公开(公告)号：US08618631B2

公开(公告)日：2013-12-31

申请号：US13372873

申请日：2012-02-14

Applicant: Jun-De Jin ,  Tzu-Jin Yeh

Inventor： Jun-De Jin ,  Tzu-Jin Yeh

IPC: H01L27/08 ,  H01L29/66 ,  H01L21/00

CPC classification number: H01L23/5227 ,  H01L28/10 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor structure having an in situ chip-level ferrite bead inductor and method for forming the same. Embodiments include a substrate, a first dielectric layer formed on the substrate, a lower ferrite layer formed on the first dielectric layer, and an upper ferrite layer spaced apart from the lower ferrite layer in the structure. A first metal layer may be formed above the lower ferrite layer and a second metal layer formed below the upper ferrite layer, wherein at least the first or second metal layer has a coil configuration including multiple turns. At least one second dielectric layer may be disposed between the first and second metal layers. The ferrite bead inductor has a small form factor and is amenable to formation using BEOL processes.

Abstract translation: 一种具有原位芯片级铁氧体磁珠电感器的半导体结构及其形成方法。 实施例包括基板，形成在基板上的第一介电层，形成在第一介电层上的下铁氧体层，以及与该结构中的下铁氧体层间隔开的上铁氧体层。 第一金属层可以形成在下铁素体层上方，第二金属层形成在上铁氧体层下面，其中至少第一或第二金属层具有包括多匝的线圈构型。 至少一个第二电介质层可以设置在第一和第二金属层之间。 铁氧体磁珠电感器具有小的外形尺寸，并且可以使用BEOL工艺来形成。

公开(公告)号：US20130181534A1

公开(公告)日：2013-07-18

申请号：US13350206

申请日：2012-01-13

Applicant: Jun-De Jin ,  Tzu-Jin Yeh

Inventor： Jun-De Jin ,  Tzu-Jin Yeh

IPC: H01F38/14

CPC classification number: H01F38/14 ,  H01F27/2804 ,  H01F37/00 ,  H01L23/48 ,  H01L23/5227 ,  H01L23/64 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2225/06531

Abstract: A transformer for RF and other frequency through-chip-interface (TCI) applications includes multiple chips in wireless electronic communication with one another in three-dimensional integrated circuit, 3DIC, technology. Each of the chips includes an inductor coil and a matching network that matches the impedance of the inductor coil. The matching network is electrically coupled between the inductor coil and further components and circuits formed on the chip.

Abstract translation: 用于RF和其他频率通过芯片接口（TCI）应用的变压器包括在三维集成电路，3DIC技术中彼此无线电子通信的多个芯片。 每个芯片包括电感线圈和与电感线圈的阻抗匹配的匹配网络。 匹配网络电耦合在电感线圈和形成在芯片上的其它部件和电路之间。

公开(公告)号：US09397729B2

公开(公告)日：2016-07-19

申请号：US12946072

申请日：2010-11-15

Applicant: Tzu-Jin Yeh ,  Hsieh-Hung Hsieh ,  Jun-De Jin ,  Ming Hsien Tsai ,  Chewn-Pu Jou ,  Fu-Lung Hsueh

Inventor： Tzu-Jin Yeh ,  Hsieh-Hung Hsieh ,  Jun-De Jin ,  Ming Hsien Tsai ,  Chewn-Pu Jou ,  Fu-Lung Hsueh

IPC: H04B5/00

CPC classification number: H04B5/0081

Abstract: Through-chip coupling is utilized for signal transport, where an interface is formed between a first coil on a first integrated circuit (IC) chip and a second coil on a second IC chip. The first coil is coupled to an antenna. The second coil is coupled to an amplifier circuit. The second coil is not in direct contact with the first coil. The first coil and the second coil communicatively transmit signals between the antenna and the first amplifier circuit.

Abstract translation: 芯片耦合用于信号传输，其中在第一集成电路（IC）芯片上的第一线圈和第二IC芯片上的第二线圈之间形成接口。 第一线圈耦合到天线。 第二线圈耦合到放大器电路。 第二线圈不与第一线圈直接接触。 第一线圈和第二线圈在天线和第一放大器电路之间通信地传送信号。

公开(公告)号：US09093977B2

公开(公告)日：2015-07-28

申请号：US13562571

申请日：2012-07-31

Applicant: Jun-De Jin ,  Ming Hsien Tsai ,  Tzu-Jin Yeh

Inventor： Jun-De Jin ,  Ming Hsien Tsai ,  Tzu-Jin Yeh

IPC: H02H9/00 ,  H03H7/40 ,  H02H9/04 ,  H01L23/60 ,  H01L23/64 ,  H01L23/522

CPC classification number: H03H7/40 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/60 ,  H01L23/64 ,  H01L2924/0002 ,  H02H9/04 ,  H02H9/046 ,  Y10T29/49117 ,  H01L2924/00

Abstract: The present disclosure relates to an on-chip electrostatic discharge (ESD) protection circuit that may be reused for a variety of integrated circuit (IC) applications. Both inductor-capacitor (LC) parallel resonator and shunt inductor (connected to ground) are used as ESD protection circuits and also as a part of an impedance matching network for a given IC application. The ESD LC resonator can be designed with a variety of band pass filter (BPF) topologies. On-chip ESD protection circuit allows for co-optimization ESD and BPF performance simultaneously, a fully on-chip ESD solution for integrated passive device (IPD) processes, eliminates a need for active ESD device protection, additional processes to support off-chip ESD protection, reduces power consumption, and creates a reusable BPF topology.

