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公开(公告)号：US20170287128A1
公开(公告)日：2017-10-05
申请号：US15624649
申请日：2017-06-15
Applicant: KLA-Tencor Corporation
Inventor： Junqing Huang , Hucheng Lee , Kenong Wu , Lisheng Gao
CPC classification number: G06T7/0008 , G06T7/0006 , G06T7/90 , G06T2207/10024 , G06T2207/20024 , G06T2207/20076 , G06T2207/30148
Abstract: Methods and systems for detecting defects on a wafer using adaptive local thresholding and color filtering are provided. One method includes determining local statistics of pixels in output for a wafer generated using an inspection system, determining which of the pixels are outliers based on the local statistics, and comparing the outliers to the pixels surrounding the outliers to identify the outliers that do not belong to a cluster of outliers as defect candidates, The method also includes determining a value for a difference in color between the pixels of the defect candidates and the pixels surrounding the defect candidates. The method further includes identifying the defect candidates that have a value for the difference in color greater than or equal to a predetermined value as nuisance defects and the defect candidates that have a value for the difference in color less than the predetermined value as real defects,
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公开(公告)号：US20170286589A1
公开(公告)日：2017-10-05
申请号：US15351813
申请日：2016-11-15
Applicant: KLA-Tencor Corporation
Inventor： Junqing Huang , Soren Konecky , Hucheng Lee , Kenong Wu , Lisheng Gao
IPC: G06F17/50
CPC classification number: G06F17/5081 , G01N21/9501 , G03F7/7065
Abstract: A method includes identifying a first set of a first care area with a first sensitivity threshold, the first care area associated with a first design of interest within a block of repeating cells in design data; identifying an additional set of an additional care area with an additional sensitivity threshold, the additional care area associated with an additional design of interest within the block of repeating cells in design data; identifying one or more defects within the first set of the first care areas in one or more images of a selected region of a sample based on the first sensitivity threshold; and identifying one or more defects within the additional set of the additional care areas in the one or more images of the selected region of the sample based on the additional sensitivity threshold.
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公开(公告)号：US20150063677A1
公开(公告)日：2015-03-05
申请号：US14468237
申请日：2014-08-25
Applicant: KLA-Tencor Corporation
Inventor： Junqing Huang , Huan Jin , Grace Hsiu-Ling Chen , Lisheng Gao
CPC classification number: G01N21/9501 , G06T5/002 , G06T2207/20061 , G06T2207/30148
Abstract: Methods and systems for filtering scratches from wafer inspection results are provided. One method includes generating a defect candidate map that includes image data for potential defect candidates as a function of position on the wafer and removing noise from the defect candidate map to generate a filtered defect candidate map. The method also includes determining one or more characteristics of the potential defect candidates based on portions of the filtered defect candidate map corresponding to the potential defect candidates. In addition, the method includes determining if each of the potential defect candidates are scratches based on the one or more characteristics determined for each of the potential defect candidates and separating the potential defect candidates determined to be the scratches from other defects in inspection results for the wafer.
Abstract translation: 提供了从晶片检查结果过滤划痕的方法和系统。 一种方法包括生成缺陷候选图，其包括作为晶片上的位置的函数的潜在缺陷候选的图像数据，并且从缺陷候选图中去除噪声以生成滤波的缺陷候选图。 该方法还包括基于与潜在缺陷候选对应的经滤波的缺陷候选映射的部分来确定潜在缺陷候选的一个或多个特性。 此外，该方法包括基于为每个潜在缺陷候选确定的一个或多个特性确定每个潜在的缺陷候选是否划伤，并且将确定为划痕的潜在缺陷候选与检查结果中的其他缺陷分离为 晶圆。
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公开(公告)号：US20150062571A1
公开(公告)日：2015-03-05
申请号：US14470916
申请日：2014-08-27
Applicant: KLA-Tencor Corporation
Inventor： Ashok V. Kulkarni , Lisheng Gao , Junqing Huang
CPC classification number: H01L22/12 , G01N21/9501 , H01L22/20
Abstract: Systems and methods for determining one or more parameters of a wafer inspection process are provided. One method includes aligning optical image(s) of an alignment target to their corresponding electron beam images generated by an electron beam defect review system. The method also includes determining different local coordinate transformations for different subsets of alignment targets based on results of the aligning. In addition, the method includes determining positions of defects in wafer inspection system coordinates based on coordinates of the defects determined by the electron beam defect review system and the different local coordinate transformations corresponding to different groups of the defects into which the defects have been separated. The method further includes determining one or more parameters for an inspection process for the wafer based on defect images acquired at the determined positions by a wafer inspection system.
