公开(公告)号：US09387960B2

公开(公告)日：2016-07-12

申请号：US14131120

申请日：2012-07-03

申请人： Tsuyoshi Nagashima ,  Shuichi Inoue ,  Takaharu Oyama ,  Chiaki Matsutori ,  Kazumasa Ohnuki ,  Hiroyuki Shida ,  Hiroki Yamagishi

发明人： Tsuyoshi Nagashima ,  Shuichi Inoue ,  Takaharu Oyama ,  Chiaki Matsutori ,  Kazumasa Ohnuki ,  Hiroyuki Shida ,  Hiroki Yamagishi

IPC分类号： B65D43/02 ,  H01L21/673

CPC分类号： B65D43/02 ,  H01L21/67373

摘要： A substrate storing container includes: a container body for storing semiconductor wafers; a door that is fitted to the front of the container body; and a locking mechanism locking the door. The locking mechanism includes: a rotary driver that is supported by the door and operated from a cover plate side; and a locking bar that vertically slides as the rotary driver rotates to bring the distal end into, and out of, a locking hollow of the container body. The rotary driver is separated into first and second rotary drivers. The first and second rotary drivers are formed with first and second cam portions, respectively. The first and second cam portions are made to support the proximal end of the locking bar therebetween so that the locking bar can sway in the thickness direction of the door.

摘要翻译： 基板收容容器包括：容纳半导体晶片的容器本体; 安装在容器主体前部的门; 以及锁定机构。 锁定机构包括：旋转驱动器，其由门支撑并从盖板侧操作; 以及随着旋转驱动器旋转而垂直滑动以使远端进入和离开容器主体的锁定中空的锁定杆。 旋转驱动器分离成第一和第二旋转驱动器。 第一和第二旋转驱动器分别形成有第一和第二凸轮部分。 第一和第二凸轮部分被制成以支撑其间的锁定杆的近端，使得锁定杆可以在门的厚度方向上摆动。

公开(公告)号：US08881907B2

公开(公告)日：2014-11-11

申请号：US13641707

申请日：2011-04-08

申请人： Hiroki Yamagishi ,  Toshiyuki Kamada

发明人： Hiroki Yamagishi ,  Toshiyuki Kamada

IPC分类号： B65D85/30 ,  H01L21/673

CPC分类号： H01L21/67379 ,  B65D2585/86 ,  H01L21/67303 ,  H01L21/67386

摘要： A substrate storage container is provided with a container body for aligning and storing a plurality of sheets of semiconductor wafers, and a lid for detachably opening/closing an open front of the container body, in which a robotic flange for conveyance is attached on a substantially center portion of a ceiling of the container body, in which heavy gravity center position adjustment member is provided at a rear portion of the container body such as on a rear wall, a side wall rear portion so that inclination of the substrate container body toward the lid side is regulated with the gravity center position adjustment member.

摘要翻译： 基板储存容器设置有用于对准和存储多片半导体晶片的容器主体，以及用于可拆卸地打开/关闭容器主体的敞开前部的盖，其中用于输送的机器人凸缘基本上 容器主体的顶部的中心部分，其中重心位置调节构件设置在容器主体的后部，例如在后壁上，侧壁后部，使得基底容器主体朝向 盖侧由重心位置调节构件调节。

公开(公告)号：US08318275B2

公开(公告)日：2012-11-27

申请号：US12515237

申请日：2007-11-14

申请人： Hideo Kudo ,  Hiroki Yamagishi

发明人： Hideo Kudo ,  Hiroki Yamagishi

IPC分类号： B65D81/00

CPC分类号： B29C45/1657 ,  B29C2045/1659 ,  H01L21/67383 ,  Y10T428/13 ,  Y10T428/1352 ,  Y10T428/24612

摘要： A multicolor molding article is integrally formed of first and second molding materials in combination. At least part of the peripheral portion in the boundary between a first molding part of the first molding material and a second molding part of the second molding material is formed with a thin projected piece. The tapering inclined angle of the thin projected piece is specified to range from 5° to 40°.

