公开(公告)号：US07836597B2

公开(公告)日：2010-11-23

申请号：US11326690

申请日：2006-01-06

申请人： Madhav Datta ,  Mark McMaster ,  Rick Brewer ,  Peng Zhou ,  Paul Tsao ,  Girish Upadhaya ,  Mark Munch

发明人： Madhav Datta ,  Mark McMaster ,  Rick Brewer ,  Peng Zhou ,  Paul Tsao ,  Girish Upadhaya ,  Mark Munch

IPC分类号： B23P15/26 ,  F28D15/00

CPC分类号： F04B17/00 ,  F04B19/006 ,  F28D15/0266 ,  F28F3/12 ,  F28F13/185 ,  F28F2245/04 ,  H01L21/4882 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/49353 ,  Y10T29/49366 ,  Y10T29/49369 ,  H01L2924/00

摘要： An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.

摘要翻译： 公开了一种制造用于热交换器的微结构的结构和方法。 热交换器包括歧管层和微结构区域。 歧管层包括将流体输送到微结构化区域的结构。 微结构区域由多个由热导层形成的窗口层形成，多个微孔通过该导热层通过湿蚀刻工艺形成。 然后将多个窗口层耦合在一起以形成复合微结构。

公开(公告)号：US20070175621A1

公开(公告)日：2007-08-02

申请号：US11345556

申请日：2006-01-31

申请人： Madhav Datta ,  Peng Zhou ,  James Hom ,  Mark Munch ,  Mark McMaster

发明人： Madhav Datta ,  Peng Zhou ,  James Hom ,  Mark Munch ,  Mark McMaster

IPC分类号： H05K7/20

CPC分类号： H01L23/3736 ,  H01L23/3735 ,  H01L23/473 ,  H01L2224/73253

摘要： A heat exchanging system uses a metallic TIM for efficient heat transfer between a heat source and a heat exchanger. The heat source is preferably an integrated circuit coupled to a circuit board. The metallic TIM preferably comprises indium. The metallic TIM is comprised of either a separate metallic TIM foil or as a deposited layer of metal material. The metallic TIM foil is mechanically joined to a first surface of the heat exchanger and to a first surface of the integrated circuit by applying sufficient pressure during clamping. Disassembly is accomplished by un-clamping the heat exchanger, the metallic TIM foil, and the integrated circuit from each other. Once disassembled, the heat exchanger and the metallic TIM foil are available to be used again. If the metallic TIM is deposited onto the heat exchanger, disassembly yields a heat exchanging sub-assembly that is also reusable.

摘要翻译： 热交换系统使用金属TIM来在热源和热交换器之间进行有效的热传递。 热源优选为耦合到电路板的集成电路。 金属TIM优选包含铟。 金属TIM由单独的金属TIM箔或金属材料的沉积层组成。 金属TIM箔通过在夹紧期间施加足够的压力机械地连接到热交换器的第一表面和集成电路的第一表面。 通过将热交换器，金属TIM箔和集成电路彼此不夹紧来实现拆卸。 一旦分解，热交换器和金属TIM箔可以再次使用。 如果金属TIM沉积在热交换器上，则拆卸产生也是可重复使用的热交换子组件。

公开(公告)号：US07293423B2

公开(公告)日：2007-11-13

申请号：US11049202

申请日：2005-02-01

申请人： Girish Upadhya ,  Richard Grant Brewer ,  Mark McMaster

发明人： Girish Upadhya ,  Richard Grant Brewer ,  Mark McMaster

IPC分类号： F25D21/00

CPC分类号： F28F3/12 ,  F28F2265/14

摘要： An apparatus and method of controlling freezing in a liquid system is disclosed. The apparatus includes a heat exchanger having a initial zone characterized by a surface area to volume ratio. The apparatus also includes means for initiating freezing of a fluid from the initial zone to facilitate volume expansion during freezing in the direction of a final zone characterized by a final zone surface area to volume ratio. The apparatus can further include a plurality of zones located between the initial zone and the final zone, wherein a zone surface area to volume ratio is calculated for each zone. Preferably, the zone surface area to volume ratio of each zone progressively decreases from the initial zone in the direction of the final zone. Preferably, the final freezing zone has the lowest surface area to volume ratio and has sufficient elasticity to accommodate the volume expansion of all the fluid that has frozen from the initial zone.