Abstract translation: 提供了用于确定晶片检查过程的一个或多个参数的系统和方法。 一种方法包括将对准靶的光学图像与由电子束缺陷检查系统产生的相应的电子束图像对准。 该方法还包括基于对准的结果确定不同的对准目标子集的不同局部坐标变换。 此外，该方法包括基于由电子束缺陷评估系统确定的缺陷的坐标以及对应于缺陷已分离的缺陷的不同组的不同局部坐标变换来确定晶片检查系统坐标中缺陷的位置。 该方法还包括基于由晶片检查系统在所确定的位置处获取的缺陷图像来确定用于晶片的检查处理的一个或多个参数。
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公开(公告)号：US10599944B2
公开(公告)日：2020-03-24
申请号：US13685808
申请日：2012-11-27
Applicant: KLA-Tencor Corporation
Inventor： Hucheng Lee , Junqing Huang , Lisheng Gao
Abstract: The disclosure is directed to providing visual feedback for inspection algorithms and difference filters used to process test and reference images from an inspection system. A user interface may be configured for displaying information and accepting user commands. A computing system communicatively coupled to the user interface may be configured to receive at least one set of test and reference images collected by the inspection system. The computing system may be further configured to provide at least one visual representation of the test and reference images via the user interface to show effects of an inspection algorithm and/or difference filter.
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Patent Agency Ranking
公开(公告)号：US10395359B2
公开(公告)日：2019-08-27
申请号：US15624649
申请日：2017-06-15
Applicant: KLA-Tencor Corporation
Inventor： Junqing Huang , Hucheng Lee , Kenong Wu , Lisheng Gao
Abstract: Methods and systems for detecting defects on a wafer using adaptive local thresholding and color filtering are provided. One method includes determining local statistics of pixels in output for a wafer generated using an inspection system, determining which of the pixels are outliers based on the local statistics, and comparing the outliers to the pixels surrounding the outliers to identify the outliers that do not belong to a cluster of outliers as defect candidates. The method also includes determining a value for a difference in color between the pixels of the defect candidates and the pixels surrounding the defect candidates. The method further includes identifying the defect candidates that have a value for the difference in color greater than or equal to a predetermined value as nuisance defects and the defect candidates that have a value for the difference in color less than the predetermined value as real defects.
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公开(公告)号：US10339262B2
公开(公告)日：2019-07-02
申请号：US15351813
申请日：2016-11-15
Applicant: KLA-Tencor Corporation
Inventor： Junqing Huang , Soren Konecky , Hucheng Lee , Kenong Wu , Lisheng Gao
Abstract: A method includes identifying a first set of a first care area with a first sensitivity threshold, the first care area associated with a first design of interest within a block of repeating cells in design data; identifying an additional set of an additional care area with an additional sensitivity threshold, the additional care area associated with an additional design of interest within the block of repeating cells in design data; identifying one or more defects within the first set of the first care areas in one or more images of a selected region of a sample based on the first sensitivity threshold; and identifying one or more defects within the additional set of the additional care areas in the one or more images of the selected region of the sample based on the additional sensitivity threshold.
