Abstract:
An apparatus and method for manufacturing particles using corona discharge is disclosed. A discharge electrode is provided within a guide duct and reaction gases are supplied into the guide duct. A high voltage is applied to the discharge electrode and a low voltage is applied to the guide duct to generate a voltage difference therebetween. When heat energy is applied to the reaction gases, chemical reactions occur in the gases and particles are made by the chemical reactions. The particles form new particles centering around ions as nuclei which are generated by corona discharge and moves along the guide duct. A collecting plate positioned in front of the guide duct collects the particles.
Abstract:
A condensation particle counter measures the number of ultra-fine particles by growing the ultra-fine particles through a condensing process. The counter includes a capillary in which vapor of operating liquid is condensed and the ultra-fine particles grow. An insulating material surrounds the capillary to shut out heat flow between the capillary and the environment. The condensation particle counter can use various operating liquids including alcohol and water, and can be also applied to semiconductor clean rooms.
Abstract:
A method for reducing targeting errors encountered when trying to locate contaminant particles in a high-magnification imaging device, based on estimates of the particle positions obtained from a scanning device. The method of the invention uses three techniques separately and in combination. The first technique includes selecting at least three reference particles, to provide multiple unique pairs of reference particles for computation of an averaged set of coordinate transformation parameters, used to transform particle position coordinates from the coordinate system of the scanning device to the coordinate system of the imaging device. The averaged transformation parameters result in much smaller targeting errors between the estimated and actual positions of the particles. The targeting errors are further reduced by the use of multiple scans of the scanning device. In a third technique, accumulated reference particle targeting errors observed in prior processing of other wafers are used to reduce these targeting errors when processing a new wafer.