Work piece transfer system for an ion beam implanter
    2.
    发明申请
    Work piece transfer system for an ion beam implanter 有权
    用于离子束注入机的工件传送系统

    公开(公告)号:US20050194549A1

    公开(公告)日:2005-09-08

    申请号:US10794009

    申请日:2004-03-05

    CPC分类号: H01L21/67742 H01L21/67745

    摘要: A work piece transfer apparatus for use with an ion beam implanter for treating a work piece at sub-atmospheric pressure. The work piece transfer apparatus includes an evacuable load lock system in fluid communication with an interior region the implantation chamber interior region. The load lock system includes a support surface for supporting the work piece with an opening aligned with the work piece. The work piece transfer apparatus further includes a work piece support within the implantation chamber having a pedestal supported by a linkage with two degrees of freedom. The linkage moves the pedestal transversely through the load lock support surface opening to pick up the work piece from the support surface prior to treatment. The pedestal holds the work piece in position in the implantation chamber for treatment. The linkage then moves the pedestal transversely through the load lock support surface opening to deposit the work piece on the support surface subsequent to treatment.

    摘要翻译: 一种与离子束注入机一起使用的工件传送装置,用于在大气压下处理工件。 工件传送装置包括与植入室内部区域的内部区域流体连通的可抽空的装载锁定系统。 负载锁定系统包括用于支撑具有与工件对准的开口的工件的支撑表面。 工件传送装置还包括在植入室内的工件支撑件,其具有由具有两个自由度的连杆支撑的基座。 连杆将基座横向移动通过负载锁定支撑表面开口,以在处理之前从支撑表面拾起工件。 基座将工件保持在植入室中的适当位置进行处理。 然后,联动装置将基座横向移动通过负载锁定支撑表面开口,以在处理之后将工件沉积在支撑表面上。

    Wafer 2D scan mechanism
    3.
    发明申请
    Wafer 2D scan mechanism 失效
    晶圆2D扫描机制

    公开(公告)号:US20050184253A1

    公开(公告)日:2005-08-25

    申请号:US10786660

    申请日:2004-02-25

    摘要: The present invention is directed to a scanning apparatus and method for processing a substrate, wherein the scanning apparatus comprises a base portion and a rotary subsystem. The rotary subsystem comprises a first link comprising a first joint, wherein the first link is rotatably coupled to the base portion by the first joint, and a second link comprising a second joint, wherein the second link is rotatably coupled to the first link by the second joint. The first joint and the second joint are spaced a predetermined distance from one another. The second link further comprising an end effector whereon the substrate resides, and wherein the end effector is operably coupled to the second link. The end effector is further spaced from the second joint by the predetermined distance, wherein a rotation of the first link and second link in a respective first direction and second direction is operable to linearly oscillate the end effector along a linear first scan path, and wherein the rotational velocity of the first link and second link does not cross zero.

    摘要翻译: 本发明涉及一种用于处理基板的扫描装置和方法,其中扫描装置包括基部和旋转子系统。 所述旋转子系统包括第一连杆,所述第一连杆包括第一接头,其中所述第一连杆通过所述第一接头可旋转地联接到所述基座部分;以及第二连杆,包括第二接头,其中所述第二连杆通过 第二关节 第一关节和第二关节彼此隔开预定的距离。 所述第二连杆还包括位于所述基板上的端部执行器,并且其中所述端部执行器可操作地联接到所述第二连杆。 末端执行器与第二关节进一步间隔预定距离,其中第一连杆和第二连杆在相应的第一方向和第二方向上的旋转可操作以沿着线性第一扫描路径线性振荡末端执行器,并且其中 第一连杆和第二连杆的旋转速度不为零。

    PARALLEL SINGLE SUBSTRATE PROCESSING SYSTEM LOADER
    4.
    发明申请
    PARALLEL SINGLE SUBSTRATE PROCESSING SYSTEM LOADER 审中-公开
    并行单基板加工系统装载机

    公开(公告)号:US20120308346A1

    公开(公告)日:2012-12-06

    申请号:US13488433

    申请日:2012-06-04

    IPC分类号: H01L21/677

    摘要: A substrate unload and load apparatus adapted to unload and load a plurality of processed substrates from a plurality of arrayed substrate holders, the apparatus having a frame and a plurality of processed substrate supports coupled to the frame configured to support the processed substrates. A plurality of unprocessed substrate supports is coupled to the frame configured to support the unprocessed substrates, each of the unprocessed substrate supports alternating and interleaved with each of the processed substrate supports. A holder release is coupled to the frame and configured to engage the arrayed substrate holders having a first state where the arrayed substrate holders releases the processed substrates from the arrayed substrate holders, the holder release having a second state where the arrayed substrate holders captures the unprocessed substrates with arrayed substrate holders.