摘要翻译： 公开了一种在液体系统中控制冷冻的装置和方法。 该装置包括具有以表面积与体积比为特征的初始区的热交换器。 该装置还包括用于启动来自初始区域的流体冷冻的装置，以便在以最终区域表面积与体积比为特征的最终区域的方向上的冷冻期间促进体积膨胀。 该设备还可以包括位于初始区域和最终区域之间的多个区域，其中针对每个区域计算区域表面积与体积比。 优选地，每个区域的区域表面积与体积比逐渐从初始区域沿最终区域的方向减小。 优选地，最终的冷冻区具有最低的表面积与体积比，并且具有足够的弹性以适应从初始区域冻结的所有流体的体积膨胀。

公开(公告)号：US20090046423A1

公开(公告)日：2009-02-19

申请号：US12221961

申请日：2008-08-07

申请人： James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Douglas E. Werner ,  Norman Chow ,  Adrian Correa ,  Brandon Leong ,  Sudhakar Gopalakrishnan ,  Richard Grant Brewer ,  Mark McMaster ,  Girish Upadhya

发明人： James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Douglas E. Werner ,  Norman Chow ,  Adrian Correa ,  Brandon Leong ,  Sudhakar Gopalakrishnan ,  Richard Grant Brewer ,  Mark McMaster ,  Girish Upadhya

IPC分类号： H05K7/20

CPC分类号： H05K7/20736

摘要： The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.

摘要翻译： 电子外壳的后面板包括一个或多个热交换器。 后面板可以是冷却门，其被配置为提供对位于电子外壳内的电缆和设备的访问。 可以通过在诸如标准门的铰链上使门打开来提供这种接近。 在具有多个热交换器的情况下，门可以被构造成段，每个热交换器一个段，并且每个段包括铰链，以便独立于其它段打开。 在一些实施例中，每个部分像标准门一样旋转打开。 在其他实施例中，每个段被配置成围绕水平轴向上或向下旋转。 在其他实施例中，每个部分被配置为与电子外壳断开连接，并且移出方向，在这种情况下，每个热交换器使用可以弯曲的方式或快速断开的柔性管连接。 在其他实施例中，整个后门或后门的每个部分可被构造成像抽屉一样滑动和关闭。

公开(公告)号：US20070201210A1

公开(公告)日：2007-08-30

申请号：US11707332

申请日：2007-02-16

申请人： Norman Chow ,  Paul Tsao ,  Douglas Werner ,  Mark McMaster ,  Girish Upadhya ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

发明人： Norman Chow ,  Paul Tsao ,  Douglas Werner ,  Mark McMaster ,  Girish Upadhya ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

IPC分类号： H05K7/20

CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

摘要： A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.

摘要翻译： 安装系统提供了将来自服务器机架的热交换器与来自电子服务器的热交换器热接触的机构和形式因素。 为了确保良好的热接触，在两个热交换器，排料盘和底盘冷板之间施加压力。 用于接合和分离热交换器的安装机构构造成隔离施加到两个热交换器的力。 安装机构包括互锁机构，其防止施加的力传递到电子服务器的其余部分。 在不隔离该力的情况下，该力被施加到电子服务器和/或机架机架，可能断开电子服务器和机架之间的电连接，以及向电子服务器和机架机架提供机械应力。 安装机构还耦合到电子服务器锁定机构，使得将电子服务器锁定到机架中的动作导致热交换器进行热接触。 这是一个故障安全程序，因为不需要单独的过程来接合电子服务器冷却回路。

公开(公告)号：US20050268626A1

公开(公告)日：2005-12-08

申请号：US11049202

申请日：2005-02-01

申请人： Girish Upadhya ,  Richard Brewer ,  Mark McMaster

发明人： Girish Upadhya ,  Richard Brewer ,  Mark McMaster

IPC分类号： A21D2/00 ,  A21D8/02 ,  F25D21/00 ,  F28F3/12

CPC分类号： F28F3/12 ,  F28F2265/14

摘要： An apparatus and method of controlling freezing in a liquid system is disclosed. The apparatus includes a heat exchanger having a initial zone characterized by a surface area to volume ratio. The apparatus also includes means for initiating freezing of a fluid from the initial zone to facilitate volume expansion during freezing in the direction of a final zone characterized by a final zone surface area to volume ratio. The apparatus can further include a plurality of zones located between the initial zone and the final zone, wherein a zone surface area to volume ratio is calculated for each zone. Preferably, the zone surface area to volume ratio of each zone progressively decreases from the initial zone in the direction of the final zone. Preferably, the final freezing zone has the lowest surface area to volume ratio and has sufficient elasticity to accommodate the volume expansion of all the fluid that has frozen from the initial zone.

摘要翻译： 公开了一种在液体系统中控制冷冻的装置和方法。 该装置包括具有以表面积与体积比为特征的初始区的热交换器。 该设备还包括用于启动来自初始区域的流体冷冻的装置，以便在以最终区域表面积与体积比为特征的最终区域的方向的冷冻期间促进体积膨胀。 该设备还可以包括位于初始区域和最终区域之间的多个区域，其中针对每个区域计算区域表面积与体积比。 优选地，每个区域的区域表面积与体积比逐渐从初始区域沿最终区域的方向减小。 优选地，最终的冷冻区具有最低的表面积与体积比，并且具有足够的弹性以适应从初始区域冻结的所有流体的体积膨胀。

公开(公告)号：US07539020B2

公开(公告)日：2009-05-26

申请号：US11707332

申请日：2007-02-16

申请人： Norman Chow ,  Paul Tsao ,  Douglas E. Werner ,  Mark McMaster ,  Girish Upadhya ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

发明人： Norman Chow ,  Paul Tsao ,  Douglas E. Werner ,  Mark McMaster ,  Girish Upadhya ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

IPC分类号： H05K7/16

CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

摘要： A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.

