1/00 ,  G06F7/00

CPC classification number: H01L21/681 ,  H01L21/67265 ,  H01L21/67745

Abstract: An ion implantation apparatus, system, and method are provided for a transferring a plurality of workpieces between vacuum and atmospheric pressures, wherein an alignment mechanism is operable to align a plurality of workpieces for generally simultaneous transportation to a dual-workpiece load lock chamber. The alignment mechanism comprises a characterization device, an elevator, and two vertically-aligned workpiece supports for supporting two workpieces. First and second atmospheric robots are configured to generally simultaneously transfer two workpieces at a time between load lock modules, the alignment mechanism, and a FOUP. Third and fourth vacuum robots are configured to transfer one workpiece at a time between the load lock modules and a process module.

Abstract translation: 提供一种用于在真空和大气压之间传送多个工件的离子注入装置，系统和方法，其中对准机构可操作以将多个工件对准，以便大体上同时传送到双工件加载锁定室。 对准机构包括表征装置，电梯和用于支撑两个工件的两个垂直对齐的工件支撑件。 第一和第二大气机器人被配置为一般在负载锁定模块，对准机构和FOUP之间同时传送两个工件。 第三和第四真空机器人被配置为在加载锁模块和处理模块之间一次传送一个工件。

公开(公告)号：US20070243049A1

公开(公告)日：2007-10-18

申请号：US11765499

申请日：2007-06-20

Applicant: Joseph Ferrara

Inventor： Joseph Ferrara

IPC: B65G35/00

CPC classification number: H01L21/67213 ,  H01L21/67201 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67778 ,  Y10S414/139

Abstract: A transfer system for use with a tool for processing a work-piece at low or vacuum pressure such as an ion implanter for implanting silicon wafers. An enclosure defines a low pressure region for processing of work-pieces placed at a work-piece processing station within the low pressure region. A two tier multiple work-piece isolation load lock transfers work-pieces from a higher pressure region to the lower pressure for processing and back to said higher pressure subsequent to said processing. A first robot transfers work-pieces within the low pressure region from the load locks to a processing station within the low pressure region. Multiple other robots positioned outside the low pressure region transfers work-pieces to and from the two tier work-piece isolation load locks from a source of said work-pieces prior to processing and to a destination of said work-pieces after said processing.

Abstract translation: 一种用于在低或真空压力下处理工件的工具的转移系统，例如用于注入硅晶片的离子注入机。 外壳限定用于处理放置在低压区域内的工件处理站的工件的低压区域。 两层多件工件隔离负载锁将工件从较高压力区域转移到较低压力以进行处理，并在所述处理之后转回所述较高压力。 第一机器人将低压区域内的工件从负载锁传送到低压区域内的处理站。 位于低压区域之外的多个其它机器人在处理之前将工件与来自所述工件的来源的两层工件隔离负载锁转移到所述工件的所述处理之后的所述工件的目的地。

公开(公告)号：US20060033045A1

公开(公告)日：2006-02-16

申请号：US10917597

申请日：2004-08-13

Applicant: Klaus Petry ,  Joseph Ferrara ,  Klaus Becker

Inventor： Klaus Petry ,  Joseph Ferrara ,  Klaus Becker

IPC: H01J37/317 ,  H01J37/20

CPC classification number: H01J37/3171 ,  H01J37/20 ,  H01J37/304 ,  H01J2237/20207 ,  H01J2237/20214 ,  H01J2237/20235 ,  H01J2237/20242 ,  H01J2237/24528 ,  H01J2237/31703

Abstract: Dosimetry systems and methods are also presented for measuring a scanned ion beam at a plurality of points along a curvilinear path at a workpiece location in a process chamber. An illustrated dosimetry system comprises a sensor and a mounting apparatus that supports support the sensor and selectively positions the sensor at a plurality of points along the curvilinear path, wherein the mounting apparatus can selectively position the sensor to point toward a vertex of the scanned ion beam.

Abstract translation: 还提出了测量系统和方法，用于在处理室中的工件位置处沿着曲线路径的多个点处测量扫描离子束。 所示的剂量测定系统包括传感器和安装设备，其支撑传感器并且选择性地将传感器定位在沿着曲线路径的多个点处，其中安装设备可以选择性地将传感器定位成朝向扫描离子束的顶点 。

公开(公告)号：US20050232727A1

公开(公告)日：2005-10-20

申请号：US10826419

申请日：2004-04-16

Applicant: Joseph Ferrara

Inventor： Joseph Ferrara

IPC: B24B7/00 ,  H01L21/00 ,  H01L21/677

CPC classification number: H01L21/67213 ,  H01L21/67201 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67778 ,  Y10S414/139

Abstract: A transfer system for use with a tool for processing a work-piece at low or vacuum pressure such as an ion implanter for implanting silicon wafers. An enclosure defines a low pressure region for processing of work-pieces placed at a work-piece processing station within the low pressure region. A two tier multiple work-piece isolation load lock transfers work-pieces from a higher pressure region to the lower pressure for processing and back to said higher pressure subsequent to said processing. A first robot transfers work-pieces within the low pressure region from the load locks to a processing station within the low pressure region. Multiple other robots positioned outside the low pressure region transfers work-pieces to and from the two tier work-piece isolation load locks from a source of said work-pieces prior to processing and to a destination of said work-pieces after said processing.

Abstract translation: 一种用于在低或真空压力下处理工件的工具的转移系统，例如用于注入硅晶片的离子注入机。 外壳限定用于处理放置在低压区域内的工件处理站的工件的低压区域。 两层多件工件隔离负载锁将工件从较高压力区域转移到较低压力以进行处理，并在所述处理之后转回所述较高压力。 第一机器人将低压区域内的工件从负载锁传送到低压区域内的处理站。 位于低压区域之外的多个其它机器人在处理之前将工件与来自所述工件的来源的两层工件隔离负载锁转移到所述工件的所述处理之后的所述工件的目的地。

公开(公告)号：US20080149857A1

公开(公告)日：2008-06-26

申请号：US11644623

申请日：2006-12-22

Applicant: Joseph Ferrara ,  Bo H. Vanderberg ,  Michael A. Graf

Inventor： Joseph Ferrara ,  Bo H. Vanderberg ,  Michael A. Graf

IPC: G21K5/10

CPC classification number: H01J37/3171 ,  H01J37/09 ,  H01J2237/022 ,  H01J2237/024 ,  H01J2237/0458 ,  H01J2237/057 ,  H01J2237/24528 ,  H01J2237/30455 ,  H01J2237/30483 ,  H01J2237/31705

Abstract: A workpiece or semiconductor wafer is tilted as a ribbon beam is swept up and/or down the workpiece. In so doing, the implant angle or the angle of the ion beam relative to the workpiece remains substantially constant across the wafer. This allows devices to be formed substantially consistently on the wafer. Resolving plates move with the beam as the beam is scanned up and/or down. This allows desired ions to impinge on the wafer, but blocks undesirable contaminants.

Abstract translation: 当工件或半导体晶片沿着工件扫过和/或向下时，工件或半导体晶片被倾斜。 在这样做时，植入角度或离子束相对于工件的角度在晶片上保持基本恒定。 这允许在晶片上基本上一致地形成器件。 当光束向上扫描和/或向下扫描时，解析板随着光束移动。 这允许所需的离子撞击在晶片上，但阻止不期望的污染物。