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公开(公告)号：US20150043804A1
公开(公告)日：2015-02-12
申请号：US14450170
申请日：2014-08-01
Applicant: KLA-Tencor Corporation
Inventor： Junqing Huang , Hucheng Lee , Kenong Wu , Lisheng Gao
CPC classification number: G06T7/0008 , G06T7/0006 , G06T7/90 , G06T2207/10024 , G06T2207/20024 , G06T2207/20076 , G06T2207/30148
Abstract: Methods and systems for detecting defects on a wafer using adaptive local thresholding and color filtering are provided. One method includes determining local statistics of pixels in output for a. wafer generated using an inspection system, determining which of the pixels are outliers based on the local statistics, and comparing the outliers to the pixels surrounding the outliers to identify the outliers that do not belong to a cluster of outliers as defect candidates. The method also includes determining a value for a difference in color between the pixels of the defect candidates and the pixels surrounding the defect candidates. The method further includes identifying the defect candidates that have a value for the difference in color greater than or equal to a predetermined value as nuisance defects and the defect candidates that have a value for the difference in color less than the predetermined value as real defects.
Abstract translation: 提供了使用自适应局部阈值和颜色滤波来检测晶片上的缺陷的方法和系统。 一种方法包括确定a的输出中的像素的局部统计。 使用检查系统生成的晶片，基于本地统计确定哪个像素是异常值，以及将异常值与异常值周围的像素进行比较，以将不属于异常值聚类的异常值识别为缺陷候选。 该方法还包括确定缺陷候选的像素与围绕缺陷候选的像素之间的颜色差异的值。 该方法还包括将具有大于或等于预定值的颜色差值的缺陷候选识别为具有小于预定值的颜色差值作为真实缺陷的有害缺陷和缺陷候选。
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公开(公告)号：US20140270474A1
公开(公告)日：2014-09-18
申请号：US13796955
申请日：2013-03-12
Applicant: KLA-Tencor Corporation
Inventor： Junqing Huang , Lisheng Gao
IPC: G06T7/00
CPC classification number: G06T7/0004 , G01N21/88 , G01N21/8803 , G01N21/9501 , G01N21/956 , G01N21/95607 , G01N2021/8825 , G06T7/0002 , G06T7/001 , G06T2207/10061 , G06T2207/20076 , G06T2207/30148
Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes determining difference values for pixels in first output for a wafer generated using a first optics mode of an inspection system and determining other values for pixels in second output for the wafer generated using a second optics mode of the inspection system. The first and second optics modes are different from each other. The method also includes generating a two-dimensional scatter plot of the difference values and the other values for the pixels in the first and second output corresponding to substantially the same locations on the wafer. The method further includes detecting defects on the wafer based on the two-dimensional scatter plot.
Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括确定使用检查系统的第一光学模式产生的晶片的第一输出中的像素的差值，并且使用检查系统的第二光学模式确定晶片的第二输出中的像素的其它值。 第一和第二光学模式彼此不同。 该方法还包括生成对应于晶片上基本上相同位置的第一和第二输出中的差值和其它值的二维散点图。 该方法还包括基于二维散点图检测晶片上的缺陷。
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公开(公告)号：US20140185919A1
公开(公告)日：2014-07-03
申请号：US13733133
申请日：2013-01-02
Applicant: KLA-Tencor Corporation
Inventor： Jun Lang , Kan Chen , Lisheng Gao , Junqing Huang
IPC: G06T7/00
CPC classification number: G06T7/0004 , G01N21/8851 , G01N21/9501 , G01N2021/8867 , G03F7/70616 , G03F7/7065 , G06T7/0008 , G06T2207/10152 , G06T2207/30148
Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes identifying one or more characteristics of first raw output generated for a wafer that correspond to one or more geometrical characteristics of patterned features formed on the wafer and assigning individual output in second raw output generated for the wafer to different segments based on the identified one or more characteristics of the first raw output and based on the individual output in the second raw output and individual output in the first raw output that were generated at substantially the same locations on the wafer such that the one or more geometrical characteristics of the patterned features that correspond to each of the different segments in the second raw output are different.
Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括识别对应于晶片上形成的图案化特征的一个或多个几何特征的晶片产生的第一原始输出的一个或多个特征，并且基于所识别的将针对晶片生成的第二原始输出中的各个输出分配给不同的段 第一原始输出的一个或多个特征，并且基于第二原始输出中的单独输出和在第一原始输出中在晶片上的基本相同位置处产生的单独输出，使得图案化的一个或多个几何特征 对应于第二原始输出中的每个不同段的特征是不同的。
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