Abstract translation: 本公开涉及可以重用于各种集成电路（IC）应用的片上静电放电（ESD）保护电路。 电感 - 电容（LC）并联谐振器和并联电感（连接到地）均用作ESD保护电路，也可用作给定IC应用的阻抗匹配网络的一部分。 ESD LC谐振器可以设计有各种带通滤波器（BPF）拓扑。 片上ESD保护电路允许同时优化ESD和BPF性能，用于集成无源器件（IPD）工艺的完全片上ESD解决方案，无需主动ESD器件保护，另外还支持片外ESD保护 保护，降低功耗，并创建可重用的BPF拓扑。

公开(公告)号：US20130207230A1

公开(公告)日：2013-08-15

申请号：US13372873

申请日：2012-02-14

Applicant: Jun-De Jin ,  Tzu-Jin Yeh

Inventor： Jun-De Jin ,  Tzu-Jin Yeh

IPC: H01L27/06 ,  H01L21/02

CPC classification number: H01L23/5227 ,  H01L28/10 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor structure having an in situ chip-level ferrite bead inductor and method for forming the same. Embodiments include a substrate, a first dielectric layer formed on the substrate, a lower ferrite layer formed on the first dielectric layer, and an upper ferrite layer spaced apart from the lower ferrite layer in the structure. A first metal layer may be formed above the lower ferrite layer and a second metal layer formed below the upper ferrite layer, wherein at least the first or second metal layer has a coil configuration including multiple turns. At least one second dielectric layer may be disposed between the first and second metal layers. The ferrite bead inductor has a small form factor and is amenable to formation using BEOL processes.

Abstract translation: 一种具有原位芯片级铁氧体磁珠电感器的半导体结构及其形成方法。 实施例包括基板，形成在基板上的第一介电层，形成在第一介电层上的下铁氧体层，以及与该结构中的下铁氧体层间隔开的上铁氧体层。 第一金属层可以形成在下铁素体层上方，第二金属层形成在上铁氧体层下面，其中至少第一或第二金属层具有包括多匝的线圈构型。 至少一个第二电介质层可以设置在第一和第二金属层之间。 铁氧体磁珠电感器具有小的外形尺寸，并且可以使用BEOL工艺来形成。

公开(公告)号：US08848390B2

公开(公告)日：2014-09-30

申请号：US13028270

申请日：2011-02-16

Applicant: Jun-De Jin ,  Ming Hsien Tsai ,  Tzu-Jin Yeh

Inventor： Jun-De Jin ,  Ming Hsien Tsai ,  Tzu-Jin Yeh

IPC: H05K1/11 ,  H05K1/14 ,  H01L23/48 ,  H01L25/065 ,  H01Q1/22 ,  H01L23/64

CPC classification number: H01L25/0657 ,  H01L23/48 ,  H01L23/645 ,  H01L2225/06531 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01Q1/2283 ,  H01L2924/00

Abstract: A multi-chip module includes a chip stack package including at least one pair of stacked dies, the dies having overlapping opposing faces, and at least one capacitive proximity communication (CPC) interconnect between the pair of stacked dies. The CPC interconnect includes a first capacitor plate at a first one of the overlapping opposing faces and a second capacitor plate at a second one of the overlapping opposing faces spaced from and aligned with the first capacitor plate. The CPC interconnect further includes an inductive element connected in series with the first capacitor plate and second capacitor plate, wherein the capacitor plates form part of a capacitor and the capacitor cooperates with the inductor element to form a LC circuit having a resonant frequency.