    摘要翻译: 一种衬底卸载和负载装置,适于从多个排列的衬底保持器卸载和加载多个经处理的衬底,所述装置具有框架和多个经处理的衬底支撑件,所述衬底支撑件被配置成支撑经处理的衬底。 多个未处理的衬底支撑件被耦合到框架,该框架被配置为支撑未处理的衬底,每个未处理的衬底支撑件与每个处理的衬底支撑件交替并交错。 保持器释放件联接到框架并且被配置为接合具有第一状态的排列的衬底保持器,其中阵列的衬底保持器从排列的衬底保持器释放经处理的衬底,保持器释放具有第二状态,其中阵列衬底保持器捕获未处理 具有阵列基板支架的基板。

    Work piece transfer system for an ion beam implanter
    5.
    发明授权
    Work piece transfer system for an ion beam implanter 有权
    用于离子束注入机的工件传送系统

    公开(公告)号:US06987272B2

    公开(公告)日:2006-01-17

    申请号:US10794009

    申请日:2004-03-05

    IPC分类号: H01J37/317

    CPC分类号: H01L21/67742 H01L21/67745

    摘要: A work piece transfer apparatus for use with an ion beam implanter for treating a work piece at sub-atmospheric pressure. The work piece transfer apparatus includes an evacuable load lock system in fluid communication with an interior region the implantation chamber interior region. The load lock system includes a support surface for supporting the work piece with an opening aligned with the work piece. The work piece transfer apparatus further includes a work piece support within the implantation chamber having a pedestal supported by a linkage with two degrees of freedom. The linkage moves the pedestal transversely through the load lock support surface opening to pick up the work piece from the support surface prior to treatment. The pedestal holds the work piece in position in the implantation chamber for treatment. The linkage then moves the pedestal transversely through the load lock support surface opening to deposit the work piece on the support surface subsequent to treatment.

    摘要翻译: 一种与离子束注入机一起使用的工件传送装置,用于在大气压下处理工件。 工件传送装置包括与植入室内部区域的内部区域流体连通的可抽空的装载锁定系统。 负载锁定系统包括用于支撑具有与工件对准的开口的工件的支撑表面。 工件传送装置还包括在植入室内的工件支撑件,其具有由具有两个自由度的连杆支撑的基座。 连杆将基座横向移动通过负载锁定支撑表面开口,以在处理之前从支撑表面拾起工件。 基座将工件保持在植入室中的适当位置进行处理。 然后,联动装置将基座横向移动通过负载锁定支撑表面开口,以在处理之后将工件沉积在支撑表面上。

    Mechanical oscillator for wafer scan with spot beam
    6.
    发明授权
    Mechanical oscillator for wafer scan with spot beam 失效
    机械振荡器,用于具有点光束的晶圆扫描

    公开(公告)号:US07119343B2

    公开(公告)日:2006-10-10

    申请号:US10840186

    申请日:2004-05-06

    IPC分类号: G21K5/10 G01K5/08 G01F23/00

    摘要: The present invention is directed to a scanning apparatus and method for processing a substrate, wherein the scanning apparatus comprises a first link and a second link rigidly coupled to one another at a first joint, wherein the first link and second link are rotatably coupled to a base portion by the first joint, therein defining a first axis. An end effector, whereon the substrate resides, is coupled to the first link. The second link is coupled to a first actuator via at least second joint. The first actuator is operable to translate the second joint with respect to the base portion, therein rotating the first and second links about the first axis and translating the substrate along a first scan path in an oscillatory manner. A controller is further operable to maintain a generally constant translational velocity of the end effector within a predetermined scanning range.

    摘要翻译: 本发明涉及一种用于处理基板的扫描装置和方法,其中扫描装置包括第一连杆和在第一关节处彼此刚性地联接的第二连杆,其中第一连杆和第二连杆可旋转地连接到 其中所述第一接头限定第一轴线。 衬底所在的末端执行器被耦合到第一连杆。 第二连杆通过至少第二接头联接到第一致动器。 第一致动器可操作以相对于基部部分平移第二接头,其中使第一和第二连杆围绕第一轴线旋转,并以振荡方式沿着第一扫描路径平移基板。 控制器还可操作以将末端执行器的大致恒定的平移速度保持在预定扫描范围内。

    Wafer 2D scan mechanism
    7.
    发明授权
    Wafer 2D scan mechanism 失效
    晶圆2D扫描机制

    公开(公告)号:US07112808B2

    公开(公告)日:2006-09-26

    申请号:US10786660

    申请日:2004-02-25

    IPC分类号: G21K5/10

    摘要: The present invention is directed to a scanning apparatus and method for processing a substrate, wherein the scanning apparatus comprises a base portion and a rotary subsystem. The rotary subsystem comprises a first link comprising a first joint, wherein the first link is rotatably coupled to the base portion by the first joint, and a second link comprising a second joint, wherein the second link is rotatably coupled to the first link by the second joint. The first joint and the second joint are spaced a predetermined distance from one another. The second link further comprising an end effector whereon the substrate resides, and wherein the end effector is operably coupled to the second link. The end effector is further spaced from the second joint by the predetermined distance, wherein a rotation of the first link and second link in a respective first direction and second direction is operable to linearly oscillate the end effector along a linear first scan path, and wherein the rotational velocity of the first link and second link does not cross zero.