摘要翻译： 多色成型制品组合地由第一和第二模塑材料一体地形成。 在第一成型材料的第一成型部分和第二成型材料的第二成型部分之间的边界中的周边部分的至少一部分形成有薄的突出片。 薄突片的锥形倾斜角度规定为5°至40°。

公开(公告)号：US20110064896A1

公开(公告)日：2011-03-17

申请号：US12515237

申请日：2007-11-14

申请人： Hideo Kudo ,  Hiroki Yamagishi

发明人： Hideo Kudo ,  Hiroki Yamagishi

IPC分类号： B32B1/00 ,  B32B3/10 ,  B29C39/12

CPC分类号： B29C45/1657 ,  B29C2045/1659 ,  H01L21/67383 ,  Y10T428/13 ,  Y10T428/1352 ,  Y10T428/24612

摘要： A multicolor molding article is integrally formed of first and second molding materials in combination. At least part of the peripheral portion in the boundary between a first molding part of the first molding material and a second molding part of the second molding material is formed with a thin projected piece. The tapering inclined angle of the thin projected piece is specified to range from 5° to 40°.

摘要翻译： 多色成型制品组合地由第一和第二模塑材料一体地形成。 在第一成型材料的第一成型部分和第二成型材料的第二成型部分之间的边界中的周边部分的至少一部分形成有薄的突出片。 薄突片的锥形倾斜角度规定为5°至40°。

公开(公告)号：US06638091B2

公开(公告)日：2003-10-28

申请号：US10060237

申请日：2002-02-01

申请人： Hiroki Yamagishi

发明人： Hiroki Yamagishi

IPC分类号： H01R1362

CPC分类号： H05K7/1007

摘要： A socket for an electrical part comprises an open/close member mounted, to be rotatable about a rotational shaft, to a socket body in which an electrical part is accommodated, an urging member for urging the open/close member in a closed direction thereof, and an operation member vertically movable with respect to the socket body. The open/close member is opened against the urging force of the urging member by depressing the operation member the urging member has one end portion engaged with a portion of the open/close member apart from a rotation center thereof and another end portion engaged with the operation member.

摘要翻译： 一种用于电气部件的插座包括可绕旋转轴旋转的开/关构件，其安装在容纳电气部件的插座主体中，用于沿闭合方向推压打开/关闭构件的推动构件， 以及可相对于所述插座主体垂直移动的操作构件。 打开/关闭构件通过按压操作构件而抵抗推动构件的推动力打开，该推动构件具有与打开/关闭构件的一部分接合的一个端部与其旋转中心分离，另一个端部与 操作员

公开(公告)号：US6083013A

公开(公告)日：2000-07-04

申请号：US890314

申请日：1997-07-09

申请人： Hiroki Yamagishi

发明人： Hiroki Yamagishi

IPC分类号： H01R13/24 ,  H01R33/76 ,  H05K7/10 ,  H01R9/09

CPC分类号： H05K7/1069

摘要： An IC socket includes a socket body (1) for supporting lower end sections of bow-shaped contact pins (3), a floating member (2) provided with holes (2a) for guiding upper end sections of the contact pins (3), and a cover member (4) for pressing the floating member. Borders of the guide holes (2a) act as stoppers for the upper end sections of the contact pins (3) for regulating height of projection thereof from the floating member (2) and contact positions thereof in reference to solder ball terminals to prevent damage to the solder ball terminals of the IC package even if the solder balls are softened under a heat-resistance test or the like. In one embodiment, the IC socket can effectively perform wiping of the solder balls when it is used at an ordinary temperature. The cover member (4) may be used and formed with a surface (4b) for first engaging the IC package and another surface (4a) for subsequently engaging the top surface of the floating member (2). The lower end sections of the contact pins (3) may be fixed in the socket body (1) or may be movably supported

摘要翻译： IC插座包括用于支撑弓形接触针（3）的下端部分的插座本体（1），设置有用于引导触针（3）的上端部分的孔（2a）的浮动部件（2） 以及用于按压浮动部件的盖部件（4）。 引导孔（2a）的边界用作接触销（3）的上端部分的止动件，用于调节与浮动部件（2）的突出高度及其与焊球端子相关的接触位置，以防止损坏 即使在耐热性试验等下焊锡球软化，IC封装的焊球端子也是如此。 在一个实施例中，当在常温下使用时，IC插座可以有效地执行焊球的擦拭。 盖构件（4）可以使用并形成有用于首先接合IC封装的表面（4b）和用于随后接合浮动构件（2）的顶表面的另一表面（4a）。 接触销（3）的下端部分可以固定在插座主体（1）中，或者可移动地被支撑