Abstract translation: 多芯片模块包括芯片堆叠封装，其包括至少一对堆叠的裸片，所述裸片具有重叠的相对面，以及在所述一对堆叠裸片之间的至少一个电容邻近通信（CPC）互连。 CPC互连包括在重叠相对面中的第一个处的第一电容器板和与第一电容器板间隔开并与第一电容器板对准的第二个重叠相对面中的第二电容器板。 CPC互连还包括与第一电容器板和第二电容器板串联连接的电感元件，其中电容器板形成电容器的一部分，并且电容器与电感器元件配合以形成具有谐振频率的LC电路。

公开(公告)号：US08830011B2

公开(公告)日：2014-09-09

申请号：US13282642

申请日：2011-10-27

Applicant: Jun-De Jin ,  Tzu-Jin Yeh

Inventor： Jun-De Jin ,  Tzu-Jin Yeh

IPC: H03H7/075 ,  H03H7/01

CPC classification number: H03H7/075 ,  H03H7/1758

Abstract: A band-pass filter includes an input node coupled to receive an oscillating input signal, an output node, and a first LC resonator coupled to a first node coupled between the input node and the output node and to a first power supply node coupled to provide a first voltage. The first LC resonator includes a first capacitor, and a first inductor coupled in series with the first capacitor. The output node is coupled to output a filtered response signal that includes at least one zero based on the oscillating input signal and the first LC resonator.

Abstract translation: 带通滤波器包括耦合以接收振荡输入信号的输入节点，输出节点和耦合到耦合在输入节点和输出节点之间的第一节点的第一LC谐振器和耦合到第一电源节点的第一电源节点， 第一电压。 第一LC谐振器包括第一电容器和与第一电容器串联耦合的第一电感器。 输出节点被耦合以输出基于振荡输入信号和第一LC谐振器包括至少一个零的滤波响应信号。

公开(公告)号：US08742871B2

公开(公告)日：2014-06-03

申请号：US13044619

申请日：2011-03-10

Applicant: Jun-De Jin ,  Ming Hsien Tsai ,  Tzu-Jin Yeh

Inventor： Jun-De Jin ,  Ming Hsien Tsai ,  Tzu-Jin Yeh

IPC: H03H7/01 ,  H03H7/00

CPC classification number: H03H7/09 ,  H03H7/075 ,  H03H7/1758 ,  H03H2001/0078

Abstract: A bandpass filter comprises a first capacitor, a second capacitor, a third capacitor and at least two resonators. The first and second capacitors are coupled in parallel with each other, and each of the first and second capacitors includes an input. The third capacitor is coupled between the first capacitor and the second capacitor at their respective inputs. The at least two resonators are coupled in parallel with the first capacitor and the second capacitor and are positioned adjacent to each other at a distance such that the at least one component of the resonators are electromagnetically coupled together to provide three (3) transmission zeros.

Abstract translation: 带通滤波器包括第一电容器，第二电容器，第三电容器和至少两个谐振器。 第一和第二电容器彼此并联耦合，并且第一和第二电容器中的每一个包括输入端。 第三电容器在它们各自的输入处耦合在第一电容器和第二电容器之间。 所述至少两个谐振器与第一电容器和第二电容器并联耦合并且以一定距离彼此相邻地定位，使得谐振器的至少一个分量电磁耦合在一起以提供三（3）个传输零点。

公开(公告)号：US08610494B1

公开(公告)日：2013-12-17

申请号：US13494263

申请日：2012-06-12

Applicant: Jun-De Jin ,  Tzu-Jin Yeh

Inventor： Jun-De Jin ,  Tzu-Jin Yeh

IPC: H03B1/00

CPC classification number: H03H7/0115 ,  H03H7/1758 ,  H03H11/48

Abstract: Some embodiments relate to a band-pass filter arranged in a ladder-like structure. The band-pass filter includes respective inductor-capacitor (LC) resonators arranged on respective rungs of the ladder-like structure. Respective matching circuits are arranged on a leg of the ladder-like structure between neighboring rungs.

Abstract translation: 一些实施例涉及布置成阶梯状结构的带通滤波器。 带通滤波器包括布置在阶梯状结构的各个梯级上的相应的电感器 - 电容器（LC）谐振器。 相应的匹配电路布置在相邻梯级之间的梯状结构的腿上。

公开(公告)号：US20130106532A1

公开(公告)日：2013-05-02

申请号：US13282642

申请日：2011-10-27

Applicant: Jun-De JIN ,  Tzu-Jin Yeh

Inventor： Jun-De JIN ,  Tzu-Jin Yeh

IPC: H03H7/075

CPC classification number: H03H7/075 ,  H03H7/1758

Abstract: A band-pass filter includes an input node coupled to receive an oscillating input signal, an output node, and a first LC resonator coupled to a first node coupled between the input node and the output node and to a first power supply node coupled to provide a first voltage. The first LC resonator includes a first capacitor, and a first inductor coupled in series with the first capacitor. The output node is coupled to output a filtered response signal that includes at least one zero based on the oscillating input signal and the first LC resonator.

Abstract translation: 带通滤波器包括耦合以接收振荡输入信号的输入节点，输出节点和耦合到耦合在输入节点和输出节点之间的第一节点的第一LC谐振器和耦合到第一电源节点的第一电源节点， 第一电压。 第一LC谐振器包括第一电容器和与第一电容器串联耦合的第一电感器。 输出节点被耦合以输出基于振荡输入信号和第一LC谐振器包括至少一个零的滤波响应信号。