公开(公告)号：US10451412B2

公开(公告)日：2019-10-22

申请号：US15613119

申请日：2017-06-02

Applicant: KLA-Tencor Corporation

Inventor： Michael Adel ,  Walter D. Mieher ,  Ibrahim Abdulhalim ,  Ady Levy ,  Michael Friedmann

IPC: G03F7/20 ,  G01B11/27 ,  G01N21/95 ,  G01N21/47 ,  H01L21/68 ,  H01L23/544

Abstract: Disclosed is a method for determining an overlay error between at least two layers in a multiple layer sample. An imaging optical system is used to measure multiple measured optical signals from multiple periodic targets on the sample, and the targets each have a first structure in a first layer and a second structure in a second layer. There are predefined offsets between the first and second structures A scatterometry overlay technique is used to analyze the measured optical signals of the periodic targets and the predefined offsets of the first and second structures of the periodic targets to thereby determine an overlay error between the first and second structures of the periodic targets. The scatterometry overlay technique is a phase based technique, and the imaging optical system is configured to have an illumination and/or collection numerical aperture (NA) and/or spectral band selected so that a specific diffraction order is collected and measured for the plurality of measured optical signals. In one aspect, the number of periodic targets equals half the number of unknown parameters.

公开(公告)号：US20140199791A1

公开(公告)日：2014-07-17

申请号：US14083126

申请日：2013-11-18

Applicant: KLA-Tencor Corporation

Inventor： Allen Park ,  Ellis Chang ,  Michael Adel ,  Kris Bhaskar ,  Ady Levy ,  Amir Widmann ,  Mark Wagner ,  Songnian Rong

IPC: H01L21/66 ,  G06F17/50

CPC classification number: H01L22/12 ,  G06F17/5081

Abstract: Universal target based inspection drive metrology includes designing a plurality of universal metrology targets measurable with an inspection tool and measurable with a metrology tool, identifying a plurality of inspectable features within at least one die of a wafer using design data, disposing the plurality of universal targets within the at least one die of the wafer, each universal target being disposed at least proximate to one of the identified inspectable features, inspecting a region containing one or more of the universal targets with an inspection tool, identifying one or more anomalistic universal targets in the inspected region with an inspection tool and, responsive to the identification of one or more anomalistic universal targets in the inspected region, performing one or more metrology processes on the one or more anomalistic universal metrology targets with the metrology tool.

Abstract translation: 通用的基于目标的检测驱动度量包括设计多个通过检测工具测量的通用度量目标并且可以用计量工具测量，使用设计数据识别晶片的至少一个管芯内的多个检查特征，将多个通用目标 在晶片的至少一个模具内，每个通用目标被设置为至少接近所识别的可检查特征之一，用检查工具检查包含一个或多个通用目标的区域，以识别一个或多个异常通用目标 检查区域具有检查工具，并且响应于在被检查区域中识别一个或多个异常通用目标，对所述一个或多个异常通用度量目标与计量工具执行一个或多个计量过程。

公开(公告)号：US10763146B2

公开(公告)日：2020-09-01

申请号：US15751514

申请日：2017-12-11

Applicant: KLA-TENCOR CORPORATION

Inventor： Roie Volkovich ,  Michael Adel ,  Liran Yerushalmi ,  Eitan Herzel ,  Mengmeng Ye ,  Eran Amit

IPC: H01L21/67 ,  G01D18/00 ,  H01L21/66

Abstract: Metrology methods and modules are provided, which comprise carrying out recipe setup procedure(s) and/or metrology measurement(s) using zonal analysis with respect to respective setup parameter(s) and/or metrology metric(s). The zonal analysis comprises relating to spatially variable values of the setup parameter(s) and/or metrology metric(s) across one or more wafers in one or more lots. Wafer zones may be discrete or spatially continuous, and be used to weight one or more parameter(s) and/or metric(s) during any of the stages of the respective setup and measurement processes.