    摘要翻译: 本发明涉及一种用于处理基板的扫描装置和方法,其中扫描装置包括基部和旋转子系统。 所述旋转子系统包括第一连杆,所述第一连杆包括第一接头,其中所述第一连杆通过所述第一接头可旋转地联接到所述基座部分,所述第二连杆包括第二接头,其中所述第二连杆通过所述第一接头可旋转地联接到所述第一连杆 第二关节 第一关节和第二关节彼此隔开预定的距离。 所述第二连杆还包括位于所述基板上的端部执行器,并且其中所述端部执行器可操作地联接到所述第二连杆。 末端执行器与第二关节进一步间隔预定距离,其中第一连杆和第二连杆在相应的第一方向和第二方向上的旋转可操作以沿着线性第一扫描路径线性振荡末端执行器,并且其中 第一连杆和第二连杆的旋转速度不为零。

    PARALLEL SINGLE SUBSTRATE PROCESSING SYSTEM HOLDER
    9.
    发明申请
    PARALLEL SINGLE SUBSTRATE PROCESSING SYSTEM HOLDER 审中-公开
    平行单基板加工系统支架

    公开(公告)号:US20120306139A1

    公开(公告)日:2012-12-06

    申请号:US13488407

    申请日:2012-06-04

    IPC分类号: H01L21/687

    摘要: A substrate holder adapted to hold and retain a substrate during vertical fluid processing of a surface of the substrate. The wafer holder has a frame. A first leg is coupled to the frame by a first compliant flexure, the first leg having a first contact member configured to engage a first edge of the substrate. A second leg is coupled to the frame by a second compliant flexure, the second leg having a second contact member configured to engage a second edge of the substrate. Upon deflection of the first and second compliant flexures, the first and second legs are moveable in substantially opposite directions disengaging the first and second contact fingers from the first and second edges of the substrate respectively.

    摘要翻译: 衬底保持器,适于在衬底的表面的垂直流体处理期间保持和保持衬底。 晶片架具有框架。 第一腿通过第一柔顺弯曲部联接到框架,第一腿部具有构造成接合衬底的第一边缘的第一接触构件。 第二腿通过第二柔顺弯曲部联接到框架,第二腿具有构造成接合衬底的第二边缘的第二接触构件。 在第一和第二柔性弯曲部偏转时,第一和第二腿部可以基本上相反的方向移动,从而分别使第一和第二接触指与基板的第一和第二边缘分离。

    Wafer scanning system with reciprocating rotary motion utilizing springs and counterweights
    10.
    发明授权
    Wafer scanning system with reciprocating rotary motion utilizing springs and counterweights 失效
    使用弹簧和配重的往复旋转运动的晶圆扫描系统

    公开(公告)号:US07267520B2

    公开(公告)日:2007-09-11

    申请号:US11099022

    申请日:2005-04-05

    IPC分类号: B66F9/00

    摘要: The present invention is directed to a scanning apparatus and method for processing a workpiece, wherein the scanning apparatus comprises a wafer arm and moving arm fixedly coupled to one another, wherein the wafer arm and moving arm are operable to rotate about a first axis. An end effector, whereon the workpiece resides, is coupled to the wafer arm. A rotational shaft couples the wafer arm and moving arm to a first actuator, wherein the first actuator provides a rotational force to the shaft. A momentum balance mechanism is coupled to the shaft and is operable to generally reverse the rotational direction of the shaft. The momentum balance mechanism comprises one or more fixed spring elements operable to provide a force to a moving spring element coupled to the moving arm. A controller is further operable to maintain a generally constant translational velocity of the end effector within a predetermined scanning range.

    摘要翻译: 本发明涉及一种用于处理工件的扫描装置和方法,其中扫描装置包括彼此固定地连接的晶片臂和移动臂,其中晶片臂和移动臂可操作以围绕第一轴线旋转。 工件所在的端部执行器与晶片臂连接。 旋转轴将晶片臂和移动臂联接到第一致动器,其中第一致动器向轴提供旋转力。 动量平衡机构联接到轴上并且可操作地大体上使轴的旋转方向反转。 动量平衡机构包括一个或多个固定弹簧元件,其可操作以向耦合到移动臂的移动弹簧元件提供力。 控制器还可操作以将末端执行器的大致恒定的平移速度保持在预定扫描范围内。