摘要翻译： 安装系统提供了将来自服务器机架的热交换器与来自电子服务器的热交换器热接触的机构和形式因素。 为了确保良好的热接触，在两个热交换器，排料盘和底盘冷板之间施加压力。 用于接合和分离热交换器的安装机构构造成隔离施加到两个热交换器的力。 安装机构包括互锁机构，其防止施加的力传递到电子服务器的其余部分。 在不隔离该力的情况下，该力被施加到电子服务器和/或机架机架，可能断开电子服务器和机架之间的电连接，以及向电子服务器和机架机架提供机械应力。 安装机构还耦合到电子服务器锁定机构，使得将电子服务器锁定到机架中的动作导致热交换器进行热接触。 这是一个故障安全程序，因为不需要单独的过程来接合电子服务器冷却回路。

公开(公告)号：US07746634B2

公开(公告)日：2010-06-29

申请号：US12221961

申请日：2008-08-07

申请人： James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Douglas E. Werner ,  Norman Chow ,  Adrian Correa ,  Brandon Leong ,  Sudhakar Gopalakrishnan ,  Richard Grant Brewer ,  Mark McMaster ,  Girish Upadhya

发明人： James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Douglas E. Werner ,  Norman Chow ,  Adrian Correa ,  Brandon Leong ,  Sudhakar Gopalakrishnan ,  Richard Grant Brewer ,  Mark McMaster ,  Girish Upadhya

IPC分类号： H05K7/20

CPC分类号： H05K7/20736

摘要： The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.

摘要翻译： 电子外壳的后面板包括一个或多个热交换器。 后面板可以是冷却门，其被配置为提供对位于电子外壳内的电缆和设备的访问。 可以通过在诸如标准门的铰链上使门打开来提供这种接近。 在具有多个热交换器的情况下，门可以被构造成段，每个热交换器一个段，并且每个段包括铰链，以便独立于其它段打开。 在一些实施例中，每个部分像标准门一样旋转打开。 在其他实施例中，每个段被配置成围绕水平轴向上或向下旋转。 在其他实施例中，每个部分被配置为与电子外壳断开连接，并且移出方向，在这种情况下，每个热交换器使用可以弯曲的方式或快速断开的柔性管连接。 在其他实施例中，整个后门或后门的每个部分可被构造成像抽屉一样滑动和关闭。

公开(公告)号：US20090044928A1

公开(公告)日：2009-02-19

申请号：US11977797

申请日：2007-10-25

申请人： Girish Upadhya ,  Richard Grant Brewer ,  Mark McMaster

发明人： Girish Upadhya ,  Richard Grant Brewer ,  Mark McMaster

IPC分类号： F28F7/00

CPC分类号： F28F19/006 ,  F28D15/00 ,  F28F3/12 ,  F28F2265/14 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20272 ,  H01L2924/00

摘要： An apparatus for preventing cracking of a liquid system includes an enclosure and one or more compressible objects immersed in the enclosure. According to the present invention, the enclosure is configured to cause a fluid to begin to freeze at a location in the enclosure, and for freezing to advance towards the one or more compressible objects.

摘要翻译： 用于防止液体系统破裂的装置包括一个外壳和一个或多个浸入外壳中的可压缩物体。 根据本发明，外壳被配置成使得流体在外壳中的位置处开始冻结，并且用于冻结以朝向一个或多个可压缩物体前进。

公开(公告)号：US07301773B2

公开(公告)日：2007-11-27

申请号：US10945807

申请日：2004-09-20

申请人： Richard Grant Brewer ,  Paul Tsao ,  Richard Herms ,  Mark Munch ,  Mark McMaster ,  Dave Corbin

发明人： Richard Grant Brewer ,  Paul Tsao ,  Richard Herms ,  Mark Munch ,  Mark McMaster ,  Dave Corbin

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H01L23/4006 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.

摘要翻译： 热收集装置使用包括万向接头的万向板安装在热源上。 万向节接头可以作为单点负载将作用于吸收装置的保持力作为单点负载。 保持力沿着与热源的热界面的面心法线向量共线的矢量施加。 这导致保持力在热界面区域上的平衡和集中应用。 万向节板使用弹簧装置直接安装到电路板上。 弹簧意味着调节通过万向节接头到集热装置的配合力的量。 由于万向节关节是旋转柔性的，构成热界面的两个配合面被强制并联配合。 以这种方式，产生高性能的TIM接口。