公开(公告)号：US09702693B2

公开(公告)日：2017-07-11

申请号：US15136855

申请日：2016-04-22

Applicant: KLA-Tencor Corporation

Inventor： Mark Ghinovker ,  Michael Adel ,  Walter D. Mieher ,  Ady Levy ,  Dan Wack

IPC: G03F7/20 ,  G01B11/27 ,  G01N21/47 ,  G01N21/95 ,  H01L21/68 ,  H01L23/544

CPC classification number: G01B11/272 ,  G01N21/4785 ,  G01N21/9501 ,  G03F7/70633 ,  H01L21/68 ,  H01L21/682 ,  H01L23/544 ,  Y10S438/975

Abstract: A metrology system for determining overlay is disclosed. The system includes an optical assembly for capturing images of an overlay mark and a computer for analyzing the captured images to determine whether there is an overlay error. The mark comprises first and second regions that each include at least two separately generated working zones, juxtaposed relative to one another, configured to provide overlay information in a first direction, and include a periodic structure having coarsely segmented elements. The mark comprises third and fourth regions that each include at least two separately generated working zones, juxtaposed relative to one another, configured to provide overlay information in a second direction, and include a periodic structure having coarsely segmented elements. Working zones of the first and second regions are diagonally opposed and spatially offset relative to one another, and the working zones of the third and fourth regions are diagonally opposed and spatially offset relative to one another.

公开(公告)号：US09576861B2

公开(公告)日：2017-02-21

申请号：US14083126

申请日：2013-11-18

Applicant: KLA-Tencor Corporation

Inventor： Allen Park ,  Ellis Chang ,  Michael Adel ,  Kris Bhaskar ,  Ady Levy ,  Amir Widmann ,  Mark Wagner ,  Songnian Rong

IPC: G06F17/50 ,  H01L21/66

CPC classification number: H01L22/12 ,  G06F17/5081

Abstract: Universal target based inspection drive metrology includes designing a plurality of universal metrology targets measurable with an inspection tool and measurable with a metrology tool, identifying a plurality of inspectable features within at least one die of a wafer using design data, disposing the plurality of universal targets within the at least one die of the wafer, each universal target being disposed at least proximate to one of the identified inspectable features, inspecting a region containing one or more of the universal targets with an inspection tool, identifying one or more anomalistic universal targets in the inspected region with an inspection tool and, responsive to the identification of one or more anomalistic universal targets in the inspected region, performing one or more metrology processes on the one or more anomalistic universal metrology targets with the metrology tool.

Abstract translation: 通用的基于目标的检测驱动度量包括设计多个通过检测工具测量的通用度量目标并且可以用计量工具测量，使用设计数据识别晶片的至少一个管芯内的多个检查特征，将多个通用目标 在晶片的至少一个模具内，每个通用目标被设置为至少接近所识别的可检查特征之一，用检查工具检查包含一个或多个通用目标的区域，以识别一个或多个异常通用目标 检查区域具有检查工具，并且响应于在被检查区域中识别一个或多个异常通用目标，对所述一个或多个异常通用度量目标与计量工具执行一个或多个计量过程。

公开(公告)号：US20160313116A1

公开(公告)日：2016-10-27

申请号：US15136855

申请日：2016-04-22

Applicant: KLA-Tencor Corporation

Inventor： Mark Ghinovker ,  Michael Adel ,  Walter D. Mieher ,  Ady Levy ,  Dan Wack

IPC: G01B11/27

CPC classification number: G01B11/272 ,  G01N21/4785 ,  G01N21/9501 ,  G03F7/70633 ,  H01L21/68 ,  H01L21/682 ,  H01L23/544 ,  Y10S438/975

Abstract: A metrology system for determining overlay is disclosed. The system includes an optical assembly for capturing images of an overlay mark and a computer for analyzing the captured images to determine whether there is an overlay error. The mark comprises first and second regions that each include at least two separately generated working zones, juxtaposed relative to one another, configured to provide overlay information in a first direction, and include a periodic structure having coarsely segmented elements. The mark comprises third and fourth regions that each include at least two separately generated working zones, juxtaposed relative to one another, configured to provide overlay information in a second direction, and include a periodic structure having coarsely segmented elements. Working zones of the first and second regions are diagonally opposed and spatially offset relative to one another, and the working zones of the third and fourth regions are diagonally opposed and spatially offset relative to one another.

Abstract translation: 公开了一种用于确定覆盖层的计量系统。 该系统包括用于捕获覆盖标记的图像的光学组件和用于分析所捕获图像的计算机，以确定是否存在重叠错误。 标记包括第一和第二区域，每个区域包括至少两个单独生成的工作区域，其相对于彼此并置，被配置为在第一方向上提供覆盖信息，并且包括具有粗分段元素的周期性结构。 标记包括第三和第四区域，每个区域包括相对于彼此并置的至少两个单独生成的工作区域，其被配置为在第二方向上提供覆盖信息，并且包括具有粗分段元素的周期性结构。 第一区域和第二区域的工作区域相对于彼此对角地相对并且在空间上偏移，并且第三区域和第四区域的工作区域相对于彼此对角地相对并且在空间上偏移。