摘要:
The very thin, high carbon wire is 0.05 to 0.50 mm in diameter and comprises, in mass %, 0.90-1.20% of C, 0.05-1.2% of Si, 0.2-1.0% of Mn, and 0.0050% or less of N, with the balance being iron and impurities. In a differential scanning thermal analysis curve A of the steel wire, the steel wire has an exothermic peak X in the temperature range of 60° to 130° C., and a maximum height h of the exothermic peak X relative to a reference line Y joining the point of 60° C. and the point of 130° C. in the differential scanning thermal analysis curve is set at 5 μW/mg or more. The very thin, high carbon steel wire is free of delamination in high-speed stranding and superior in both strength and ductility.
摘要:
A spring steel which is superior in both shaving properties and green drawing properties, which are important in spring production. A process for making the spring steel into wire rods for good springs. A rolled spring steel superior in workability characterized in that it has the following mechanical properties. Tensile strength≦1200 MPa 30%≦reduction of area≦70% A process for producing a steel wire rod for springs from said spring steel, said process comprising drawing, shaving, and oil tempering, which are carried out sequentially, said drawing being optionally followed by prescribed treatment.
摘要:
A drying apparatus for processing a surface of a substrate wherein, when a nitrogen gas is fed to a nozzle, a jet of the nitrogen gas spouted through a jet hole is generated. The jet becomes film-shaped and is projected upwardly along an inner surface of a side wall of a processing vessel. Then, the jet is collected into an outside through a suction port formed in an upper portion of the processing vessel. The inner surface of the side wall of the processing vessel is covered with the jet. Therefore, an IPA vapor can be prevented from condensing uselessly on the inner surface. As a result, the IPA vapor is effectively utilized for condensation on a surface of the object to be processed which is mounted on a pan. Thus, defective dryness of the object can be prevented.
摘要:
Novel imidazoquinolone derivative represented by the formula (I); ##STR1## wherein R.sup.1 represents hydrogen, alkyl, cycloalkyl, alkenyl aralkyl, aralkenyl or substituted or unsubstituted aryl; X represents nitrogen or ##STR2## where R.sup.2 is hydrogen, hydroxyl, alkyl, cycloalkyl, alkenyl, aralkyl, aralkenyl, substituted or unsubstituted aryl, thiol, halogen, substituted or unsubstituted aromatic heterocyclic group, or --(CH.sub.2).sub.m CO.sub.2 R.sup.6 where R.sup.6 is hydrogen or lower alkyl and m is an integer of 0 to 3; Y represents oxygen or sulfur; R.sup.3 represents alkyl, cycloalkyl, alkoxyalkly, alkenyl, aralkyl, aralkenyl, --(CH.sub.2).sub.n -- Het where Het is substituted or unsubstituted aromatic heterocyclic group and n is an integer of 1 to 3 or --(CH.sub.2).sub.n CO.sub.2 R.sup.6a where n has the same meaning as defined above and R.sup.6a has the same meaning as defined as to R.sup.6 ; each of R.sup.4 and R.sup.5 independently represents hydrogen, lower alkyl, trifluoromethyl, cycloalkyl, halogen, hydroxyl, lower alkoxyl, lower alkylthio, nitro, amino, lower alkylamino, lower alkanoylamino, aroylamino, lower alkanoyl or aroyl; and a pharmaceutically acceptable salt thereof. The Compound (I) and a pharmaceutically acceptable salt thereof show bronchodilatory and antiallergic activities, and are useful for treating respiratory disorders such as bronchial asthma.
摘要:
The present invention provides a carbostyril compound represented by General Formula (1) or a salt thereof, wherein A is a direct bond, a lower alkylene group, or a lower alkylidene group; X is an oxygen atom or a sulfur atom; R4 and R5 each represent a hydrogen atom; the bond between the 3 and 4 positions of the carbostyril skeleton is a single bond or a double bond; R1 is a hydrogen atom, etc; R2 is a hydrogen atom, etc; and R3 is a hydrogen atom, etc. The carbostyril compound or salt thereof of the present invention induces the production of TFF, and thus is usable for the treatment and/or prevention of disorders such as alimentary tract diseases, oral diseases, upper respiratory tract diseases, respiratory tract diseases, eye diseases, cancers, and wounds.
摘要:
A heterocyclic compound or a salt thereof represented by the formula (1): where R2 represents a hydrogen atom or a lower alkyl group; A represents a lower alkylene group or lower alkenylene group; and R1 represents an aromatic group or a heterocyclic group. The compound of the present invention has a wide treatment spectrum for mental disorders including central nervous system disorders, no side effects and high safety.
摘要:
A clip includes: a head portion; and a leg portion including: a pair of first engagement arms that are provided on a pair of facing side surfaces of the leg portion; a pair of second engagement arms that are provided on the other pair of facing side surfaces of the leg portion, the pair of second engagement arms including abutment portions adapted to be individually brought into abutment with circumferential edges of respective diametrically extended hole portions of a trim and a panel; a pair of first stopper walls for holding a hole edge of the mounting hole of the panel in cooperation with the respective first engagement arms; and a pair of second stop walls for holding the circumferential edges of the diametrically extended hole portions of the panel in cooperation with the abutment portions of the respective second engagement arms.
摘要:
The connecting structure for connecting an automotive interior member and an automotive body panel is provided with a grommet to be inserted in and engaged with a mounting hole of the automotive body panel, a pin member to be detachably or integrally attached to a mounting seat formed on the interior member, a band connecting the grommet to the mounting seat. One end of the band is connected to the grommet. At the other end of the band, an engaging portion to be slidably engaged with an elongated hole of the mounting seat is provided. The engaging force between the mounting hole of the automotive body panel and the grommet is set to be greater than the engaging force between the grommet and the pin member.
摘要:
A clip has a head part adapted to be contacted with a peripheral edge of a fitting hole in a panel to be fitted, and a leg part adapted to be inserted into the fitting hole thereby to be engaged with the peripheral edge of the fitting hole. The leg part has a post suspended from a center of a lower face of the head part, at least three projections which are radially extended from the post in a diametrical direction and connected to the lower face of the head part at their upper ends, and engaging pieces which are extended from these projections in a circumferential direction to be respectively positioned between the projections. The engaging pieces are connected to the head part at their upper ends, and provided with slits between their circumferentially extended ends and the opposed projections.
摘要:
A solder removing apparatus comprises a stage and a head portion. A top face of the stage is a flat surface, and the stage can arbitrarily move in a direction parallel to the top face. On the stage are arranged a first member supplying portion on which one or more first members are located, a second member supplying portion on which one or more second members are located, and a heating portion for heating a member located thereon at an arbitrary temperature. The head comprises a first head and a second head. The first head and the second head can move along the same moving axis in a direction vertical to the top face of the stage independently from each other. The first head adsorbs the first member located on the first member supplying portion and locates the first member on the heating portion. The second head adsorbs the second member located on the second member supplying portion and locates the second member on the first member located on the heating portion. The solder adhering to the second member is melted when heated by the heating portion through the first member and adheres to the first member. As a result, the solder is removed from the second member.